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1. 发明授权

US09484329B2 Light emitter array layout for color mixing 有权
标题翻译：用于混色的发光二极管阵列布局
公开(公告)号：US09484329B2
公开(公告)日：2016-11-01
申请号：US12629735
申请日：2009-12-02
申请人： Antony P. van de Ven , Gerald Negley , Thomas Yuan , Bernd Keller , Theodore Lowes
发明人： Antony P. van de Ven , Gerald Negley , Thomas Yuan , Bernd Keller , Theodore Lowes
IPC分类号： H01L25/075 , H01L25/16 , H01L33/58
CPC分类号： H01L25/0753 , H01L25/167 , H01L33/58 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Solid state lighting components are disclosed having multiple discrete light sources whose light combines to provide the desired emission characteristics. One embodiment of an LED component according to the present invention comprises a rectangular submount. A first group of blue shifted yellow (BSY) LED chips, a second group of BSY LED chips and a group of red LED chips are mounted on the submount. A plurality of contacts is arranged along one of the edges of the submount and accessible from one side of the component for applying electrical signals to the groups of LED chips.
摘要翻译：公开了具有多个分立光源的固态照明组件，其光组合以提供期望的发射特性。根据本发明的LED部件的一个实施例包括矩形基座。第一组蓝移LED（BSY）LED芯片，第二组BSY LED芯片和一组红色LED芯片安装在底座上。多个触点沿着副安装座的边缘之一布置，并且可从组件的一侧接近以将电信号施加到LED芯片组。

2. 发明授权

US09431589B2 Textured encapsulant surface in LED packages 有权
公开(公告)号：US09431589B2
公开(公告)日：2016-08-30
申请号：US12002429
申请日：2007-12-14
申请人： Ban P. Loh , Chenhua You , Bernd Keller , Nathaniel O. Cannon , Mitch Jackson , Ernest W. Combs
发明人： Ban P. Loh , Chenhua You , Bernd Keller , Nathaniel O. Cannon , Mitch Jackson , Ernest W. Combs
IPC分类号： H01L33/54 , H01L25/075
CPC分类号： H01L33/54 , H01L25/0753 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： A packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. The textured encapsulant, which can be textured using an additive or subtractive process, is applied to the LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface helps to reduce total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output profile. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously.

3. 发明授权

US09159888B2 Wafer level phosphor coating method and devices fabricated utilizing method 有权
标题翻译：晶圆级荧光粉涂布方法及利用方法制造的器件
公开(公告)号：US09159888B2
公开(公告)日：2015-10-13
申请号：US11899790
申请日：2007-09-07
申请人： Ashay Chitnis , James Ibbetson , Bernd Keller , David T. Emerson , John Edmond , Michael J. Bergmann , Jasper S. Cabalu , Jeffrey C. Britt , Arpan Chakraborty , Eric Tarsa , Yankun Fu
发明人： Ashay Chitnis , James Ibbetson , Bernd Keller , David T. Emerson , John Edmond , Michael J. Bergmann , Jasper S. Cabalu , Jeffrey C. Britt , Arpan Chakraborty , Eric Tarsa , James Seruto , Yankun Fu
IPC分类号： H01L33/00 , H01L33/50 , H01L33/62 , H01L33/38 , H01L33/36 , H01L33/44 , H01L33/54
CPC分类号： H01L33/508 , H01L33/0095 , H01L33/36 , H01L33/387 , H01L33/44 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.
摘要翻译：制造发光二极管（LED）芯片的方法包括通常在衬底上提供多个LED。基座沉积在LED上，每个基座与其中一个LED电接触。在LED上形成涂层，其中涂层埋入至少一些基座。然后将涂层平坦化以暴露至少一些埋置的基座，同时在所述LED上留下至少一些所述涂层。然后可以例如通过引线接合露出的基座。本发明公开了用于制造LED芯片的类似方法，所述LED芯片具有倒装芯片接合在载体基板上并用于制造其它半导体器件的LED。还公开了使用所公开的方法制造的LED芯片晶片和LED芯片。

