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    • 4. 发明授权
    • System for enabling digital signature auditing
    • 启用数字签名审核的系统
    • US08892892B2
    • 2014-11-18
    • US13420705
    • 2012-03-15
    • Michael Charles OsborneTamas Visegrady
    • Michael Charles OsborneTamas Visegrady
    • G06F21/00H04L9/32
    • H04L9/3247H04L2209/38
    • A computer method, computer system, and article for enabling digital signature auditing. The method includes the steps of: receiving at least one signature request issued by at least one application, forwarding a first data corresponding to the received at least one signature request to at least one signing entity for subsequent signature of the first data, storing an updated system state that is computed using a function of: i) a reference system state and ii) a second data corresponding to the received at least one signature request, where the reference system state and the updated system state attest to the at least one signature request, and repeating the above steps, using the updated system state as a new reference system state, where the steps of the method are executed at a server of a computerized system.
    • 一种用于启用数字签名审核的计算机方法,计算机系统和文章。 该方法包括以下步骤:接收由至少一个应用发出的至少一个签名请求,将对应于所接收的至少一个签名请求的第一数据转发给至少一个签名实体,以便随后签署第一数据,存储更新的 使用以下功能计算的系统状态:i)参考系统状态,以及ii)对应于接收到的至少一个签名请求的第二数据,其中参考系统状态和更新的系统状态证明至少一个签名请求 ,并且重复上述步骤,使用更新的系统状态作为新的参考系统状态,其中该方法的步骤在计算机化系统的服务器处执行。
    • 5. 发明授权
    • Method for enhancing lithographic imaging of isolated and semi-isolated features
    • 用于增强隔离和半隔离特征的光刻成像的方法
    • US08546069B2
    • 2013-10-01
    • US12354247
    • 2009-01-15
    • Wu-Song HuangGregory R. McIntyre
    • Wu-Song HuangGregory R. McIntyre
    • G03F7/40
    • G03F7/2022G03F7/095G03F7/26
    • The present invention relates to photolithography methods for enhancing lithographic imaging of isolated and semi-isolated features. A first layer of a first photoresist is formed over a substrate. A second layer of a second photoresist is formed over the first layer. The second photoresist includes a polymer containing an absorbing moiety. The second layer is exposed through a first patterned mask and developed to form a first relief image. The first relief image and the first layer are exposed through a second patterned mask. One of the first and the second patterned masks includes a dense pattern, while the other includes an isolated or a semi-isolated pattern. The first relief image and base soluble regions of the first layer are removed to form a second relief image with an isolated or a semi-isolated pattern. The second layer can also be bleachable upon exposure and bake in the present invention.
    • 本发明涉及用于增强孤立和半隔离特征的光刻成像的光刻方法。 在衬底上形成第一光致抗蚀剂的第一层。 在第一层上形成第二光致抗蚀剂层。 第二光致抗蚀剂包括含有吸收部分的聚合物。 第二层通过第一图案化掩模曝光并显影以形成第一浮雕图像。 第一浮雕图像和第一层通过第二图案掩模曝光。 第一和第二图案化掩模中的一个包括密集图案,而另一个包括隔离或半隔离图案。 去除第一层的第一浮雕图像和底部可溶区域以形成具有隔离或半隔离图案的第二浮雕图像。 第二层也可以在本发明中曝光和烘烤时可漂白。
    • 7. 发明授权
    • Controlling shared memory
    • 控制共享内存
    • US09356887B2
    • 2016-05-31
    • US13599501
    • 2012-08-30
    • Ying ChenYan LiQiming TengHuayong Wang
    • Ying ChenYan LiQiming TengHuayong Wang
    • G06F15/167H04L12/879G06F9/54
    • H04L49/901G06F9/544G06F15/167
    • In view of the characteristics of distributed applications, the present invention proposes a technical solution for applying a shared memory on an NIC comprising: a shared memory configured to provide shared storage space for a task of a distributed application, and a microcontroller. Furthermore, the present invention provides a computer device that includes the above-mentioned NIC, a method for controlling a read/write operation on a shared memory of a NIC, and a method for invoking the NIC. The use of the technical solution provided in the present invention bypasses the processing of network protocol stack, avoids the time delay introduced by the network protocol stack. The present invention does not need to perform TCP/IP encapsulation on the data packet, thus greatly saving additional packet header and packet tail overheads generated from the TCP/IP layer data encapsulation.
    • 鉴于分布式应用的特征,本发明提出了一种在NIC上应用共享存储器的技术方案,包括:配置为为分布式应用的任务提供共享存储空间的共享存储器和微控制器。 此外,本发明提供了一种包括上述NIC的计算机设备,用于控制NIC的共享存储器上的读/写操作的方法和用于调用NIC的方法。 使用本发明提供的技术方案绕过了网络协议栈的处理,避免了由网络协议栈引入的时延。 本发明不需要在数据分组上执行TCP / IP封装,从而大大节省了从TCP / IP层数据封装产生的附加分组报头和分组尾部开销。
    • 10. 发明授权
    • Strained ultra-thin SOI transistor formed by replacement gate
    • 应变超薄SOI晶体管由替代栅极组成
    • US08536650B2
    • 2013-09-17
    • US13020223
    • 2011-02-03
    • Kangguo ChengJunedong Lee
    • Kangguo ChengJunedong Lee
    • H01L27/12
    • H01L29/78684H01L29/66545H01L29/66742H01L29/7848H01L29/78603H01L29/78621
    • A semiconductor structure is described. The structure includes a transistor formed in a semiconductor substrate, the semiconductor substrate having a semiconductor-on-insulator (SOI) layer; a channel associated with the transistor and formed on a first portion of the SOI layer; and a source/drain region associated with the transistor and formed in a second portion of the SOI layer and in a recess at each end of the channel, where the second portion of the SOI layer is substantially thicker than the first portion of the SOI layer. A method of fabricating the semiconductor structure is also described. The method includes forming a dummy gate in a semiconductor substrate; performing a SIMOX process to form a SOI layer such that a first portion of the SOI layer under the dummy gate is substantially thinner than a second portion of the SOI layer; forming a source/drain extension in the SOI layer; and recessing the source/drain extension for forming a source/drain region; epitaxially growing the second portion of the SOI layer; forming an insulating layer over the epitaxial growth; removing the dummy gate for forming a gate opening; and filling the gate opening with a gate dielectric material and a gate conductor material.
    • 描述半导体结构。 该结构包括形成在半导体衬底中的晶体管,该半导体衬底具有绝缘体上半导体层(SOI)层; 与所述晶体管相关并形成在所述SOI层的第一部分上的沟道; 以及与所述晶体管相关并形成在所述SOI层的第二部分中以及在所述沟道的每个端部处的凹部中的源极/漏极区域,其中所述SOI层的所述第二部分基本上比所述SOI层的第一部分更厚 。 还描述了制造半导体结构的方法。 该方法包括在半导体衬底中形成虚拟栅极; 执行SIMOX处理以形成SOI层,使得所述伪栅极之下的所述SOI层的第一部分实质上薄于所述SOI层的第二部分; 在SOI层中形成源/漏扩展; 并且凹入用于形成源极/漏极区域的源极/漏极延伸部分; 外延生长SOI层的第二部分; 在外延生长上形成绝缘层; 去除用于形成门开口的虚拟门; 以及用栅极电介质材料和栅极导体材料填充栅极开口。