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    • 8. 发明授权
    • Curable resin composition and short-cure method
    • 可固化树脂组合物和短固化方法
    • US09039951B2
    • 2015-05-26
    • US13776754
    • 2013-02-26
    • Cytec Technology Corp.
    • Jonathan E. Meegan
    • B29C45/02B29C45/14C08G65/22D06M17/04C08G85/00C08G59/50C08G59/56C08G59/38C08L63/00B32B27/04B32B27/26B32B27/38
    • C08K7/06B29C70/48B29K2063/00B29K2105/0809C08G59/00C08G59/38C08G59/50C08G59/5026C08G59/504C08G59/56C08G65/22C08G85/00C08J3/243C08J3/244C08J2363/00C08L63/00D06M17/04Y10T428/24994Y10T428/31511
    • Disclosed herein is a method for utilizing the exothermic energy generated by a low temperature cure reaction to access a high-temperature cure reaction, which is otherwise energetically inaccessible at a chosen tool temperature, thereby producing a cured resin matrix with properties closely matching to those produced via high-temperature cure reactions but achieved via a short cure time and low cure temperature. Also disclosed is a short-cure resin composition containing: (a) at least one multifunctional epoxy resin having an epoxy functionality of greater than 1; (b) a hardener composition containing (i) at least one aliphatic or cycloaliphatic amine curing agent having one or more amino groups per molecule; (ii) at least one aromatic amine curing agent having one or more amino groups per molecule; and optionally, (iii) an imidazole as curing accelerator. The improved properties of this resin composition include being curable at a temperature of ≦120° C. for a time period of less than 10 minutes to achieve a degree of cure higher than that derived from the same composition with just (i) aliphatic/cycloaliphatic amine or (ii) aromatic amine in isolation.
    • 本文公开了一种利用由低温固化反应产生的放热能进行高温固化反应的方法,否则在所选择的工具温度下能够达到高能量固化反应,从而产生固化的树脂基质,其特性与所生产的 通过高温固化反应,但通过短的固化时间和低固化温度实现。 还公开了一种短固化树脂组合物,其包含:(a)至少一种环氧官能度大于1的多官能环氧树脂; (b)一种硬化剂组合物,其包含(i)至少一种每分子具有一个或多个氨基的脂族或脂环族胺固化剂; (ii)每分子具有一个或多个氨基的至少一种芳族胺固化剂; 和(iii)咪唑作为固化促进剂。 该树脂组合物的改进的性质包括在<120℃的温度下可固化的时间小于10分钟,以达到比由相同组成衍生的固化程度更高的刚性(i)脂族/ 脂环族胺或(ii)芳族胺。
    • 9. 发明申请
    • STRUCTURAL ADHESIVE AND BONDING APPLICATION THEREOF
    • 结构粘合和粘结应用
    • US20150030844A1
    • 2015-01-29
    • US14512642
    • 2014-10-13
    • CYTEC TECHNOLOGY CORP.
    • Junjie Jeffrey SangDalip Kumar KohliKunal Gaurang Shah
    • C09J163/00B32B27/38B32B27/18B32B7/12
    • C09J163/00B32B7/12B32B27/18B32B27/38B32B2250/03B32B2264/0207B32B2270/00B32B2405/00C08G59/4253C08G59/50C08G59/5026C08G59/5073C08K3/36C08L63/00C08L81/06Y10T428/24995Y10T428/249951Y10T428/249952Y10T428/254Y10T428/31515Y10T428/31522C08L51/04C08L101/00
    • A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional, trifunctional, and tetrafunctional epoxy resins, certain toughening components, and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core-shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler as a rheology/thixotropy modifying component. The weight ratio of part (A) to part (B) is within the range of 3:2 to 10:2. In another embodiment, the structural adhesive composition is based on a one-part system which includes the components of the resinous part (A) in the two-part system mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine. The one-part system is curable within the temperature range of 140-300° F. (60-150° C.). The paste adhesive disclosed herein has film-like properties and is particularly useful in rapid-assembly aerospace structure bonding applications.
    • 适用于金属和航空航天结构材料的高强度粘合的结构粘合剂组合物。 在一个实施方案中,基于两部分系统的结构粘合剂组合物,其可在等于或低于200°F(93℃)下固化。 两部分系统由树脂部分(A)和催化剂部分(B)组成,可以在室温下分开储存,直到准备使用。 树脂部分(A)包括至少两种具有不同官能度的功能性多官能环氧树脂,其中二官能,三官能和四官能环氧树脂,某些增韧组分和无机填料颗粒作为流变学/触变性改良组分。 增韧组分包括具有不同粒度的核 - 壳橡胶颗粒和弹性体聚合物和聚醚砜聚合物中的至少一种。 催化剂部分(B)包括作为固化剂的脂族或环状胺化合物和作为流变/触变性改性成分的无机填料。 部分(A)与部分(B)的重量比在3:2至10:2的范围内。 在另一个实施方案中,结构粘合剂组合物基于一部分系统,其包括与潜伏胺固化剂混合的两部分体系中的树脂部分(A)的组分。 单组分体系可以进一步包括咪唑和/或脂族胺。 单组分体系可在140-300°F(60-150°C)的温度范围内固化。 本文公开的糊状粘合剂具有膜状特性,并且在快速组装航空航天结构粘合应用中特别有用。