4. 发明授权

US08998444B2 Solid state lighting devices including light mixtures 有权
标题翻译：固体照明装置，包括轻质混合物
公开(公告)号：US08998444B2
公开(公告)日：2015-04-07
申请号：US12491654
申请日：2009-06-25
申请人： John Roberts , Gerald H. Negley , Antony P. van de Ven , Arpan Chakraborty , Bernd Keller , Ronan P. Le Toquin
发明人： John Roberts , Gerald H. Negley , Antony P. van de Ven , Arpan Chakraborty , Bernd Keller , Ronan P. Le Toquin
IPC分类号： F21V9/00 , F21K99/00 , F21S4/00 , F21Y101/02 , F21Y105/00 , H01L25/075 , H01L33/50 , F21Y103/00
CPC分类号： F21K9/00 , F21S4/20 , F21Y2103/10 , F21Y2105/10 , F21Y2105/12 , F21Y2115/10 , H01L25/0753 , H01L33/50 , H01L2924/0002 , Y10S362/80 , H01L2924/00
摘要： A solid state lighting apparatus includes a plurality of light emitting diodes (LEDs) including at least a first LED and a second LED. Chromaticities of the first and second LEDs are selected so that a combined light generated by a mixture of light from the pair of LEDs has about a target chromaticity. The first LED may include a first LED chip that emits light in the blue portion of the visible spectrum and a phosphor that emits red light in response to blue light emitted by the first LED chip. The second LED emits light having a color point that is above the planckian locus of a 1931 CIE Chromaticity diagram, and in particular may have a yellow green, greenish yellow or green hue.
摘要翻译：固态照明装置包括至少包括第一LED和第二LED的多个发光二极管（LED）。选择第一和第二LED的色度，使得由来自该对LED的光的混合产生的组合光具有约目标色度。第一LED可以包括发射可见光谱的蓝色部分中的光的第一LED芯片和响应于由第一LED芯片发射的蓝光发射红光的荧光体。第二个LED发出具有高于1931 CIE色度图的平底轨迹的色点的光，特别是可以具有黄绿色，绿黄色或绿色。

5. 发明授权

US08941134B2 Leadframe-based packages for solid state light emitting devices having heat dissipating regions in packaging 有权
标题翻译：用于在封装中具有散热区域的固态发光器件的基于引线框的封装
公开(公告)号：US08941134B2
公开(公告)日：2015-01-27
申请号：US13242103
申请日：2011-09-23
申请人： Ban P. Loh , Nicholas W. Medendorp, Jr. , Eric Tarsa , Bernd Keller
发明人： Ban P. Loh , Nicholas W. Medendorp, Jr. , Eric Tarsa , Bernd Keller
IPC分类号： H01L33/62 , H01L23/495 , H01L33/48 , H01L33/64 , H01L23/498 , H01L25/075
CPC分类号： H01L33/483 , H01L23/49861 , H01L24/73 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2924/01019 , H01L2924/01068 , H01L2924/01322 , H01L2924/3011 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness. The leadframe further includes an electrical lead extending laterally away from the second region, and the package further includes a thermoset package body on the leadframe and surrounding the first region. The thermoset package body may be on both the top and bottom surfaces of the second region. A leak barrier may be on the leadframe, and the package body may be on the leak barrier. Methods of forming modular packages including thermoset package bodies on leadframes are also disclosed.
摘要翻译：用于发光器件的模块化封装包括引线框架，其包括具有顶表面，底表面和第一厚度的第一区域和具有小于第一厚度的顶表面，底表面和第二厚度的第二区域。引线框还包括从第二区域横向延伸的电引线，并且封装件还包括在引线框上并围绕第一区域的热固性封装主体。热固性封装体可以在第二区域的顶表面和底表面上。泄漏屏障可以在引线框架上，并且封装主体可以在泄漏屏障上。还公开了在引线框架上形成包括热固性封装体的模块化封装的方法。

