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1. 发明授权

US11420219B2 Printing apparatus for printed electronics 有权
公开(公告)号：US11420219B2
公开(公告)日：2022-08-23
申请号：US16473536
申请日：2018-01-12
申请人： PROTEC CO., LTD.
发明人： Eui Keun Choi , Dae Yong Lee , Da Hai Zhang , Seung Hwan Choi , Seung Min Hong
IPC分类号： B05B5/03 , B05B12/00 , H05K3/12 , B41J2/045
摘要： A printing apparatus for printed electronics according to the present invention may include: ejection head units which each have at least one nozzle for ejecting ink droplets to perform drop-on-demand or continuous printing; a jetting observation unit which is provided at one side of the nozzle and configured to observe the ink droplet ejected from the nozzle; a lighting unit which is provided at the other side of the nozzle and configured to provide light to the jetting observation unit; an alignment observation unit which is configured to observe an aligned state between the nozzle and a substrate; and a fluid supply unit which is configured to supply the ink to the nozzle, in which the ejection head units include a single-nozzle head unit, and a multi-nozzle head unit provided separately from the single-nozzle head unit.

2. 发明申请

US20220193706A1 Apparatus for Ejecting Viscous Liquid Aerosol 有权
公开(公告)号：US20220193706A1
公开(公告)日：2022-06-23
申请号：US17535710
申请日：2021-11-26
申请人： PROTEC CO., LTD.
发明人： Seung Min HONG , Hansung LEE , EUI KEUN CHOI , HEEJAE JIN
IPC分类号： B05B7/26 , B05B7/04
摘要： Provided is an apparatus for ejecting viscous liquid aerosol, and more particularly, an apparatus for ejecting viscous liquid aerosol capable of dispensing a viscous liquid to a work with a fine line width by ejecting the viscous liquid in the form of aerosols. The apparatus for ejecting viscous liquid aerosol may be configured compactly by miniaturizing a device capable of aerosolizing and ejecting viscous liquid in the form of aerosols. In addition, since the apparatus for ejecting viscous liquid aerosol has a structure that is easy to miniaturize, it is easy to uniformly maintain the characteristics of aerosol.

3. 发明申请

US20220032332A1 DISPENSING APPARATUS HAVING NOZZLE CLEANING FUNCTION 有权
公开(公告)号：US20220032332A1
公开(公告)日：2022-02-03
申请号：US17388037
申请日：2021-07-29
申请人： PROTEC CO., LTD.
发明人： Seung Min HONG , DAE YONG LEE
IPC分类号： B05B15/55 , B05D1/18 , B05C11/10
摘要： Provided is a dispensing apparatus capable of cleaning a nozzle, and more particularly, to a dispensing apparatus capable of cleaning a nozzle having the function of cleaning a nozzle of an apparatus for dispensing a viscous solution with a cleaning solution. The dispensing apparatus capable of cleaning a nozzle can effectively supply and manage a cleaning solution while effectively cleaning the viscous solution that are likely to be attached to the nozzle.

4. 发明申请

US20190001426A1 METHOD FOR BONDING FLEXIBLE PART INCLUDING INCLINED LEADS 审中-公开
公开(公告)号：US20190001426A1
公开(公告)日：2019-01-03
申请号：US15896025
申请日：2018-02-13
申请人： PROTEC CO., LTD.
发明人： MOO SUP SHIM , SEONG YONG JI , HYOUNG YEON JU , CHIHO CHO
IPC分类号： B23K3/06 , B23K3/08 , B23K1/00 , H05K3/34 , H01L23/00
CPC分类号： B23K3/0623 , B23K1/0016 , B23K3/087 , B23K2101/36 , H01L24/741 , H05K3/3426 , H05K2201/10757 , H05K2203/041
摘要： A method of bonding a flexible part including inclined leads is provided, and more particularly, a method of bonding a flexible part including inclined leads, in which parts are aligned to bond the parts is provided. According to the method of bonding the flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.

