专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20180100888A1 IMPLEMENTING USER CONFIGURABLE PROBING USING MAGNETIC CONNECTIONS AND PCB FEATURES 有权
公开(公告)号：US20180100888A1
公开(公告)日：2018-04-12
申请号：US15287283
申请日：2016-10-06
申请人： International Business Machines Corporation
发明人： Layne A. Berge , John R. Dangler , Matthew S. Doyle , Thomas W. Liang , Manuel Orozco
IPC分类号： G01R31/28 , G01R1/067
CPC分类号： G01R31/2808 , G01R1/0416 , G01R1/06727 , G01R1/06794 , G01R31/2868 , G01R31/2893 , G01R31/2896
摘要： A method and system are provided for implementing user configurable probing with magnetic connections and printed circuit board (PCB) features. A first magnet is located at a desired probe point on the PCB, a probe having a second magnet of suitable polarity and an electrical contact is moved to the probe point. The first and second magnets attract each other, and the probe point makes electrical contact with an electrical conductor at the probe point.

2. 发明申请

US20180024163A1 PROBE MODULE HAVING CANTILEVER MEMS PROBE AND METHOD OF MAKING THE SAME 审中-公开
公开(公告)号：US20180024163A1
公开(公告)日：2018-01-25
申请号：US15652972
申请日：2017-07-18
申请人： MPI CORPORATION
发明人： YU-CHEN HSU , YU-WEN WANG , HORNG-KUANG FAN , MAO-FA SHEN
IPC分类号： G01R1/067 , G01R1/20 , G01R3/00
CPC分类号： G01R1/06727 , G01R1/06744 , G01R1/20 , G01R3/00
摘要： A method of making a cantilever MEMS probe module includes the steps of forming a cantilever MEMS probe on a first surface of a circuit substrate by a MEMS fabrication process in a way that the cantilever MEMS probe has a support post electrically and mechanically connected with an electric contact of the first surface, a cantilever arm connected with the support post, and a needle connected with the cantilever arm, and forming a through hole penetrating through the first surface and a second surface opposite to the first surface of the circuit substrate and corresponding in position to the needle and a part of the cantilever arm by using a cutting tool to cut the circuit substrate from the second surface toward the first surface of the circuit substrate. A probe module made by the method is disclosed too.

3. 发明授权

US09874585B2 Resilient electrical interposers, systems that include the interposers, and methods for using and forming the same 有权
公开(公告)号：US09874585B2
公开(公告)日：2018-01-23
申请号：US14788288
申请日：2015-06-30
申请人： Cascade Microtech, Inc.
发明人： Kenneth R. Smith , Mike Jolley , Eric Strid , Peter Hanaway , K. Reed Gleason , Koby L. Duckworth
IPC分类号： G01R31/00 , G01R31/02 , G01R31/28 , G01R1/073 , H01L21/48 , G01R1/067
CPC分类号： G01R1/0735 , G01R1/06727 , G01R1/06733 , G01R1/07342 , H01L21/4825 , H01L21/4828 , H01L21/4842 , H01L21/4853 , H01L21/4857 , Y10T29/49155
摘要： Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.

4. 发明授权

US09709597B2 Miniaturized cantilever probe for scanning probe microscopy and fabrication thereof 有权
公开(公告)号：US09709597B2
公开(公告)日：2017-07-18
申请号：US14305588
申请日：2014-06-16
申请人： Bruker Nano, Inc.
发明人： Weijie Wang , Chanmin Su
IPC分类号： G01Q70/08 , G01Q70/16 , G01Q60/38 , G01Q70/14 , G01Q70/02 , G01Q70/00
CPC分类号： G01Q60/38 , G01Q70/00 , G01Q70/02 , G01Q70/08 , G01Q70/14 , G01Q70/16 , G01R1/06727
摘要： Cantilever probes are formed from a multilayer structure comprising an upper substrate, a lower substrate, an interior layer, a first separation layer, and a second separation layer, wherein the first separation layer is situated between the upper substrate and the interior layer, the second separation layer is situated between the lower substrate and the interior layer, and wherein the first and the second separation layers are differentially etchable with respect to the first and the second substrates, the interior layer. The upper substrate is a first device layer from which a probe tip is formed. The interior layer is a second device layer from which a cantilever arm is formed. The lower substrate is a handle layer from which a handle, or base portion, is formed. Patterning and etching processing of any layer is isolated from the other layers by the separation layers.