6. 发明授权

US08882284B2 LED lamp or bulb with remote phosphor and diffuser configuration with enhanced scattering properties 有权
标题翻译： LED灯或灯泡与远程荧光粉和扩散器配置具有增强的散射性能
公开(公告)号：US08882284B2
公开(公告)日：2014-11-11
申请号：US13018291
申请日：2011-01-31
申请人： Tao Tong , Ronan Le Toquin , Bernd Keller , Eric Tarsa , Mark Youmans , Theodore Lowes , Nicholas W. Medendorp, Jr. , Antony Van De Ven , Gerald Negley
发明人： Tao Tong , Ronan Le Toquin , Bernd Keller , Eric Tarsa , Mark Youmans , Theodore Lowes , Nicholas W. Medendorp, Jr. , Antony Van De Ven , Gerald Negley
IPC分类号： F21V9/16 , F21V5/00 , F21K99/00 , F21Y101/02 , F21V3/00 , F21V29/00 , F21V3/02 , F21V7/20
CPC分类号： F21V9/30 , F21K9/232 , F21K9/64 , F21V3/00 , F21V3/02 , F21V29/505 , F21V29/767 , F21V29/773 , F21Y2115/10
摘要： An LED lamp or bulb is disclosed that comprises a light source, a heat sink structure and an optical cavity. The optical cavity comprises a phosphor carrier having a conversions material and arranged over an opening to the cavity. The phosphor carrier comprises a thermally conductive transparent material and is thermally coupled to the heat sink structure. An LED based light source is mounted in the optical cavity remote to the phosphor carrier with light from the light source passing through the phosphor carrier. A diffuser dome is included that is mounted over the optical cavity, with light from the optical cavity passing through the diffuser dome. The properties of the diffuser, such as geometry, scattering properties of the scattering layer, surface roughness or smoothness, and spatial distribution of the scattering layer properties may be used to control various lamp properties such as color uniformity and light intensity distribution as a function of viewing angle.
摘要翻译：公开了一种LED灯或灯泡，其包括光源，散热结构和光学腔。光学腔包括具有转换材料的荧光体载体并且布置在通向空腔的开口上。荧光体载体包括导热透明材料并且热耦合到散热器结构。基于LED的光源通过来自光源的光穿过荧光体载体而安装在远离荧光体载体的光学腔中。包括安装在光学腔上的扩散器圆顶，来自光学腔的光通过扩散器圆顶。扩散器的性质，如几何形状，散射层的散射特性，表面粗糙度或平滑度以及散射层性质的空间分布可用于控制各种灯具性能，如颜色均匀性和光强度分布，作为可视角度。

7. 外观设计

USD700584S1 LED component 有权
标题翻译： LED组件
公开(公告)号：USD700584S1
公开(公告)日：2014-03-04
申请号：US29396759
申请日：2011-07-06
申请人： Chandan Bhat , Theodore Douglas Lowes , Bernd Keller
设计人： Chandan Bhat , Theodore Douglas Lowes , Bernd Keller

8. 发明申请

US20140009932A1 LIGHT EMITTING DIODE PRIMARY OPTIC FOR BEAM SHAPING 有权
标题翻译：光发射二极管主光学用于光束形状
公开(公告)号：US20140009932A1
公开(公告)日：2014-01-09
申请号：US13544662
申请日：2012-07-09
申请人： Eric Tarsa , Monica Hansen , Bernd Keller
发明人： Eric Tarsa , Monica Hansen , Bernd Keller
IPC分类号： F21V7/04 , F21V7/00
CPC分类号： H01L33/54 , F21K9/233 , F21S8/026 , F21V7/0008 , F21V7/005 , F21V13/04 , F21V29/74 , F21Y2115/10
摘要： LED components are described having primary optics provide improved LED component emission characteristics. Light fixtures are also described that utilize the LED components to provide improved light fixture emissions. One LED component according to the present invention comprises an LED chip emitting an LED chip emission pattern. A primary optic is included directly on the LED chip with LED light from the LED chip passing through the primary optic. The primary optic shapes the LED emission pattern into an LED component emission pattern with the LED component emission pattern being broader than the LED chip emission pattern.
摘要翻译：描述了具有主要光学器件的LED组件，提供了改进的LED组件发射特性。还描述了利用LED组件来提供改进的灯具排放物的灯具。根据本发明的一个LED组件包括发射LED芯片发射图案的LED芯片。主要光学元件直接包含在LED芯片上，LED芯片的LED光通过主光学元件。主要光学器件将LED发射图案形成LED组件发射图案，其中LED组件发射图案比LED芯片发射图案更宽。