5. 发明申请

US20180366435A1 APPARATUS FOR LASER BONDING OF FLIP CHIP AND METHOD FOR LASER BONDING OF FLIP CHIP 审中-公开
公开(公告)号：US20180366435A1
公开(公告)日：2018-12-20
申请号：US16011649
申请日：2018-06-19
申请人： PROTEC CO., LTD.
发明人： GEUNSIK AHN
IPC分类号： H01L23/00 , B23K1/005
摘要： Provided are a flip chip laser bonding apparatus and a flip chip laser bonding method, and more particularly, to an apparatus and method for flip chip laser bonding, in which a semiconductor chip in a flip chip form is bonded to a substrate by using a laser beam. According to the flip chip laser bonding apparatus and the flip chip laser bonding method, even a semiconductor chip that is bent or is likely to bend may also be bonded to a substrate without contact failure of solder bumps by bonding the semiconductor chip to the substrate by laser bonding while pressurizing the semiconductor chip.

6. 发明申请

US20170120280A1 FLOWRATE MEASURING TYPE VISCOUS LIQUID DISPENSER AND DISPENSING METHOD 审中-公开
公开(公告)号：US20170120280A1
公开(公告)日：2017-05-04
申请号：US15336817
申请日：2016-10-28
申请人： PROTEC CO., LTD.
发明人： Seung Min HONG
IPC分类号： B05B12/08 , G01F1/684 , G01F11/00 , B05B9/00 , B05B9/04
CPC分类号： B05B12/085 , B05B9/002 , B05B9/0403 , B05B9/0416 , B05B9/042 , B05B12/10 , B05B12/12 , G01F1/684 , G01F11/006 , G01F11/38
摘要： Provided are a flowrate measuring type viscous liquid dispenser and dispensing method, in which a viscous liquid is dispensed by measuring a flowrate of the viscous liquid in real time so as to accurately control the flowrate of the viscous liquid.

7. 发明授权

US09613913B2 Method of forming electromagnetic interference shielding layer of ball grid array semiconductor package and base tape for the method 有权
公开(公告)号：US09613913B2
公开(公告)日：2017-04-04
申请号：US15155086
申请日：2016-05-16
申请人： PROTEC CO., LTD.
发明人： Sung Hwan Choi , Tae Sup Han
IPC分类号： H01L21/00 , H01L23/552 , H01L21/285 , H01L21/3205 , H01L21/683 , H01L23/00
CPC分类号： H01L23/552 , H01L21/2855 , H01L21/32051 , H01L21/6836 , H01L24/14 , H01L2221/68381 , H01L2224/13014 , H01L2224/13016 , H01L2924/15311 , H01L2924/3025
摘要： Provided are a method of forming an electromagnetic interference (EMI) shielding layer of a ball grid array (BGA) semiconductor package, and a base tape used in the method, and more particularly, a method of forming a shielding layer for blocking EMI, on an upper surface and lateral surfaces of a BGA semiconductor package having a lower surface, on which a plurality of solder balls are formed, and a base tape used in the method.According to the method of forming an EMI shielding layer of a BGA semiconductor package, the EMI shielding layer may be formed on the BGA semiconductor package quickly, easily, and effectively by using the base tape, thereby not only improving process productivity but also remarkably reducing the manufacturing costs.

8. 发明授权

US09023665B2 Method and apparatus for manufacturing LED device 有权
标题翻译： LED装置的制造方法和装置
公开(公告)号：US09023665B2
公开(公告)日：2015-05-05
申请号：US13352458
申请日：2012-01-18
申请人： Seung Min Hong
发明人： Seung Min Hong
IPC分类号： H01L21/00 , F04B13/00 , F04B49/06 , H01L23/00
CPC分类号： F04B13/00 , F04B49/06 , H01L24/48 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/10161 , H01L2924/12041 , H01L2933/0041 , H01L2224/45099 , H01L2924/00
摘要： An apparatus and method of manufacturing a light emitting diode (LED) device, and more particularly, an apparatus and method of manufacturing an LED device by dispensing a fluorescent solution prepared by mixing a fluorescent material with a liquid synthetic resin, onto an LED chip. An apparatus and method of manufacturing an LED device, whereby an appropriate amount of fluorescent solution simultaneously in consideration of several factors, such as characteristics of an LED chip and viscosity of the fluorescent solution may be dispensed onto the LED chip, is provided. An apparatus and method of manufacturing an LED device, whereby an appropriate amount of fluorescent solution may be calculated actively in consideration of viscosity of the fluorescent solution, a change in characteristics of an LED chip, or the like, and the appropriate amount of fluorescent solution may be dispensed onto the LED chip, is provided.
摘要翻译：更具体地，涉及一种通过将通过将荧光材料与液体合成树脂混合制备的荧光溶液分配到LED芯片上来制造LED器件的装置和方法。提供了一种制造LED器件的装置和方法，由此可以将考虑到诸如LED芯片的特性和荧光溶液的粘度的几个因素同时考虑适量的荧光溶液分配到LED芯片上。考虑到荧光溶液的粘度，LED芯片的特性的变化等以及适当量的荧光溶液，可以积极地计算出适当量的荧光溶液的装置和方法可以分配到LED芯片上。

