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1. 发明申请

US20170316301A1 MULTILAYER WIRING COUPLING DUAL INTERFACE CARD CARRIER-BAND MODULE 有权
公开(公告)号：US20170316301A1
公开(公告)日：2017-11-02
申请号：US15522161
申请日：2015-10-10
申请人： Caifeng LIU , BEIJING BASCH SMARTCARD CO., LTD.
发明人： Caifeng LIU , Qigang LVQIU , Danning WANG
IPC分类号： G06K19/077
CPC分类号： G06K19/07722 , G06K19/077 , G06K19/07754 , G06K19/07769 , G06K19/07773 , H01L23/498 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2924/00014 , H01L2924/00
摘要： A multilayer wiring coupling dual interface card carrier tape module is provided, including: a carrier tape base layer, an electrode diaphragm layer, a tuning capacitance layer, a radio-frequency identification coil layer, a bonding pad and a via hole. One surface of the carrier-band base layer is the front surface of the carrier-band module, and the other surface of the carrier-band base layer is the back surface of the carrier-band module. The electrode diaphragm layer and the tuning capacitance layer are located on the front surface of the carrier-band base layer, and the radio-frequency identification coil layer and the bonding pad are located on the back surface of the carrier-band base layer. The bonding pad is arranged according to a pin position of a chip. Hole metallization processing is conducted on the via hole for realizing an electrical connection between the electrode diaphragm layer and the bonding pad.

2. 发明授权

US09996790B2 Multilayer wiring coupling dual interface card carrier-band module 有权
公开(公告)号：US09996790B2
公开(公告)日：2018-06-12
申请号：US15522161
申请日：2015-10-10
申请人： BEIJING BASCH SMARTCARD CO., LTD. , Caifeng Liu
发明人： Caifeng Liu , Qigang Lvqiu , Danning Wang
IPC分类号： G06K19/06 , G06K19/077
CPC分类号： G06K19/07722 , G06K19/077 , G06K19/07754 , G06K19/07769 , G06K19/07773 , H01L23/498 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2924/00014 , H01L2924/00
摘要： A multilayer wiring coupling dual interface card carrier tape module is provided, including: a carrier tape base layer, an electrode diaphragm layer, a tuning capacitance layer, a radio-frequency identification coil layer, a bonding pad and a via hole. One surface of the carrier-band base layer is the front surface of the carrier-band module, and the other surface of the carrier-band base layer is the back surface of the carrier-band module. The electrode diaphragm layer and the tuning capacitance layer are located on the front surface of the carrier-band base layer, and the radio-frequency identification coil layer and the bonding pad are located on the back surface of the carrier-band base layer. The bonding pad is arranged according to a pin position of a chip. Hole metallization processing is conducted on the via hole for realizing an electrical connection between the electrode diaphragm layer and the bonding pad.

3. 发明授权

US09373071B2 Multilayer wiring type double-interface IC card antenna module 有权
标题翻译：多层接线型双接口IC卡天线模块
公开(公告)号：US09373071B2
公开(公告)日：2016-06-21
申请号：US14411514
申请日：2013-06-28
申请人： Beijing Basch Smartcard Co., Ltd. , Caifeng Liu , Qigang Lvqiu , Danning Wang
发明人： Caifeng Liu , Zhongyu Wang , Qigang Lvqiu , Danning Wang
IPC分类号： G06K19/06 , G06K19/077 , H05K1/03 , H05K1/16 , H05K3/46
CPC分类号： G06K19/07752 , G06K19/07722 , G06K19/07743 , G06K19/07747 , G06K19/07749 , G06K19/07754 , G06K19/07794 , H05K1/0326 , H05K1/0386 , H05K1/165 , H05K3/4685 , H05K2201/10098
摘要： A multilayer wiring type dual-interface IC card antenna module includes: an electrode diaphragm layer, including an antenna and an electrode diaphragm; a clamping base layer including eight first through hole points right below eight metal contacts on the electrode diaphragm; an RFID antenna layer including an RFID antenna, a connecting contact, a first chip attaching point and a second chip attaching point; an insulation layer including eight second through hole points located right below the eight first through hole points, a third through hole point located right below the connecting contact, a fourth through hole point located right below the first chip attaching point, and a fifth through hole point located right below the second chip attaching point; and a bridge layer connected with the second chip attaching point and the connecting contact in a bridging manner. The antenna module can achieve full-automatic production.
摘要翻译：多层布线型双接口IC卡天线模块包括：电极隔膜层，包括天线和电极隔膜; 夹持基层，其包括在电极隔膜上的八个金属触点下方的八个第一通孔点; 包括RFID天线，连接接点，第一芯片安装点和第二芯片安装点的RFID天线层; 绝缘层，包括位于八个第一通孔点正下方的八个第二通孔点，位于连接触点正下方的第三通孔点，位于第一芯片连接点正下方的第四通孔点和第五通孔点位于第二芯片连接点的正下方; 以及以桥接方式与第二芯片连接点和连接触点连接的桥接层。天线模块可实现全自动生产。

