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    • 1. 发明授权
    • Isolation structures for preventing photons and carriers from reaching active areas and methods of formation
    • 用于防止光子和载体到达有源区域的隔离结构和形成方法
    • US08071455B2
    • 2011-12-06
    • US12424336
    • 2009-04-15
    • Bryan G. ColeTroy Sorensen
    • Bryan G. ColeTroy Sorensen
    • H01L21/225H01L21/385
    • H01L27/1463H01L31/103
    • Regions of an integrated circuit are isolated by a structure that includes at least one isolating trench on the periphery of an active area. The trench is deep, extending at least about 0.5 μm into the substrate. The isolating structure prevents photons and electrons originating in peripheral circuitry from reaching the active area. Where the substrate has a heavily-doped lower layer and an upper layer on it, the trench can extend through the upper layer to the lower layer. A thermal oxide can be grown on the trench walls. A liner can also be deposited on the sidewalls of each trench. A fill material having a high-extinction coefficient is then deposited over the liner. The liner can also be light absorbent so that both the liner and fill material block photons.
    • 集成电路的区域由在有源区域的外围包括至少一个隔离沟槽的结构隔离。 沟槽深,至少延伸约0.5微米到衬底。 隔离结构防止源自外围电路的光子和电子到达有源区。 当衬底在其上具有重掺杂的下层和上层时,沟槽可以延伸通过上层到下层。 热氧化物可以在沟槽壁上生长。 衬垫也可以沉积在每个沟槽的侧壁上。 然后将具有高消光系数的填充材料沉积在衬垫上。 衬里也可以是轻的吸收剂,以便衬垫和填充材料阻挡光子。
    • 3. 发明申请
    • ISOLATION STRUCTURES FOR PREVENTING PHOTONS AND CARRIERS FROM REACHING ACTIVE AREAS AND METHODS OF FORMATION
    • 用于防止光子和载体从达到活跃区域分离的结构和形成方法
    • US20090243021A1
    • 2009-10-01
    • US12424336
    • 2009-04-15
    • Bryan G. ColeTroy Sorensen
    • Bryan G. ColeTroy Sorensen
    • H01L31/02
    • H01L27/1463H01L31/103
    • Regions of an integrated circuit are isolated by a structure that includes at least one isolating trench on the periphery of an active area. The trench is deep, extending at least about 0.5 μm into the substrate. The isolating structure prevents photons and electrons originating in peripheral circuitry from reaching the active area. Where the substrate has a heavily-doped lower layer and an upper layer on it, the trench can extend through the upper layer to the lower layer. A thermal oxide can be grown on the trench walls. A liner can also be deposited on the sidewalls of each trench. A fill material having a high-extinction coefficient is then deposited over the liner. The liner can also be light absorbent so that both the liner and fill material block photons.
    • 集成电路的区域由在有源区域的外围包括至少一个隔离沟槽的结构隔离。 沟槽是深的,延伸至少约0.5μm的衬底。 隔离结构防止源自外围电路的光子和电子到达有源区。 当衬底在其上具有重掺杂的下层和上层时,沟槽可以延伸通过上层到下层。 热氧化物可以在沟槽壁上生长。 衬垫也可以沉积在每个沟槽的侧壁上。 然后将具有高消光系数的填充材料沉积在衬垫上。 衬里也可以是轻的吸收剂,以便衬垫和填充材料阻挡光子。
    • 4. 发明授权
    • Reduced imager crosstalk and pixel noise using extended buried contacts
    • 使用扩展掩埋触点降低成像器串扰和像素噪声
    • US07534982B2
    • 2009-05-19
    • US11148554
    • 2005-06-09
    • Bryan G. Cole
    • Bryan G. Cole
    • H01L27/00
    • H01L27/14621
    • Methods and structures to reduce the occurrence of crosstalk and pixel noise in solid state imager arrays. In an exemplary embodiment, a section of a layer patterned to form polysilicon buried-contacts in the pixel structure is also patterned to be disposed over the active, photosensor portion of the pixel. The section of the buried-contact layer covering the photosensor portion of the pixel serves to filter the light striking the buried-contact layer before the light strikes the photosensor. The polysilicon light filter reduces the amount of stray light entering from the adjacent pixels without adding significant processing complexity.
    • 减少固态成像器阵列串扰和像素噪声发生的方法和结构。 在示例性实施例中,图案化以在像素结构中形成多晶硅掩埋接触的层的部分也被图案化以设置在像素的有源光电传感器部分上方。 覆盖像素的光电传感器部分的掩埋接触层的部分用于在光照射光传感器之前过滤入射接触层的光。 多晶硅光滤波器减少了从相邻像素进入的杂散光量,而不增加显着的处理复杂度。
    • 9. 发明授权
    • Isolation structures for preventing photons and carriers from reaching active areas and methods of formation
    • 用于防止光子和载体到达有源区域的隔离结构和形成方法
    • US07534691B2
    • 2009-05-19
    • US11495547
    • 2006-07-31
    • Bryan G. ColeTroy Sorensen
    • Bryan G. ColeTroy Sorensen
    • H01L21/225H01L21/385H01L31/118
    • H01L27/1463H01L31/103
    • Regions of an integrated circuit are isolated by a structure that includes at least one isolating trench on the periphery of an active area. The trench is deep, extending at least about 0.5 μm into the substrate. The isolating structure prevents photons and electrons originating in peripheral circuitry from reaching the active area. Where the substrate has a heavily-doped lower layer and an upper layer on it, the trench can extend through the upper layer to the lower layer. A thermal oxide can be grown on the trench walls. A liner can also be deposited on the sidewalls of each trench. A fill material having a high-extinction coefficient is then deposited over the liner. The liner can also be light absorbent so that both the liner and fill material block photons.
    • 集成电路的区域由在有源区域的外围包括至少一个隔离沟槽的结构隔离。 沟槽是深的,延伸至少约0.5μm的衬底。 隔离结构防止源自外围电路的光子和电子到达有源区。 当衬底在其上具有重掺杂的下层和上层时,沟槽可以延伸通过上层到下层。 热氧化物可以在沟槽壁上生长。 衬垫也可以沉积在每个沟槽的侧壁上。 然后将具有高消光系数的填充材料沉积在衬垫上。 衬里也可以是轻的吸收剂,以便衬垫和填充材料阻挡光子。