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1. 发明授权

US10215937B1 Optoelectronic package 有权
公开(公告)号：US10215937B1
公开(公告)日：2019-02-26
申请号：US15967467
申请日：2018-04-30
申请人： UNISTARS CORPORATION
发明人： Shang-Yi Wu , Hsin-Hsien Hsieh
IPC分类号： G02B6/42 , H01L33/52 , H01L23/00 , H01L33/48
摘要： An optoelectronic package includes a wiring substrate having a holding plane, an optoelectronic chip, a reflective material, an optical element and an adhesive. The optoelectronic chip is mounted on the holding plane and electrically connected to the wiring substrate. The optoelectronic chip has an upper surface, a functional region and a side surface connected to the upper surface. The reflective material is on the holding plane and surrounds the optoelectronic chip. The reflective material covers the side surface and has an inclined surface. The inclined surface surrounds the upper surface and extends from an edge of the upper surface. The height of the reflective material at the inclined surface decreases from the optoelectronic chip toward a direction away from the optoelectronic chip. The adhesive covers the reflective material and the upper surface and is connected between the optoelectronic chip and the optical element.

2. 发明授权

US10153459B2 Optoelectronic package 有权
公开(公告)号：US10153459B2
公开(公告)日：2018-12-11
申请号：US15650989
申请日：2017-07-17
申请人： UNISTARS CORPORATION
发明人： Shang-Yi Wu , Hsin-Hsien Hsieh
IPC分类号： H01L51/52 , H01L51/10
摘要： An optoelectronic package includes a substrate, a light emitting chip, an optical sealant, and an optical scattering layer. The substrate has a carrying plane and a wiring layer formed on the carrying plane. The light emitting chip used for emitting a light ray is mounted on the carrying plane and electrically connected to the wiring layer. The optical sealant covers the carrying plane and wraps the light emitting chip. The optical sealant is located in the path of the light ray. The optical scattering layer covers the optical sealant. The optical sealant located in the path of the light ray is formed between the substrate and the optical scattering layer. Preferably, the refractive index of the optical sealant is larger than or equal to the refractive index of the optical scattering layer.

3. 发明申请

US20150226382A1 ELECTROLUMINESCENT DEVICE AND APPARATUS APPLYING THE SAME 审中-公开
标题翻译：电致发光器件及其应用的装置
公开(公告)号：US20150226382A1
公开(公告)日：2015-08-13
申请号：US14177229
申请日：2014-02-11
申请人： Unistars Corporation
发明人： Wen-Cheng CHIEN , Shang-Yi WU , Tien-Hao HUANG , Hsin-Hsien HSIEH
IPC分类号： F21K99/00 , F21V29/15 , F21V19/04
CPC分类号： F21K9/23 , F21Y2105/00 , F21Y2107/00 , F21Y2115/10 , F21Y2115/20
摘要： An electroluminescence device comprises a sandwich structure and a first luminous unit. The sandwich structure comprises a first metal layer, an insulation layer, and a second metal layer stacked in sequence along a stacking direction. The first luminous unit is disposed on a sidewall of the sandwich structure parallel to the stacking direction, wherein the first luminous unit comprises a first electrode and a second electrode connected to the first metal layer and the second metal layer by a solder ball respectively.
摘要翻译：电致发光器件包括夹层结构和第一发光单元。夹层结构包括沿层叠方向依次堆叠的第一金属层，绝缘层和第二金属层。第一发光单元设置在层叠结构的与堆叠方向平行的侧壁上，其中第一发光单元包括分别通过焊球连接到第一金属层和第二金属层的第一电极和第二电极。

4. 发明授权

US08866313B2 Substrate, semiconductor construction, and manufacturing method thereof 有权
标题翻译：基板，半导体构造及其制造方法
公开(公告)号：US08866313B2
公开(公告)日：2014-10-21
申请号：US13798486
申请日：2013-03-13
申请人： Unistars Corporation
发明人： Tien-Hao Huang , Hsin-Hsie Lee , Yi-Chun Wu , Shang-Yi Wu
IPC分类号： H01L23/12 , H01L21/4763 , B32B7/12 , H01L33/00 , H01L33/48
CPC分类号： H01L33/48 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L33/005 , H01L33/486 , H01L33/62 , H01L2224/27013 , H01L2224/2919 , H01L2224/32 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/83385 , H01L2224/92247 , H01L2924/00014 , H01L2924/12041 , H01L2924/181 , H01L2924/3025 , H01L2933/0033 , H01L2933/0066 , Y10T156/10 , Y10T428/24612 , Y10T428/24851 , H01L2924/00 , H01L2224/45099
摘要： A substrate includes a die-bonding zone and a glue spreading pattern. The die-bonding zone is set to bond a die. The glue spreading pattern is placed in the die-bonding zone and includes a containing space. The die is placed on the glue spreading pattern, an area of a bottom of the die is greater than an area of an opening of the glue spreading pattern, the containing room of the glue spreading pattern is filled with a glue, and the die is bonded to the substrate by means of the glue.
摘要翻译：基板包括芯片接合区和胶涂布图案。将芯片粘合区设置成键合模具。胶布铺展图案被放置在芯片粘接区域中并且包括容纳空间。将模具放置在胶布铺展图案上，模具底部的区域大于胶布铺展图案的开口面积，胶水铺展图案的容纳室用胶水填充，模具为通过胶粘在基材上。

