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1. 发明授权

US07728612B2 Probe card assembly and method of forming same 有权
标题翻译：探针卡组装及其形成方法
公开(公告)号：US07728612B2
公开(公告)日：2010-06-01
申请号：US11986453
申请日：2007-11-21
申请人： Raffi Garabedian , Nim Hak Tea , Steven Wang , Heather Karklin
发明人： Raffi Garabedian , Nim Hak Tea , Steven Wang , Heather Karklin
IPC分类号： G01R31/02 , G01R1/073
CPC分类号： G01R3/00 , G01R1/07378 , Y10T29/53243
摘要： A probe card assembly has a probe contactor substrate having a plurality of probe contactor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contactor substrate are vertically adjustable until secured by a locking mechanism which is coupled to the probe card wiring board. When the posts are secured in a fixed position, the position is one in which the plane of the plurality of probe contactor substrates is substantially parallel to a predetermined reference plane.
摘要翻译：探针卡组件具有在其上具有多个探针接触器尖端的探针接触器基板和设置在两者之间的插入器的探针卡布线板。与探针接触器基板接触的支撑柱是垂直可调的，直到通过联接到探针卡布线板的锁定机构固定。当柱固定在固定位置时，位置是多个探针接触器基板的平面基本上平行于预定参考平面的位置。

2. 发明授权

US07538567B2 Probe card with balanced lateral force 有权
标题翻译：探头卡平衡横向力
公开(公告)号：US07538567B2
公开(公告)日：2009-05-26
申请号：US11457132
申请日：2006-07-12
申请人： Shaoning Lu , Melvin Khoo , Nim Tea
发明人： Shaoning Lu , Melvin Khoo , Nim Tea
IPC分类号： G01R31/02
CPC分类号： G01R31/2891 , G01R1/07342
摘要： A novel method and structure for counter-balancing a lateral force exerted by a probe card onto a device under test (“DUT”) is disclosed. Many DUTs (particularly memory devices) are tested in parallel (i.e., many die at a time) and have unequal numbers of contact pads on top vs. bottom and/or right vs. left sides of the die. The probe card used to test the DUT would necessarily have an uneven distribution of probes that match the contact pads and, as a consequence, may exert a net lateral force on the DUT. By manipulating the individual characteristics of the individual probes, a probe card may be constructed that zeroes the lateral force. Characteristics such as the direction and stiffness of the individual probes can be varied to zero the net lateral force.
摘要翻译：公开了一种用于将探针卡施加到被测设备（“DUT”）上的横向力平衡的新颖方法和结构。许多DUT（特别是存储器件）被并行测试（即，一次许多裸片），并且在芯片的顶部与底部和/或右侧或左侧具有不相等数量的接触焊盘。用于测试DUT的探针卡必然具有与接触垫匹配的探头不均匀分布，因此可能在DUT上施加净侧向力。通过操纵各个探针的各个特性，构造可以使横向力为零的探针卡。诸如各个探针的方向和刚度的特征可以变化为零的净侧向力。

3. 发明申请

US20080252310A1 HYBRID PROBE FOR TESTING SEMICONDUCTOR DEVICES 有权
标题翻译：用于测试半导体器件的混合探针
公开(公告)号：US20080252310A1
公开(公告)日：2008-10-16
申请号：US11734434
申请日：2007-04-12
申请人： Nim Tea , Zhiyong An , Melvin Khoo
发明人： Nim Tea , Zhiyong An , Melvin Khoo
IPC分类号： G01R1/067
CPC分类号： G01R1/06733 , G01R1/06727 , G01R3/00
摘要： A novel hybrid probe design is presented that comprises a torsion element and a bending element. These elements allow the probe to store the displacement energy as torsion or as bending. The novel hybrid probe comprises a probe base, a torsion element, a bending element, and a probe tip. The probe elastically deforms to absorb the displacement energy as the probe tip contacts the DUT contact pad. The bending element absorbs some of the displacement energy through bending. Because the torsion element and the bending element join at an angle, a portion of the displacement energy is transferred to the torsion element causing it to twist (torque). The torsion element can also bend to accommodate the storage of energy through torsion and bending. Also, adjusting the position of a pivot can be manipulated to alter the energy absorption characteristics of the probe. One or more additional angular elements may be added to change the energy absorption characteristics of the probe. And, the moment of inertia for the torsion and/or bending elements can by manipulated to achieve the desired probe characteristics.
摘要翻译：提出了一种新颖的混合探针设计，其包括扭转元件和弯曲元件。这些元件允许探头将位移能量存储为扭转或弯曲。该新型混合探针包括探针基座，扭转元件，弯曲元件和探针尖端。当探针尖端接触DUT接触垫时，探头弹性变形以吸收位移能量。弯曲元件通过弯曲吸收一些位移能量。由于扭转元件和弯曲元件以一定角度接合，所以位移能量的一部分被传递到扭转元件，使其扭转（扭矩）。扭转元件还可以弯曲以适应通过扭转和弯曲的能量存储。此外，可以调节枢轴的位置以改变探头的能量吸收特性。可以添加一个或多个附加角元件以改变探针的能量吸收特性。并且，通过操纵扭转和/或弯曲元件的惯性矩可以实现所需的探针特性。

