专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20080137317A1 METHOD AND SYSTEM FOR ANGLED RF CONNECTION USING A FLEXIBLE SUBSTRATE 有权
标题翻译：使用柔性基板进行射频连接的方法和系统
公开(公告)号：US20080137317A1
公开(公告)日：2008-06-12
申请号：US11609806
申请日：2006-12-12
申请人： Robert T. Worl , Bruce L. Blaser , Peter T. Heisen , Julio A. Navarro , Douglas A. Pietila , Scott A. Raby , Jimmy S. Takeuchi
发明人： Robert T. Worl , Bruce L. Blaser , Peter T. Heisen , Julio A. Navarro , Douglas A. Pietila , Scott A. Raby , Jimmy S. Takeuchi
IPC分类号： H05K1/00 , H01R9/00
CPC分类号： H05K1/118 , H01L2924/19107 , H01R12/52 , H01R12/62 , H05K1/0237 , H05K3/361 , H05K3/4691 , H05K2201/09081 , H05K2201/09109 , H05K2201/09318 , H05K2203/049
摘要： A method and structure for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a bonding pad on the flexible substrate is in a similar plane as a bonding pad on the second element; and creating the angled RF connection by wire bonding the bonding pad on the flexible substrate and the bonding pad on the second element. The structure includes a flexible substrate that is laminated onto a first element as an outer layer, flexible substrate having at least one bonding pad, and the flexible substrate able to bend in an angle that places the bonding pad in a same plane as a bonding pad on a second element.
摘要翻译：提供了一种使用柔性基板在第一元件和第二元件之间产生成角度的RF连接的方法和结构。该方法包括将柔性基板层压到第一元件上; 弯曲柔性基板，使得柔性基板上的接合焊盘处于与第二元件上的接合焊盘相似的平面中; 以及通过将所述接合焊盘引导到所述柔性基板上的所述接合焊盘和所述第二元件上的所述接合焊盘来产生所述成角度的RF连接该结构包括层压到作为外层的第一元件上的柔性基板，具有至少一个接合焊盘的柔性基板，以及能够以与焊盘相同的平面将接合焊盘放置在一起的角度弯曲的柔性基板在第二个元素上。

2. 发明授权

US08390526B1 Wide scan phased array antenna element 有权
标题翻译：宽扫描相控阵天线元件
公开(公告)号：US08390526B1
公开(公告)日：2013-03-05
申请号：US12873831
申请日：2010-09-01
申请人： John B. O'Connell , Bruce L. Blaser
发明人： John B. O'Connell , Bruce L. Blaser
IPC分类号： H01Q9/04
CPC分类号： H01Q9/18 , H01Q3/2617
摘要： Antenna elements operable to radiate different patterns are provided. A particular apparatus includes a first antenna element having a plurality of radiating elements. Each of the radiating elements includes a first member having a first end and a second end. The first end is coupled to an antenna interface and the second end extends a length of the first member from the first end. Each of the radiating elements further includes a second member having a third end and a fourth end. The third end is electrically coupled to the first member at a point partway along the length of the first member. The fourth end extends away from the first member. When a first radiating element is radiating in the presence of a second radiating element, a null is generated in a radiation pattern of the first radiating element.
摘要翻译：提供可操作以辐射不同图案的天线元件。特定装置包括具有多个辐射元件的第一天线元件。每个辐射元件包括具有第一端和第二端的第一构件。第一端耦合到天线接口，第二端从第一端延伸第一构件的长度。每个辐射元件还包括具有第三端和第四端的第二构件。第三端沿着第一构件的长度在中途的一点电耦合到第一构件。第四端延伸离开第一个构件。当第一辐射元件在第二辐射元件的存在下发射时，在第一辐射元件的辐射图中产生零点。

3. 发明授权

US07312751B1 Phased array antenna system to achieve suppression of undesired signal components 有权
标题翻译：相控阵天线系统可实现抑制不需要的信号分量
公开(公告)号：US07312751B1
公开(公告)日：2007-12-25
申请号：US11554357
申请日：2006-10-30
申请人： Kenneth G. Voyce , Bruce L. Blaser , Paul R. Norris
发明人： Kenneth G. Voyce , Bruce L. Blaser , Paul R. Norris
IPC分类号： G01S3/16
CPC分类号： H01Q3/26 , H01Q1/52 , H01Q1/526 , H01Q3/30
摘要： Various techniques are disclosed to suppress undesired signal components introduced by non-linear amplifiers of phased array antenna systems to accommodate bandwidths greater than one octave. For example, in accordance with one embodiment, a phased array antenna system includes first and second antenna elements adapted to provide first and second received signals in response to a radio signal. The second antenna element is rotated approximately 180 degrees in relation to the first antenna element. Amplifiers may amplify the received signals to provide amplified signals having a bandwidth greater than one octave. Undesired components of the amplified signals introduced by the amplifiers may be suppressed through appropriate phase shifts performed by associated phase shifters and/or power combiners. A power combiner may combine the first and second output signals to provide a combined signal, wherein the first and second undesired components are suppressed in the combined signal relative to the amplified signals.
摘要翻译：公开了各种技术来抑制由相控阵天线系统的非线性放大器引入的不需要的信号分量，以适应大于一个八度的带宽。例如，根据一个实施例，相控阵天线系统包括适于响应于无线电信号提供第一和第二接收信号的第一和第二天线元件。第二天线元件相对于第一天线元件旋转大约180度。放大器可以放大接收的信号以提供具有大于一个八度的带宽的放大信号。可以通过由相关联的移相器和/或功率组合器执行的适当的相移来抑制由放大器引入的放大信号的不期望的分量。功率组合器可以组合第一和第二输出信号以提供组合信号，其中第一和第二不期望分量相对于放大信号被抑制在组合信号中。