9. 发明申请

US20130337232A1 METHOD FOR PRODUCING INTERIOR LINING PARTS IN A FOAMING TOOL 有权
标题翻译：用于在发泡工具中生产内部件的方法
公开(公告)号：US20130337232A1
公开(公告)日：2013-12-19
申请号：US13983954
申请日：2012-02-03
申请人： Axel Hauck , Bernd Keller
发明人： Axel Hauck , Bernd Keller
IPC分类号： B29C44/12
CPC分类号： B29C44/12 , B29C43/003 , B29C44/1252 , B29C44/1257 , B29C44/351 , B29K2075/00 , B29L2031/3041 , Y10T428/24496
摘要： The invention relates to a method for producing interior lining parts in a foaming tool, to an interior lining part produced accordingly, and to a foaming tool which can be used for production. The interior lining part has at least one molded skin, at least one foam layer and at least one carrier, the foam layer being located between the molded skin and the carrier. In order to produce an interior lining part according to the invention, the molded skin is introduced into a mold of a foaming tool. The foaming tool contains at least one separating edge. During back-foaming, the carrier is pressed against the molded skin at the position of the separating edge and connected to said molded skin such that a molded skin end can be severed manually, that is without the aid of tools, from the molded skin or is severed by the pressing step.
摘要翻译：本发明涉及一种用于在发泡工具中生产内衬部件的方法，相应地生产到内衬部件以及可用于生产的发泡工具。内部衬里部分具有至少一个成型皮肤，至少一个泡沫层和至少一个载体，泡沫层位于模制皮肤和载体之间。为了制造根据本发明的内衬部分，将模制的皮肤引入发泡工具的模具中。发泡工具包含至少一个分离边缘。在后发泡期间，载体在分离边缘的位置处被压靠在模制的皮肤上并连接到所述模制的皮肤，使得可以手动切割模制的皮肤端部，即不需要工具的模制皮肤端部，被按压步骤切断。

10. 发明申请

US20120280263A1 COMPOSITE HIGH REFLECTIVITY LAYER 有权
标题翻译：复合高反射层
公开(公告)号：US20120280263A1
公开(公告)日：2012-11-08
申请号：US13415626
申请日：2012-03-08
申请人： James Ibbetson , Ting Li , Bernd Keller
发明人： James Ibbetson , Ting Li , Bernd Keller
IPC分类号： H01L33/60 , H01L33/48
CPC分类号： H01L33/46 , G02B19/0028 , G02B19/0061 , H01L33/48 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014
摘要： A high efficiency light emitting diode with a composite high reflectivity layer integral to said LED or package to improve emission efficiency. One embodiment of a light emitting diode (LED) chip comprises a LED and a composite high reflectivity layer integral to the LED to reflect light emitted from the active region. One embodiment of a LED package comprises a LED mounted on a substrate with an encapsulant over said LED and a composite high reflectivity layer arranged to reflect emitted light. The composite layer comprises a plurality of layers such that at least one of said plurality of layers has an index of refraction lower than the encapsulant and a reflective layer on a side of said plurality of layers opposite the LED. In some embodiments, conductive vias are included through the composite layer to allow an electrical signal to pass through the layer to the LED.
摘要翻译：一种具有与所述LED或封装集成的复合高反射层的高效率发光二极管，以提高发射效率。发光二极管（LED）芯片的一个实施例包括LED和与LED成一体的复合高反射率层以反射从有源区域发射的光。 LED封装的一个实施例包括安装在具有在所述LED上的密封剂的衬底上的LED和布置成反射发射光的复合高反射率层。复合层包括多个层，使得所述多个层中的至少一个层具有低于密封剂的折射率和在与LED相对的所述多个层的一侧上的反射层。在一些实施例中，通过复合层包括导电通孔，以允许电信号通过该层到达LED。

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