专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 外观设计

USD964370S1 SSD adapter converter 有权
公开(公告)号：USD964370S1
公开(公告)日：2022-09-20
申请号：US29757925
申请日：2020-11-10
申请人： KINGSTON TECHNOLOGY CORPORATION
设计人： Hieu Khong , Kevin Jun Sun

2. 发明申请

US20220014842A1 SPEAKER WITH DUAL RESONANCE CHAMBERS 有权
公开(公告)号：US20220014842A1
公开(公告)日：2022-01-13
申请号：US17148308
申请日：2021-01-13
申请人： Kingston Technology Corporation
发明人： Kai Lin Shen , Sheng Hung Wang , Penhao Ma , Wei-Min Liang
IPC分类号： H04R1/28 , H04R9/06
摘要： The inventive subject matter is directed to headset audio systems having resonance chambers designed to improve a system's frequency response in certain ranges. Systems of the inventive subject matter include a casing that both holds a speaker driver and creates two resonance chambers. Each resonance chamber vents to ambient air outside the casing, where the length and cross-sectional areas of each vent can impact the system's frequency response. Each resonance chamber is tuned to a resonant frequency to improve the system's frequency response across a range of frequencies on either side of each chamber's resonant frequency.

3. 发明授权

US08667191B2 Managing and indentifying multiple memory storage devices 有权
标题翻译：管理和识别多个内存存储设备
公开(公告)号：US08667191B2
公开(公告)日：2014-03-04
申请号：US12688792
申请日：2010-01-15
申请人： Choon-Tak Tang , Chin-Tang Yen , Ngoc Le , David Sun
发明人： Choon-Tak Tang , Chin-Tang Yen , Ngoc Le , David Sun
IPC分类号： G06F13/00 , G06F13/36 , G06F13/20
CPC分类号： G06F13/387 , G06F3/0679
摘要： A management hub is disclosed. The management hub comprises an interface; a master hub controller coupled to the interface; a plurality of ports coupled to the master hub controller; a microcontroller coupled to the master hub controller; and hub setting switch and a slave hub controller coupled to the microcontroller and the plurality of ports. The management hub also includes a memory device coupled to the microcontroller, the memory device including a hidden drive information partition and a hidden drive organizer partition for managing and identifying information in various drives coupled to the plurality of ports, wherein when the management hub is first connected to a host system the drives are displayed in an inactive state.
摘要翻译：公布了一个管理中心。管理中心包括一个接口; 耦合到所述接口的主集线器控制器; 耦合到主集线器控制器的多个端口; 耦合到主集线器控制器的微控制器; 和集线器设置开关以及耦合到微控制器和多个端口的从属集线器控制器。管理集线器还包括耦合到微控制器的存储器设备，该存储器设备包括隐藏的驱动器信息分区和用于管理和识别耦合到多个端口的各种驱动器中的信息的隐藏的驱动器组织器分区，其中当管理集线器第一时连接到主机系统，驱动器显示为非活动状态。

4. 发明授权

US08553090B2 Portable image capture and camera device 有权
标题翻译：便携式图像捕捉和相机设备
公开(公告)号：US08553090B2
公开(公告)日：2013-10-08
申请号：US11517779
申请日：2006-09-08
申请人： George Shiu , Wei Koh
发明人： George Shiu , Wei Koh
IPC分类号： H04N5/225 , H04N9/04 , H04N5/222
CPC分类号： H04N5/2251 , H04N1/00535 , H04N1/195 , H04N1/19594 , H04N2201/0081 , H04N2201/0096 , H04N2201/0436
摘要： A portable image capture and camera device is provided including a device body, and an upper panel displaceably engaged to the body, and having an image capture module disposed thereon. A lower panel is also displaceably engaged to the body, for receiving and supporting a subject when the lower panel is deployed to an open position. The upper panel is translatable to deploy from a stowed position to a first deployed position to image a subject disposed on the lower panel (card reader mode), and to a second deployed position to image objects remote from the device (camera mode).
摘要翻译：提供了便携式图像捕获和照相机装置，其包括装置主体和可移动地接合到主体的上面板，并且具有设置在其上的图像捕获模块。下面板也可移动地接合到主体，用于当下面板部署到打开位置时接收和支撑被摄体。上部面板可以从收起位置部署到第一展开位置，以使设置在下部面板（读卡器模式）上的被摄体成像，并且到第二展开位置以对远离装置（相机模式）的物体成像。