5. 发明申请

US20170030966A1 PROBE CARD FOR TESTING INTEGRATED CIRCUITS 审中-公开
标题翻译：用于测试集成电路的探针卡
公开(公告)号：US20170030966A1
公开(公告)日：2017-02-02
申请号：US15290386
申请日：2016-10-11
申请人： STMicroelectronics S.r.l.
发明人： Alberto Pagani
IPC分类号： G01R31/28 , G01R1/04 , G01R1/073
CPC分类号： G01R31/2889 , B62M25/04 , G01R1/0491 , G01R1/06727 , G01R1/07342
摘要： A probe card is adapted for testing at least one integrated circuit that integrated on a corresponding at least one die of a semiconductor material wafer. The probe card includes a board adapted for the coupling to a tester apparatus. Several probes are coupled to the board. The probe card includes replaceable elementary units, wherein each unit includes at least one probe for contacting externally-accessible terminals of an integrated circuit under test. The replaceable elementary units are arranged so as to correspond to an arrangement of at least one die on the semiconductor material wafer containing integrated circuits to be tested.
摘要翻译：探针卡适于测试集成在半导体材料晶片的相应的至少一个管芯上的至少一个集成电路。探针卡包括适于耦合到测试仪器的板。几个探头耦合到电路板。探针卡包括可替换的基本单元，其中每个单元包括用于接触被测集成电路的外部可接近端子的至少一个探针。可替换基本单元被布置成对应于包含要测试的集成电路的半导体材料晶片上的至少一个管芯的布置。

6. 发明申请

US20160047843A1 PROBE CARD AND TEST EQUIPMENT WITH THE SAME 有权
标题翻译：探针卡和测试设备
公开(公告)号：US20160047843A1
公开(公告)日：2016-02-18
申请号：US14825671
申请日：2015-08-13
申请人： MPI CORPORATION
发明人： Chia-Tai CHANG , Hsiu-Wei LIN , Hung-Yi LIN
IPC分类号： G01R1/073 , G01R1/04 , G01R31/26 , G01R1/067
CPC分类号： G01R1/07342 , G01R1/04 , G01R1/06727 , G01R1/06733 , G01R1/07307 , G01R31/2601 , G01R31/2635
摘要： A probe card for contacting an LED chip of flip-chip type includes a circuit board, two probes and a fixing seat. The circuit board has a mounting surface and a lateral edge. Each probe has a connecting portion mounted on the circuit board, an extending portion extending from the connecting portion, a cantilever portion connected with the extending portion and protruding out of the lateral edge, and a contacting portion extending from the cantilever portion. The fixing seat is mounted on the mounting surface of the circuit board and has a fixing surface. A part of the extending portion is located between the circuit board and the fixing seat. A test equipment for testing optical characteristics of an LED chip of flip-chip type is provided with the probe card.
摘要翻译：用于接触倒装芯片类型的LED芯片的探针卡包括电路板，两个探针和固定座。电路板具有安装表面和侧边缘。每个探针具有安装在电路板上的连接部分，从连接部分延伸的延伸部分，与延伸部分连接并从侧边缘突出的悬臂部分，以及从悬臂部分延伸的接触部分。固定座安装在电路板的安装面上，具有固定面。延伸部分的一部分位于电路板和固定座之间。用于测试倒装芯片类型的LED芯片的光学特性的测试设备设置有探针卡。

7. 发明申请

US20150369843A1 ELECTRICAL CONNECTION DEVICE COMPRISING CONNECTION ELEMENTS WITH CONTROLLABLE POSITION 有权
标题翻译：包含具有可控位置的连接元件的电气连接装置
公开(公告)号：US20150369843A1
公开(公告)日：2015-12-24
申请号：US14737761
申请日：2015-06-12
申请人： Commissariat a L'Energie Atomique et aux Energies Alternatives
发明人： Haykel BEN JAMAA , Patrice REY
IPC分类号： G01R1/073 , G01R3/00
CPC分类号： G01R1/07364 , G01R1/06727 , G01R1/06738 , G01R1/06761 , G01R3/00 , H01H57/00 , H01H2057/006 , H01L41/094 , Y10T29/43
摘要： Electrical connection device comprising at least one substrate and one or several first electrical connection elements located on a front face of the electrical connection device such that they can be coupled to contact pads of an electronic device to which the electrical connection device is intended to be connected, each first electrical connection element comprising: at least one support, of which at least one first end is anchored to the substrate such that part of the support is suspended above the front face, the support comprising at least a portion of piezoelectric material located between two electrodes and capable of moving said part of the support in two directions approximately perpendicular to the front face depending on a value of an electrical voltage intended to be applied onto the electrodes; at least one electrical conducting element located on said part of the support.
摘要翻译：电连接装置包括至少一个基板和位于电连接装置的前表面上的一个或多个第一电连接元件，使得它们可以耦合到电连接装置打算连接的电子装置的接触垫每个第一电连接元件包括：至少一个支撑件，其中至少一个第一端锚定到所述基板，使得所述支撑件的一部分悬挂在所述前表面上方，所述支撑件包括至少一部分位于两个电极并且能够根据要施加到电极上的电压的值，大致垂直于前面的两个方向移动支撑体的所述部分; 位于所述支撑件的所述部分上的至少一个导电元件。