5. 发明授权

US08723214B2 Submount and manufacturing method thereof 有权
标题翻译：其安装及其制造方法
公开(公告)号：US08723214B2
公开(公告)日：2014-05-13
申请号：US13150034
申请日：2011-06-01
申请人： Wen-Cheng Chien , Chia-Lun Tsai
发明人： Wen-Cheng Chien , Chia-Lun Tsai
IPC分类号： H01L33/00 , H01L23/495 , H01L23/10 , H01L23/34 , H01L27/15
CPC分类号： H01L24/80 , H01L24/48 , H01L24/49 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/4911 , H01L2224/49175 , H01L2924/00014 , H01L2924/12041 , H01L2924/14 , H01L2924/15156 , H01L2924/15165 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： A submount and a manufacturing method thereof are provided. The submount, on which at least a semiconductor die is disposed, is mounted on a circuit board. The submount includes a substrate made of a conductive material or a semiconducting material, a plurality of conductive film patterns, and an insulating film pattern. A surface of the substrate includes a die-bonding area and a plurality of conductive areas. The conductive film patterns are individually distributed in the respective conductive areas. The insulating film pattern is disposed between the conductive film pattern and the insulating film pattern, but is not disposed in the die-bonding area. Furthermore, the semiconductor die is disposed in the die-bonding area and is electrically connected with the conductive film patterns. Because the insulating film pattern is not being disposed in the die-bonding area of the submount, the submount structure has improved heat transfer efficiency.
摘要翻译：提供了一种基座及其制造方法。至少设有半导体管芯的基座安装在电路板上。底座包括由导电材料或半导体材料制成的衬底，多个导电膜图案和绝缘膜图案。基板的表面包括芯片接合区域和多个导电区域。导电膜图案分别分布在相应的导电区域中。绝缘膜图案设置在导电膜图案和绝缘膜图案之间，但不设置在芯片接合区域中。此外，半导体管芯设置在芯片接合区域中并与导电膜图案电连接。由于绝缘膜图案不设置在基座的芯片接合区域中，所以基座结构具有改善的传热效率。

6. 发明申请

US20210057622A1 LIGHT EMITTING DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 有权
公开(公告)号：US20210057622A1
公开(公告)日：2021-02-25
申请号：US16590396
申请日：2019-10-02
申请人： Unistars Corporation
发明人： Tien-Hao Huang , Cheng-Kang Ku
IPC分类号： H01L33/60 , H01L25/075 , H01L33/48 , H01L33/54 , H01L33/50
摘要： A light emitting device package structure includes a substrate, a plurality of light emitting chips, a diffusion glue layer, a patterned masking colloid, and a transparent protective layer. The substrate has a bearing surface. The p light emitting chips are arranged and disposed on the bearing surface and electrically connected to the substrate. The light emitting chips compose an arrangement pattern. The diffusion glue layer is disposed on the bearing surface and covers the light emitting chips. The patterned masking colloid is formed on the diffusion glue layer. The patterned masking colloid at least corresponds to the arrangement pattern of the plurality of light emitting chips and is located directly above the plurality of light emitting chips. The transparent protective layer is disposed on the diffusion glue layer and covers the patterned masking colloid. A manufacturing method of a light emitting element package structure is also provided.

7. 发明授权

US10651354B2 Optoelectronic package with a low water vapor transmission rate (WVTR) and method for fabricating the same 有权
公开(公告)号：US10651354B2
公开(公告)日：2020-05-12
申请号：US15616925
申请日：2017-06-08
申请人： UNISTARS CORPORATION
发明人： Shang-Yi Wu , Liang-Kuei Huang , Pao-Ya Wang
IPC分类号： H01L33/56 , H01L33/58 , H01L33/00
摘要： An optoelectronic package includes a carrier, a light emitting die, a cover, and an encapsulation material. The carrier has a carrying plane and a wiring layer on the carrying plane. The light emitting die is mounted on the carrying plane and electrically connected to the wiring layer. The cover is connected to carrier. A cavity is formed between the cover and the carrier, and the light emitting die is within the cavity. The encapsulation material formed on the carrier surrounds the cover. The encapsulation material completely covers the interface between the cover and carrier.

