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    • 4. 发明授权
    • Apparatus and method for improving drive-strength and leakage of deep submicron MOS transistors
    • 提高深亚微米MOS晶体管的驱动强度和泄漏的装置和方法
    • US07224205B2
    • 2007-05-29
    • US11029542
    • 2005-01-04
    • Ashok Kumar Kapoor
    • Ashok Kumar Kapoor
    • H03K3/01
    • H03K19/0005H01L27/0629H01L2924/0002H03K19/0016H03K19/00361H01L2924/00
    • An apparatus and method for manufacturing metal-oxide semiconductor (MOS) transistors that are operable at voltages below 1.5V, which MOS transistors are area efficient, and where the drive strength and leakage current of the MOS transistors is improved. The invention uses a dynamic threshold voltage control scheme that does not require a change to the existing MOS technology process. The invention provides a technique that controls the threshold voltage of the transistor. In the OFF state, the threshold voltage of the transistor is set high, keeping the transistor leakage to a small value. In the ON state, the threshold voltage is set to a low value, resulting in increased drive strength. The invention is particularly useful in MOS technology for both bulk and silicon on insulator (SOI) CMOS.
    • 一种在低于1.5V的电压下工作的金属氧化物半导体(MOS)晶体管的装置和方法,其中MOS晶体管具有区域效率,并且其中MOS晶体管的驱动强度和漏电流得到改善。 本发明使用不需要改变现有MOS技术过程的动态阈值电压控制方案。 本发明提供一种控制晶体管的阈值电压的技术。 在OFF状态下,将晶体管的阈值电压设定为高,将晶体管的漏电保持在较小的值。 在ON状态下,阈值电压设定为低值,导致驱动强度增加。 本发明在用于体积和绝缘体上硅(SOI)CMOS的MOS技术中特别有用。
    • 7. 发明授权
    • Apparatus and method for improving drive-strength and leakage of deep submicron MOS transistors
    • 提高深亚微米MOS晶体管的驱动强度和泄漏的装置和方法
    • US07586155B2
    • 2009-09-08
    • US11737559
    • 2007-04-19
    • Ashok Kumar Kapoor
    • Ashok Kumar Kapoor
    • H01L23/62H01L27/088H03K17/16H03K3/01
    • H03K19/0005H01L27/0629H01L2924/0002H03K19/0016H03K19/00361H01L2924/00
    • An apparatus and method for manufacturing metal-oxide semiconductor (MOS) transistors that are operable at voltages below 1.5V, which MOS transistors are area efficient, and where the drive strength and leakage current of the MOS transistors is improved. The invention uses a dynamic threshold voltage control scheme that does not require a change to the existing MOS technology process. The invention provides a technique that controls the threshold voltage of the transistor. In the OFF state, the threshold voltage of the transistor is set high, keeping the transistor leakage to a small value. In the ON state, the threshold voltage is set to a low value, resulting in increased drive strength. The invention is particularly useful in MOS technology for both bulk and silicon on insulator (SOI) CMOS.
    • 一种用于制造在低于1.5V的电压下操作的金属氧化物半导体(MOS)晶体管的装置和方法,其中MOS晶体管具有区域效率,并且其中提高了MOS晶体管的驱动强度和漏电流。 本发明使用不需要改变现有MOS技术过程的动态阈值电压控制方案。 本发明提供一种控制晶体管的阈值电压的技术。 在OFF状态下,将晶体管的阈值电压设定为高,将晶体管的漏电保持在较小的值。 在ON状态下,阈值电压设定为低值,导致驱动强度增加。 本发明在用于体积和绝缘体上硅(SOI)CMOS的MOS技术中特别有用。
    • 8. 发明授权
    • Apparatus for using a well current source to effect a dynamic threshold voltage of a MOS transistor
    • 用于使用井电流源来实现MOS晶体管的动态阈值电压的装置
    • US07863689B2
    • 2011-01-04
    • US12348809
    • 2009-01-05
    • Robert Strain
    • Robert Strain
    • H01L29/76H01L29/94H01L31/062H01L31/113H01L31/119
    • H01L27/0629H01L27/0727H01L27/1203H01L29/47H01L29/78H01L29/872
    • Deep submicron wells of MOS transistors, implemented over an ungrounded well, exhibit two modes of operation: a current sink mode and a current source mode. While operation as a current sink is well understood and successfully controlled, it is also necessary to control the current provided in the current source mode of the well. A Schottky diode is connected between the well and the gate, the Schottky diode having a smaller barrier height than that of the PN junction of the well-to-source. For an NMOS transistor, current flows through the PN junction when the gate is high. When the gate is low, current flows through the Schottky diode. This difference of current flow results in a difference in transistor threshold, thereby achieving a dynamic threshold voltage using the current from the well when operating at the current source mode.
    • 在非接地井上实现的MOS晶体管的深亚微米阱具有两种工作模式:电流吸收模式和电流源模式。 当作为电流吸收器的操作被很好地理解并成功地控制时,还需要控制在井的当前源模式中提供的电流。 肖特基二极管连接在阱和栅极之间,肖特基二极管的栅极高度高于源阱的PN结的势垒高度。 对于NMOS晶体管,当栅极为高电平时,电流流过PN结。 当栅极低时,电流流过肖特基二极管。 电流的这种差异导致晶体管阈值的差异,从而当在当前源模式下工作时,使用来自阱的电流实现动态阈值电压。
    • 9. 发明授权
    • Method of manufacture of an apparatus for increasing stability of MOS memory cells
    • 一种用于增加MOS存储器单元的稳定性的装置的制造方法
    • US07691702B2
    • 2010-04-06
    • US12109327
    • 2008-04-24
    • Ashok Kumar Kapoor
    • Ashok Kumar Kapoor
    • H01L21/8239
    • G11C11/4023G11C11/404G11C11/412G11C16/0416H01L27/1104
    • In deep submicron memory arrays there is noted a relatively steady on current value and, therefore, threshold values of the transistors comprising the memory cell are reduced. This, in turn, results in an increase in the leakage current of the memory cell. With the use of an ever increasing number of memory cells leakage current must be controlled. A method of manufacture of a dynamic threshold voltage control scheme implemented with no more than minor changes to the existing MOS process technology is disclosed. The disclosed invention controls the threshold voltage of MOS transistors. Methods for enhancing the impact of the dynamic threshold control technology using this apparatus are also included. The invention is particularly useful for SRAM, DRAM, and NVM devices.
    • 在深亚微米存储器阵列中,注意到电流值相对稳定,因此减小了包括存储器单元的晶体管的阈值。 这又导致存储单元的漏电流的增加。 随着使用越来越多的存储单元,必须控制漏电流。 公开了一种制造动态阈值电压控制方案,该方案仅对现有的MOS工艺技术进行了微小的改变。 所公开的发明控制MOS晶体管的阈值电压。 还包括用于增强使用该装置的动态阈值控制技术的影响的方法。 本发明对SRAM,DRAM和NVM器件特别有用。