8. 发明申请

US20150192614A1 CANTILEVER CONTACT PROBE FOR A TESTING HEAD 审中-公开
标题翻译： CANTILEVER联系人测试头
公开(公告)号：US20150192614A1
公开(公告)日：2015-07-09
申请号：US14638533
申请日：2015-03-04
申请人： Technoprobe S.p.A.
发明人： Riccardo Vettori , Emanuele Bertarelli , Marco Diegidio
IPC分类号： G01R1/067 , G01R1/04 , G01R1/073
CPC分类号： G01R1/06727 , G01R1/04 , G01R1/06733 , G01R1/07342
摘要： A cantilever contact probe comprises at least a probe body and a hook-shaped end portion, being joined to the probe body and ending with a slanted section being configured as a hook. The end portion is bent at a bending point having a suitable inclination of the hooked slanted section with respect to a longitudinal extension axis of the probe and ends with a contact tip being able to assure a mechanical and electrical contact with a contact pad of a device under test. Suitably, the probe comprises at least a reduced portion having a first area with at least a first size being smaller than a corresponding first size of a second area of the probe in a section which does not comprise the reduced portion, along a side by side placing direction of the probes within a testing head. The reduced portion is substantially reduced along its sides thus forming an area having a reduced cross size being placed edgeways.
摘要翻译：悬臂接触探针至少包括探针体和钩形端部，其连接到探针主体并且以配置为钩的倾斜部分结束。端部在弯曲点处弯曲，该弯曲点具有相对于探针的纵向延伸轴线的钩形倾斜部分的适当倾斜度，并且端部具有能够确保与装置的接触垫机械和电接触的接触尖端被测试。适当地，探针至少包括具有第一区域的缩小部分，第一区域具有至少第一尺寸小于在不包括减少部分的部分中沿着并排的第一尺寸的探针的第二区域将探头的方向放置在测试头内。减小的部分沿其侧面大大减小，从而形成具有减小的交叉大小的区域被设置为边缘。

9. 发明授权

US08970240B2 Resilient electrical interposers, systems that include the interposers, and methods for using and forming the same 有权
标题翻译：弹性电插入件，包括插入件的系统，以及使用和形成插入件的方法
公开(公告)号：US08970240B2
公开(公告)日：2015-03-03
申请号：US13287794
申请日：2011-11-02
申请人： Kenneth R. Smith , Mike Jolley , Eric Strid , Peter Hanaway , K. Reed Gleason , Koby L. Duckworth
发明人： Kenneth R. Smith , Mike Jolley , Eric Strid , Peter Hanaway , K. Reed Gleason , Koby L. Duckworth
IPC分类号： G01R1/067 , G01R1/073
CPC分类号： G01R1/0735 , G01R1/06727 , G01R1/06733 , G01R1/07342 , H01L21/4825 , H01L21/4828 , H01L21/4842 , H01L21/4853 , H01L21/4857 , Y10T29/49155
摘要： Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.
摘要翻译：可用于在第一装置和第二装置之间形成多个电连接的弹性电插入件，以及可利用弹性电插入件及其使用和/或制造方法的系统。弹性电插入件可以包括弹性介电体，其中包含多个电导管。多个电导管可以被配置为在电插入器的第一表面和/或弹性介电体之间提供多个电连接，以及电插入器和/或弹性介电体的第二相对的表面。本文公开的系统和方法可以提供弹性电插入器的改进的垂直顺应性，改进的接触力控制和/或改进的尺寸稳定性。

10. 发明授权

US08957690B2 Micro contact probe coated with nanostructure and method for manufacturing the same 有权
标题翻译：用纳米结构涂覆的微接触探针及其制造方法
公开(公告)号：US08957690B2
公开(公告)日：2015-02-17
申请号：US13119590
申请日：2009-02-19
申请人： Jung-Yup Kim , Hak-Joo Lee , Chang-Soo Han
发明人： Jung-Yup Kim , Hak-Joo Lee , Chang-Soo Han
IPC分类号： G01R1/067 , G01R3/00
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/06744 , Y10S977/742 , Y10T29/49155
摘要： The present invention relates to a micro contact probe used for a probe card. An exemplary embodiment of the present invention provides a micro contact probe including a coating layer of a nanostructure such as carbon nanotubes formed on a surface thereof to reduce contact resistance when contacting a semiconductor chip. According to the micro contact probe of which the surface is coated with the nanostructure, contact resistance between the probe and the semiconductor chip is lowered and the high frequency characteristics are improved, such that a more accurate measurement can be obtained.
摘要翻译：本发明涉及用于探针卡的微型接触探针。本发明的示例性实施例提供了一种微接触探针，其包括在其表面上形成的诸如碳纳米管的纳米结构的涂层，以在接触半导体芯片时降低接触电阻。根据其表面被纳米结构涂覆的微接触探针，探针与半导体芯片之间的接触电阻降低，并且提高了高频特性，从而可以获得更准确的测量。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式