8. 发明授权

US10121943B2 Light emitting package base structure 有权
公开(公告)号：US10121943B2
公开(公告)日：2018-11-06
申请号：US15619524
申请日：2017-06-11
申请人： UNISTARS CORPORATION
发明人： Liang-Kuei Huang , Shang-Yi Wu
IPC分类号： H01L33/48 , H01L33/52 , H01L33/56 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62
摘要： A light emitting package base structure includes a carrier, a light emitting chip, a light transmission unit and a dam. The carrier has a supporting surface and an outer surface surrounding the supporting surface. The light emitting chip is disposed on the supporting surface and electrically connected to the carrier. The light transmission unit is disposed on the carrier and has a through hole. The dam is disposed between the carrier and the light transmission unit, and a hermetic receiving space is formed between the dam, the light transmission unit and the carrier. The light emitting chip is located in the hermetic receiving space and the dam has a side surface away from the hermetic receiving space. A gap is formed between the side surface and the outer surface, and the through hole is corresponded to a location between the side surface and the outer surface.

9. 发明申请

US20150060911A1 OPTOELECTRONIC SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF 审中-公开
标题翻译：光电半导体器件及其制造方法
公开(公告)号：US20150060911A1
公开(公告)日：2015-03-05
申请号：US14018422
申请日：2013-09-05
申请人： Unistars Corporation
发明人： Wen-Cheng CHIEN , Tien-Hao HUANG , Shang-Yi WU
IPC分类号： H01L33/52 , H01L33/00 , H01L33/62
CPC分类号： H01L33/52 , H01L24/97 , H01L25/0753 , H01L33/486 , H01L33/50 , H01L33/62 , H01L51/5237 , H01L2224/16 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/15787 , H01L2924/181 , H01L2933/0041 , H01L2933/0066 , H01L2924/00
摘要： An optoelectronic semiconductor device comprises a substrate, at least one solid via plug, at least one optoelectronic semiconductor chip, a phosphor layer and a molding body. The at least one solid via plug penetrates through the substrate. The at least one optoelectronic semiconductor chip has a first electrode aligned to and electrically connected with the solid via plug. The phosphor layer covers at least one surface of the optoelectronic semiconductor chip. The molding body encapsulates the substrate, the optoelectronic semiconductor chip and the phosphor layer. The number of solid valid plugs, substrate surfaces, electrodes, bonding pad on each surface of the substrate for forming each optoelectronic semiconductor device can be, for example, two, respectively.
摘要翻译：光电子半导体器件包括衬底，至少一个固体通孔插塞，至少一个光电子半导体芯片，荧光体层和成型体。至少一个固体通孔塞穿过基底。所述至少一个光电子半导体芯片具有与固体通孔插塞对准并电连接的第一电极。磷光体层覆盖光电子半导体芯片的至少一个表面。成型体封装基板，光电子半导体芯片和荧光体层。用于形成每个光电子半导体器件的用于形成每个光电子半导体器件的基板的每个表面上的固体有效插头，基板表面，电极，接合焊盘的数量可以分别为例如两个。

10. 发明申请

US20140247585A1 SEMICONDUCTOR LIGHTING APPARATUS 审中-公开
标题翻译：半导体照明设备
公开(公告)号：US20140247585A1
公开(公告)日：2014-09-04
申请号：US13781768
申请日：2013-03-01
申请人： UNISTARS CORPORATION
发明人： Wen-Cheng CHIEN , Shang-Yi WU , Shin-Shien SHIE
IPC分类号： F21V19/00
CPC分类号： F21V19/003 , F21K9/23 , F21K9/278 , F21V3/00 , F21V23/02 , F21V23/06 , F21V29/507 , F21V29/89 , F21Y2103/10 , F21Y2115/10
摘要： A semiconductor lighting apparatus includes an illumination module and a power module. The illumination module includes a supporting member, a semiconductor light-emitting element, an electrode structure and a first connecting member. The semiconductor light-emitting element is mounted on the supporting member and electrically connected with the electrode structure. The first connecting member is mounted on a first side of the supporting member. The power module is configured to connect to the first side of the supporting member, and includes a second connecting member and a driving circuit member. The second connecting member is detachably connected with the first connecting member. The driving circuit member is electrically connected with the second connecting member and electrically connected with the electrode structure to provide a driving power to the semiconductor light-emitting element.
摘要翻译：半导体照明装置包括照明模块和电源模块。照明模块包括支撑构件，半导体发光元件，电极结构和第一连接构件。半导体发光元件安装在支撑构件上并与电极结构电连接。第一连接构件安装在支撑构件的第一侧上。电源模块被配置为连接到支撑构件的第一侧，并且包括第二连接构件和驱动电路构件。第二连接构件与第一连接构件可拆卸地连接。驱动电路部件与第二连接部件电连接，与电极结构电连接，为半导体发光元件提供驱动电力。

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