5. 发明授权

US08527781B2 Secure and scalable solid state disk system 有权
公开(公告)号：US08527781B2
公开(公告)日：2013-09-03
申请号：US11746556
申请日：2007-05-09
申请人： Ben Wei Chen , Yungteh Chien , Choon Tak Tang
发明人： Ben Wei Chen , Yungteh Chien , Choon Tak Tang
IPC分类号： G06F21/00
CPC分类号： G11C16/349 , G06F21/79
摘要： A solid state disk system is disclosed. The system comprises a user token and at least one level secure virtual storage controller, coupled to the host system. The system includes a plurality of virtual storage devices coupled to at least one secure virtual storage controller. A system and method in accordance with the present invention could be utilized in flash based storage, disk storage systems, portable storage devices, corporate storage systems, PCs, servers, wireless storage, and multimedia storage systems.

6. 发明授权

US08445297B2 Method of fabricating a chip 有权
公开(公告)号：US08445297B2
公开(公告)日：2013-05-21
申请号：US12568633
申请日：2009-09-28
申请人： Wei Koh
发明人： Wei Koh
IPC分类号： H01L21/66
CPC分类号： G11C29/00 , H01L22/14 , H01L22/20 , H01L2924/014
摘要： A method of fabricating a chip may include the step of providing a first electrical part. The method may also include the step of forming a shell with the first electrical part embedded in a first side portion of the shell and a cavity in a second side portion of the shell. The method may include the step of testing the embedded first electrical part to determine whether the first electrical part is defective or functional. The method may also include the steps of providing a second electrical part, inserting the second electrical part within the cavity of the shell second side portion, establishing electrical communication between the first and second electrical parts if a test result of the first electrical part indicates that the first electrical part is functional, and finishing the chip. Also, the method may include the step of rejecting the first electrical part if the test result of the first electrical part indicates that the first electrical part is defective.

7. 发明授权

US08282012B2 Flash memory card expander 有权
标题翻译：闪存卡扩展器
公开(公告)号：US08282012B2
公开(公告)日：2012-10-09
申请号：US12945722
申请日：2010-11-12
申请人： Ben Wei Chen , David Sun , George Shiu
发明人： Ben Wei Chen , David Sun , George Shiu
IPC分类号： G06K19/06
CPC分类号： H05K5/0282 , H01R31/06
摘要： Method and system for expanding the memory capacity of devices that use flash memory cards. In one aspect, a memory card expander assembly includes an adaptor shaped to be connected to a memory card slot of a host device, and a receptacle assembly in communication with the adaptor and operative to be attached to the host device. The receptacle assembly includes an expanded memory card slot operative to connect to a memory card such that the host device can communicate with the connected memory card when the adaptor is connected to the memory card slot.
摘要翻译：扩展使用闪存卡的设备的内存容量的方法和系统。在一个方面，一种存储卡扩展器组件包括被成形为连接到主机设备的存储卡插槽的适配器以及与适配器通信并且可操作地连接到主机设备的插座组件。插座组件包括可操作地连接到存储卡的扩展的存储卡插槽，使得当适配器连接到存储卡插槽时，主机设备可与连接的存储卡通信。

8. 发明授权

US08097957B2 Flash memory card 有权
标题翻译：闪存卡
公开(公告)号：US08097957B2
公开(公告)日：2012-01-17
申请号：US12702207
申请日：2010-02-08
申请人： Ben Wei Chen , David Hong-Dien Chen , Jason Jajen Chen
发明人： Ben Wei Chen , David Hong-Dien Chen , Jason Jajen Chen
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L25/18 , H01L23/5387 , H01L23/5388 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/05553 , H01L2224/32145 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48235 , H01L2224/49175 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06562 , H01L2225/06572 , H01L2225/06575 , H01L2225/06579 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/10161 , H01L2924/15173 , H01L2924/15192 , H01L2924/19107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A Flash memory card is disclosed comprising a substrate, a Flash memory die on top of the substrate, a controller die on top of the Flash memory die, and an interposer coupled to with the controller die and on top of the Flash memory die wherein the interposer results in substantial reduced wire bonding to the substrate. The interposer can surround or be placed side by side with the controller die. A system and method in accordance with the present invention achieves the following objectives: (1) takes advantage of as large of a Flash memory die as possible, to increase the density of the Flash card by reducing the number of wire bond pads on the substrate and enabling insertion of the largest die possible that can fit inside a given card interior boundary; (2) more efficiently stacks Flash memory dies to increase density of the Flash card; and (3) has a substantially less number of bonding wires to the substrate as possible, to improve production yield.
摘要翻译：公开了一种闪存卡，其包括衬底，在衬底顶部的闪存存储器管芯，在闪存存储器管芯的顶部上的控制器管芯，以及与控制器管芯连接并在闪存管芯的顶部上的插入器，其中，插入器导致大大减少了与基板的引线接合。插入器可以围绕或与控制器管芯并排放置。根据本发明的系统和方法实现了以下目的：（1）尽可能地利用尽可能大的闪存存储器管芯，通过减少衬底上的引线接合焊盘的数量来增加闪存卡的密度并且能够插入可以装配在给定卡内部边界内的最大的模具; （2）更有效地堆叠闪存芯片，增加闪存卡的密度; 和（3）尽可能少的与基板的接合线数量，以提高产量。