4. 发明授权

US07245135B2 Post and tip design for a probe contact 有权
公开(公告)号：US07245135B2
公开(公告)日：2007-07-17
申请号：US11194720
申请日：2005-08-01
申请人： Salleh Ismail , Nim Tea , Yang Hsu , Weilong Tang , Raffi Garabedian , Melvin Khoo
发明人： Salleh Ismail , Nim Tea , Yang Hsu , Weilong Tang , Raffi Garabedian , Melvin Khoo
IPC分类号： G01R31/02 , G03F1/14
CPC分类号： G01R1/06727 , G01R1/06738 , G01R3/00 , H01L2924/0002 , Y10T29/49117 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： The present invention relates to A microfabricated tip and post structure comprising a post having a rough top surface that diffuses incident light and a cross-section, and a tip, lithographically plated on the rough top surface of the post, having a smooth reflective surface appropriate for automatic vision recognition, and having a cross-section that is less than the cross-section of the post.

5. 发明申请

US20070075717A1 Lateral interposer contact design and probe card assembly 审中-公开
标题翻译：横向插入器触点设计和探针卡组合
公开(公告)号：US20070075717A1
公开(公告)日：2007-04-05
申请号：US11633324
申请日：2006-12-04
申请人： David Kinghorn , Raffi Garabedian , Richard Yabuki , Salleh Ismail
发明人： David Kinghorn , Raffi Garabedian , Richard Yabuki , Salleh Ismail
IPC分类号： G01R31/02
CPC分类号： G01R1/07378 , H01R12/52 , H01R13/24 , H01R13/2435 , H01R13/2464 , H01R13/2485 , H05K3/325
摘要： The present invention is directed to an interposer having an interposer substrate with an upper surface and a lower surface and at least one resilient contact element having an upper portion and a lower portion. The upper portion extends in a substantially vertical fashion above the upper surface of said interposer substrate, and the lower portion extends in a substantially vertical fashion below the lower surface of said interposer substrate. The upper and lower portions of the resilient contact element are substantially resilient in a direction parallel to the substrate.
摘要翻译：本发明涉及具有具有上表面和下表面的插入件基板和至少一个具有上部和下部的弹性接触元件的插入件。上部部分以大致垂直的方式在所述插入器基板的上表面上方延伸，并且下部部分以基本垂直的方式延伸到所述插入器基板的下表面之下。弹性接触元件的上部和下部在平行于基底的方向上基本上具有弹性。

6. 发明申请

US20110100826A1 SUPERFILLING SECONDARY METALLIZATION PROCESS IN MEMS FABRICATION 有权
标题翻译： MEMS制造中的超级二次金属化过程
公开(公告)号：US20110100826A1
公开(公告)日：2011-05-05
申请号：US12608857
申请日：2009-10-29
申请人： Montray Leavy
发明人： Montray Leavy
IPC分类号： C25D5/16 , B44C1/22 , B32B15/01
CPC分类号： C25D1/003 , B32B15/01 , C25D3/38
摘要： Processes are provided herein for the fabrication of MEMS utilizing both a primary metal that is integrated into the final MEMS structure and a sacrificial secondary metal that provides structural support for the primary metal component during machining More specifically, techniques are disclosed to increase the rate of secondary metal deposition between primary metal features in order to prevent voiding in the sacrificial secondary metal and thus enhance structural support of the primary metal during machining.
摘要翻译：本文提供了用于利用集成到最终MEMS结构中的主要金属和在加工期间为主要金属部件提供结构支撑的牺牲二次金属制造MEMS的工艺。具体而言，公开了增加次级金属沉积在主金属特征之间以防止牺牲二次金属中的空隙，从而增强在加工过程中初级金属的结构支撑。