4. 发明授权

US08179204B2 Bandgap impedance surface of polar configuration usable in a waveguide transition module 有权
标题翻译：极性配置的带隙阻抗表面可用于波导过渡模块
公开(公告)号：US08179204B2
公开(公告)日：2012-05-15
申请号：US12228380
申请日：2008-08-11
申请人： John B. O'Connell , Bruce L. Blaser
发明人： John B. O'Connell , Bruce L. Blaser
IPC分类号： H01P5/103
CPC分类号： H01P5/103 , H01P1/2005 , H05K1/0236 , H05K2201/09309 , H05K2201/09663 , Y10T29/49016
摘要： A bandgap surface for use in a waveguide transition module. The surface may be constructed with a ground plane; a capacitive layer including a plurality of capacitive elements arranged in a polar configuration within a common plane, and spaced apart from said ground plane; and a plurality of electrically conductive vias formed within a dielectric layer of material that conductively couple said ground plane to each of said capacitive elements.
摘要翻译：用于波导过渡模块的带隙表面。表面可以用地平面构成; 电容层，包括以公共平面内的极性配置布置并与所述接地平面间隔开的多个电容元件; 以及形成在材料的电介质层内的多个导电通孔，其导电地将所述接地平面耦合到每个所述电容元件。

5. 发明申请

US20100033272A1 Apparatus and method for forming a bandgap surface and waveguide transition modules incorporating a bandgap surface 有权
标题翻译：用于形成带隙表面的装置和方法以及包含带隙表面的波导过渡模块
公开(公告)号：US20100033272A1
公开(公告)日：2010-02-11
申请号：US12228380
申请日：2008-08-11
申请人： John B. O'Connell , Bruce L. Blaser
发明人： John B. O'Connell , Bruce L. Blaser
IPC分类号： H01P1/16 , H01P11/00
CPC分类号： H01P5/103 , H01P1/2005 , H05K1/0236 , H05K2201/09309 , H05K2201/09663 , Y10T29/49016
摘要： A bandgap surface for use in a waveguide transition module. The surface may be constructed with a ground plane; a capacitive layer including a plurality of capacitive elements arranged in a polar configuration within a common plane, and spaced apart from said ground plane; and a plurality of electrically conductive vias formed within a dielectric layer of material that conductively couple said ground plane to each of said capacitive elements.
摘要翻译：用于波导过渡模块的带隙表面。表面可以用地平面构成; 电容层，包括以公共平面内的极性配置布置并与所述接地平面间隔开的多个电容元件; 以及形成在材料的电介质层内的多个导电通孔，其导电地将所述接地平面耦合到每个所述电容元件。

6. 发明授权

US07388756B1 Method and system for angled RF connection using a flexible substrate 有权
标题翻译：使用柔性基板进行角度射频连接的方法和系统
公开(公告)号：US07388756B1
公开(公告)日：2008-06-17
申请号：US11609806
申请日：2006-12-12
申请人： Robert T. Worl , Bruce L. Blaser , Peter T. Heisen , Julio A. Navarro , Douglas A. Pietila , Scott A. Raby , Jimmy S. Takeuchi
发明人： Robert T. Worl , Bruce L. Blaser , Peter T. Heisen , Julio A. Navarro , Douglas A. Pietila , Scott A. Raby , Jimmy S. Takeuchi
IPC分类号： H05K7/00
CPC分类号： H05K1/118 , H01L2924/19107 , H01R12/52 , H01R12/62 , H05K1/0237 , H05K3/361 , H05K3/4691 , H05K2201/09081 , H05K2201/09109 , H05K2201/09318 , H05K2203/049
摘要： A method and structure for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a bonding pad on the flexible substrate is in a similar plane as a bonding pad on the second element; and creating the angled RF connection by wire bonding the bonding pad on the flexible substrate and the bonding pad on the second element. The structure includes a flexible substrate that is laminated onto a first element as an outer layer, flexible substrate having at least one bonding pad, and the flexible substrate able to bend in an angle that places the bonding pad in a same plane as a bonding pad on a second element.
摘要翻译：提供了一种使用柔性基板在第一元件和第二元件之间产生成角度的RF连接的方法和结构。该方法包括将柔性基板层压到第一元件上; 弯曲柔性基板，使得柔性基板上的接合焊盘处于与第二元件上的接合焊盘相似的平面中; 以及通过将所述接合焊盘引导到所述柔性基板上的所述接合焊盘和所述第二元件上的所述接合焊盘来产生所述成角度的RF连接该结构包括层压到作为外层的第一元件上的柔性基板，具有至少一个接合焊盘的柔性基板，以及能够以与焊盘相同的平面将接合焊盘放置在一起的角度弯曲的柔性基板在第二个元素上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式