9. 发明申请

US20120065382A1 METHOD AND DEVICE FOR EXTRACTING POLLEN PROTEINS 有权
标题翻译：提取蛋白质的方法和装置
公开(公告)号：US20120065382A1
公开(公告)日：2012-03-15
申请号：US13320738
申请日：2010-05-10
申请人： Tsuneo Yamaguchi , Akira Saito , Akio Kato
发明人： Tsuneo Yamaguchi , Akira Saito , Akio Kato
IPC分类号： C07K1/36 , B01D11/02
CPC分类号： A61K36/15 , A61K39/00 , C07K14/415
摘要： The present invention is one that, in a pollen protein extracting method, enables mass production, and while improving production efficiency, achieves a reduction in workload such as a reduction in man-hours, reductions in equipment cost and running cost, and an improvement of a work environment. Specifically, a pollen protein extracting method for extracting water-soluble protein from pollen is characterized by including: mixing the pollen and PBS; adding an aggregating agent including a natural inorganic component to a resultant mixed solution and performing stirring; and after formation of a pollen aggregate, performing filter filtration to perform solid-liquid separation.
摘要翻译：本发明是在花粉蛋白质提取方法中，能够进行批量生产，在提高生产效率的同时，能够减少工时，减少工时，降低设备成本和运行成本，并且提高一个工作环境。具体来说，从花粉中提取水溶性蛋白质的花粉蛋白质提取方法的特征在于：将花粉与PBS混合; 向得到的混合溶液中加入包含天然无机成分的凝集剂，进行搅拌; 在形成花粉骨料后进行过滤，进行固液分离。

10. 发明申请

US20100327468A1 VOLUME-BASED DISPENSING CONTROL METHOD 有权
标题翻译：基于体积分配控制方法
公开(公告)号：US20100327468A1
公开(公告)日：2010-12-30
申请号：US12650685
申请日：2009-12-31
申请人： Ki Man YANG
发明人： Ki Man YANG
IPC分类号： B29D11/00
CPC分类号： B29D11/00634 , B29D11/00807 , H01L2224/48091 , H01L2924/00014
摘要： A volume-based dispensing control method is capable of enabling a pump to dispense a resin with greatly increased accuracy. The method includes: a preliminary dispensing step in which a resin is dispensed on one or more workpieces with a pump; a volume measuring step in which the workpieces passed through the preliminary dispensing step is scanned by an optical scanner to measure a dispensed resin volume; a corrected-volume calculating step in which a corrected volume of the resin to be additionally dispensed is calculated by using a difference between the dispensed resin volume measured in the volume measuring step and a predetermined dispensing volume; and a corrective dispensing step in which the resin is dispensed on the workpieces in light of the corrected volume calculated in the corrected-volume calculating step.
摘要翻译：基于体积的分配控制方法能够使泵以大大提高的精度来分配树脂。该方法包括：初步分配步骤，其中用泵将树脂分配在一个或多个工件上; 体积测量步骤，其中通过预分配步骤的工件通过光学扫描仪扫描以测量分配的树脂体积; 校正体积计算步骤，其中通过使用在体积测量步骤中测量的分配树脂体积与预定分配体积之间的差来计算要额外分配的树脂的校正体积; 以及校正分注步骤，其中根据在校正量计算步骤中计算出的校正容积将树脂分配在工件上。

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