7. 发明申请

US20100308854A1 PROBE CARD SUBSTRATE WITH BONDED VIA 审中-公开
标题翻译：探针卡底座与绑定威盛
公开(公告)号：US20100308854A1
公开(公告)日：2010-12-09
申请号：US12754452
申请日：2010-04-05
申请人： Raffi Garabedian , Salleh Ismail , Lakshmikanth Namburi
发明人： Raffi Garabedian , Salleh Ismail , Lakshmikanth Namburi
IPC分类号： G01R31/00 , H01R9/00
CPC分类号： G01R3/00 , G01R1/07378 , Y10T29/49147
摘要： The present invention is directed to a probe head having a probe contactor substrate with at least one slot that passes through the probe contactor substrate, at least one probe contactor adapted to test a device under test, with the probe contactor being coupled to the a top side of the probe contactor substrate and electrically connected to a terminal also disposed on top of the probe contactor substrate, and a space transformer having at least one bond pad coupled to a top side of the space transformer, and a bond interconnect which electrically couples the bond pad to the terminal through the slot in the probe contactor substrate.
摘要翻译：本发明涉及一种探针头，其具有探针接触器基底，该探针接触器基底具有穿过该探针接触器基底的至少一个狭缝，至少一个探针接触器，其适用于测试被测器件，探针接触器与顶部并且电连接到也设置在探针接触器基板顶部的端子，以及空间变压器，其具有耦合到空间变压器的顶侧的至少一个接合焊盘，以及电连接所述探针接触器基板接合焊盘通过探头接触器基板中的插槽连接到端子。

8. 发明申请

US20080252328A1 PROBE FOR TESTING SEMICONDUCTOR DEVICES 有权
标题翻译：用于测试半导体器件的探针
公开(公告)号：US20080252328A1
公开(公告)日：2008-10-16
申请号：US12042295
申请日：2008-03-04
申请人： Zhiyong An , Melvin Khoo , Nim Tea , Ting Hu
发明人： Zhiyong An , Melvin Khoo , Nim Tea , Ting Hu
IPC分类号： G01R1/067
CPC分类号： G01R1/06733 , G01R1/06727
摘要： A novel probe design is presented that increases a probe tolerance to stress fractures. Specifically, what is disclosed are three features increase stress tolerance. These features include a various union angle interface edge shapes, pivot cutouts and buffers.
摘要翻译：提出了一种新的探针设计，增加了对应力骨折的探针耐受性。具体来说，公开的是增加压力容忍度的三个特征。这些特征包括各种联合角度界面边缘形状，枢轴切口和缓冲区。

9. 发明授权

US07378734B2 Stacked contact bump 失效
标题翻译：堆叠接触凸块
公开(公告)号：US07378734B2
公开(公告)日：2008-05-27
申请号：US11421064
申请日：2006-05-30
申请人： Richard Yabuki , Nim Tea
发明人： Richard Yabuki , Nim Tea
IPC分类号： H01L23/48
CPC分类号： G01R3/00 , G01R1/06733 , H01L24/12 , H01L24/72 , H01L2224/05552 , H01L2224/1134 , H01L2224/1308 , H01L2224/13144 , H01L2224/13147 , H01L2224/13164 , H01L2224/13169 , H01L2924/00013 , H01L2924/01004 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/14 , H01L2924/00014 , H01L2224/13099
摘要： A novel method for providing bump structures that can be formed by conventional stud bump bonding techniques is disclosed. The bumps can be arranged in a buttressed configuration that allows for substantial lateral and vertical contact loads, and substantial heights. A side-by-side configuration may be used to build a stacked bump contact that is substantially taller and stronger than is possible under current techniques. Other arrangements can be selected to optimize the load bearing capacity in any direction or combination of directions.
摘要翻译：公开了一种用于提供可以通过常规的柱形凸块结合技术形成的凸块结构的新颖方法。凸块可以布置成支撑构造，其允许实质的侧向和垂直接触负载以及实质高度。可以使用并排配置来构建比当前技术下可能的基本上更高和更强的堆叠凸点接触。可以选择其他布置来优化任何方向或方向组合的承载能力。

10. 发明授权

US07365553B2 Probe card assembly 有权
标题翻译：探头卡组合
公开(公告)号：US07365553B2
公开(公告)日：2008-04-29
申请号：US11317408
申请日：2005-12-22
申请人： Raffi Garabedian , Nim Hak Tea , Steven Wang , Heather Karklin
发明人： Raffi Garabedian , Nim Hak Tea , Steven Wang , Heather Karklin
IPC分类号： G01R31/02 , G01R1/073
CPC分类号： G01R3/00 , G01R1/07378 , Y10T29/53243
摘要： A probe card assembly has a probe contractor substrate having a plurality of probe contractor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contractor substrate are vertically adjustable until secured by a locking mechanism which is coupled to the probe card wiring board. When the posts are secured in a fixed position, the position is one in which the plane of the plurality of probe contractor substrates is substantially parallel to a predetermined reference plane.
摘要翻译：探针卡组件具有在其上具有多个探针承载器尖端的探针承载器基板和设置在两者之间的插入器的探针卡布线板。与探针承载器基板接触的支撑柱是垂直可调的，直到通过联接到探针卡布线板的锁定机构固定。当柱固定在固定位置时，位置是多个探头承载器基板的平面基本上平行于预定参考平面的位置。

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