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    • 3. 发明授权
    • Sensing system
    • 感应系统
    • US07663743B2
    • 2010-02-16
    • US11749340
    • 2007-05-16
    • Alan Torres Garcia
    • Alan Torres Garcia
    • G01J1/00G01B9/08
    • H01L21/67253
    • In a first aspect according to the invention there is provided a sensing system 100, suitable for sensing the stage of processing of a wafer 200, said sensing system 100 comprising receiving means 110 in the form of a first photosensitive device 110a and a second photosensitive device 110b, detector 120, a comparator 130 and a control system in the form of a programmable logic controller (PLC) 140. The first photosensitive device 110a receives light from the wafer 200, while the second photosensitive device 110b receives ambient light. The light received by the first photosensitive device 110a can be incident ambient light reflected off the surface of the wafer 200, refracted light radiating through the wafer 200, filtered light radiating through the wafer 200 or translucent light radiating through the wafer 200. It is further envisaged that the received light may be filtered through filters (not shown) before being received by the photosensitive devices 110a&b. The detector 120 then generates a wafer control signal associated with the color(s) of the light received from the wafer 200. The wafer control signal produced by the detector 120 is then compared by a comparator 130. Once the comparator 130 has compared the wafer control signal to the predetermined values, this indirectly indicates the level of processing of the wafer 200. The PLC 140 then controls the further processing of the wafer 200 according to the result of the comparison.
    • 在根据本发明的第一方面,提供了一种感测系统100,其适于感测晶片200的处理阶段,所述感测系统100包括呈第一感光装置110a和第二感光装置形式的接收装置110 110b,检测器120,比较器130和可编程逻辑控制器(PLC)140形式的控制系统。第一光敏器件110a接收来自晶片200的光,而第二光敏器件110b接收环境光。 由第一感光装置110a接收的光可以是从晶片200的表面反射的入射环境光,通过晶片200辐射的折射光,通过晶片200辐射的滤波光或通过晶片200辐射的半透明光。进一步 设想接收的光可以在被感光装置110a和b接收之前通过滤光器(未示出)过滤。 然后,检测器120产生与从晶片200接收的光的颜色相关联的晶片控制信号。然后由比较器130比较由检测器120产生的晶片控制信号。一旦比较器130比较晶片 控制信号到预定值,这间接地指示晶片200的处理水平。然后,PLC 140根据比较的结果控制晶片200的进一步处理。
    • 4. 发明申请
    • Sensing System
    • 感应系统
    • US20080285015A1
    • 2008-11-20
    • US11749340
    • 2007-05-16
    • Alan Torres Garcia
    • Alan Torres Garcia
    • G01N21/00G01J3/46
    • H01L21/67253
    • In a first aspect according to the invention there is provided a sensing system 100, suitable for sensing the stage of processing of a wafer 200, said sensing system 100 comprising receiving means 110 in the form of a first photosensitive device 110a and a second photosensitive device 110b, detector 120, a comparator 130 and a control system in the form of a programmable logic controller (PLC) 140. The first photosensitive device 110a receives light from the wafer 200, while the second photosensitive device 110b receives ambient light. The light received by the first photosensitive device 110a can be incident ambient light reflected off the surface of the wafer 200, refracted light radiating through the wafer 200, filtered light radiating through the wafer 200 or translucent light radiating through the wafer 200. It is further envisaged that the received light may be filtered through filters (not shown) before being received by the photosensitive devices 110a&b. The detector 120 then generates a wafer control signal associated with the color(s) of the light received from the wafer 200. The wafer control signal produced by the detector 120 is then compared by a comparator 130. Once the comparator 130 has compared the wafer control signal to the predetermined values, this indirectly indicates the level of processing of the wafer 200. The PLC 140 then controls the further processing of the wafer 200 according to the result of the comparison.
    • 在根据本发明的第一方面中,提供了一种感测系统100,其适于感测晶片200的处理阶段,所述感测系统100包括呈第一感光装置110a和第二感光体形式的接收装置110 设备110b,检测器120,比较器130和可编程逻辑控制器(PLC)140形式的控制系统。 第一感光装置110a接收来自晶片200的光,而第二感光装置110b接收环境光。 由第一感光装置110a接收的光可以是从晶片200的表面反射的入射环境光,通过晶片200辐射的折射光,通过晶片200辐射的滤波光或通过晶片200辐射的半透明光。 进一步设想,接收的光可以在被感光装置110a和b接收之前通过滤光器(未示出)过滤。 然后,检测器120产生与从晶片200接收的光的颜色相关联的晶片控制信号。 然后由比较器130比较由检测器120产生的晶片控制信号。 一旦比较器130将晶片控制信号与预定值进行比较,则间接地指示晶片200的处理水平。 然后,PLC 140根据比较的结果控制晶片200的进一步处理。