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    • 10. 发明授权
    • Plasma processing apparatus and plasma processing method
    • 等离子体处理装置和等离子体处理方法
    • US08545670B2
    • 2013-10-01
    • US12209617
    • 2008-09-12
    • Akihiro KojimaHisataka HayashiAkio Ui
    • Akihiro KojimaHisataka HayashiAkio Ui
    • C23F1/00H01L21/306C23C16/00
    • H01L21/31116H01J37/32091H01J37/32165
    • A plasma processing apparatus for processing a substrate using plasma includes a first electrode configured to mount the substrate, a second electrode disposed to face the first electrode with a predetermined space, a chamber containing the first electrode and the second electrode, the chamber being capable of adjusting an inside atmosphere, a first electric power source device configured to apply a first RF voltage for controlling a self-bias voltage generated on the substrate to the first electrode, the first electric power source device applying a substantially constant width and a substantially constant value in a peak-to-peak voltage of an RF voltage of a first frequency at intervals, and a second electric power source device configured to apply a second RF voltage of a second frequency for generating plasma between the first and second electrodes to one of the first electrode and the second electrode.
    • 使用等离子体处理衬底的等离子体处理装置包括:被配置为安装衬底的第一电极,以预定空间设置为面对第一电极的第二电极,容纳第一电极和第二电极的腔室, 调整内部气氛的第一电源装置,被配置为向第一电极施加用于控制在基板上产生的自偏压的第一RF电压的第一电源装置,施加基本上恒定的宽度和基本恒定的值的第一电力源装置 在间隔的第一频率的RF电压的峰峰值电压中,以及第二电源装置,被配置为将第二频率的第二RF电压施加到第一和第二电极之间的等离子体之一 第一电极和第二电极。