9. 发明申请

US20110058327A1 FLASH MEMORY CARD EXPANDER 有权
标题翻译：闪存存储卡扩展器
公开(公告)号：US20110058327A1
公开(公告)日：2011-03-10
申请号：US12945722
申请日：2010-11-12
申请人： Ben Wei CHEN , David SUN , George K. L. SHIU
发明人： Ben Wei CHEN , David SUN , George K. L. SHIU
IPC分类号： G06F1/16
CPC分类号： H05K5/0282 , H01R31/06
摘要： Method and system for expanding the memory capacity of devices that use flash memory cards. In one aspect, a memory card expander assembly includes an adaptor shaped to be connected to a memory card slot of a host device, and a receptacle assembly in communication with the adaptor and operative to be attached to the host device. The receptacle assembly includes an expanded memory card slot operative to connect to a memory card such that the host device can communicate with the connected memory card when the adaptor is connected to the memory card slot.
摘要翻译：扩展使用闪存卡的设备的内存容量的方法和系统。在一个方面，一种存储卡扩展器组件包括被成形为连接到主机设备的存储卡插槽的适配器以及与适配器通信并且可操作地连接到主机设备的插座组件。插座组件包括扩展的存储卡插槽，其可操作以连接到存储卡，使得当适配器连接到存储卡插槽时，主机设备可与连接的存储卡通信。

10. 发明授权

US07781299B2 Leadframe semiconductor package stand and method for making the same 有权
标题翻译：引线框半导体封装架及其制造方法
公开(公告)号：US07781299B2
公开(公告)日：2010-08-24
申请号：US11094557
申请日：2005-03-31
申请人： Wei H. Koh
发明人： Wei H. Koh
IPC分类号： H01L23/495 , H01L21/56 , H01L21/60
CPC分类号： H01L23/49861 , H01L23/4951 , H01L23/49558 , H01L2924/0002 , Y10T29/4913 , Y10T29/49147 , H01L2924/00
摘要： A method is disclosed for making a leadframe package stand having application in semiconductor packaging and microelectronic assembly in which an IC device (e.g., a bare chip IC, a wafer level package, or a chipscale package) is received for electrical connection to a PWB or for vertical package over package stacking. Electrically conductive leadframe traces are arranged in an area array circuit pattern between outer leads at the periphery of the mold body of a leadframe for connection to the PWB to inner leads for connection to the IC device. The inner lead tips terminate at each side of the IC device in groups of parallel aligned rows and columns to facilitate connection to the IC device without using intermediate bonding wires. Prior to molding, the inner leads of the conductive traces are secured by sacrificial tie-bars or adhesive tape to prevent movement of the inner leads and possible short circuits during molding. A cavity is formed in the mold body during molding so as to lie above the inner leads. After molding, the sacrificial tie-bars are separated from the inner leads, and the IC device is located in the cavity to be assembled to the leadframe to complete a leadframe package.
摘要翻译：公开了一种用于制造半导体封装和微电子组件的引线框架封装架的方法，其中IC器件（例如，裸芯片IC，晶片级封装或芯片尺寸封装）被接收用于电连接到PWB或用于垂直封装堆叠堆叠。导电引线框架线路以引线框架的模体的周边的外引线之间的区域阵列电路图形布置，用于连接到PWB到用于连接到IC器件的内引线。内部引线末端在IC器件的每一侧以平行排列的行和列组终止，以便于不使用中间接合线而连接到IC器件。在模制之前，导电迹线的内部引线通过牺牲连接条或胶带固定，以防止内部引线的移动和模制期间可能的短路。在模制过程中在模具体中形成空腔以便位于内部引线之上。在模制之后，牺牲连接杆与内引线分离，并且IC器件位于腔中以组装到引线框架以完成引线框封装。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式