4. 发明申请

US20150161502A1 MULTILAYER WIRING TYPE DOUBLE-INTERFACE IC CARD ANTENNA MODULE 有权
标题翻译：多层接线型双接口IC卡天线模块
公开(公告)号：US20150161502A1
公开(公告)日：2015-06-11
申请号：US14411514
申请日：2013-06-28
申请人： Caifeng LIU , Qigang LVQIU , Danning WANG , Beijing Basch Smartcard Co., Ltd.
发明人： Caifeng Liu , Zhongyu Wang , Qigang Lvqiu , Danning Wang
IPC分类号： G06K19/077
CPC分类号： G06K19/07752 , G06K19/07722 , G06K19/07743 , G06K19/07747 , G06K19/07749 , G06K19/07754 , G06K19/07794 , H05K1/0326 , H05K1/0386 , H05K1/165 , H05K3/4685 , H05K2201/10098
摘要： Disclosed is a multilayer wiring type double-interface IC card antenna module, comprising: an electrode diaphragm layer (1), a clamping base layer (2), an RFID antenna layer (3), an insulation layer (4) and a bridge layer (5). The electrode diaphragm layer (1) comprises an antenna and an electrode diaphragm. The clamping base layer (2) is arranged below the electrode diaphragm layer (1), and comprises eight first through hole points (21) located right below eight metal contacts on the electrode diaphragm. The MID antenna layer (3) is arranged below the clamping base layer (2), and comprises an RFID antenna, a connecting contact, a first chip attaching point and a second chip attaching point, the connecting contact and the first chip attaching point being connected to two ends of the RFID antenna. The insulation layer (4) is arranged below the RFID antenna layer (3), and comprises eight second through hole points located right below the eight first through hole points, a third through hole point located right below the connecting contact, a forth through hole point located right below the first chip attaching point, and a fifth through hole point located right below the second chip attaching point. The bridge layer (5) is arranged below the insulation layer (4) and connected with the second chip attaching point and the connecting contact in a bridging manner. The antenna module can achieve full-automatic production.
摘要翻译：公开了一种多层布线型双接口IC卡天线模块，包括：电极隔膜层（1），夹持基层（2），RFID天线层（3），绝缘层（4）和桥接层（5）。电极隔膜层（1）包括天线和电极隔膜。夹持基层（2）布置在电极隔膜层（1）的下方，并且包括位于电极隔膜上的八个金属触点正下方的八个第一通孔点（21）。 MID天线层（3）布置在夹持基层（2）的下方，包括RFID天线，连接触点，第一芯片安装点和第二芯片安装点，连接触点和第一芯片连接点为连接到RFID天线的两端。绝缘层（4）布置在RFID天线层（3）的下方，并且包括位于八个第一通孔点正下方的八个第二通孔点，位于连接触点正下方的第三通孔点，第四通孔位于第一芯片连接点正下方，以及位于第二芯片连接点正下方的第五通孔点。桥接层（5）布置在绝缘层（4）的下方，并以桥接方式与第二芯片连接点和连接触点连接。天线模块可实现全自动生产。

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