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1. 发明申请

US20060063283A1 Stacked die module and techniques for forming a stacked die module 有权
标题翻译：堆叠模具模块和用于形成堆叠模具模块的技术
公开(公告)号：US20060063283A1
公开(公告)日：2006-03-23
申请号：US11266972
申请日：2005-11-04
申请人： Chad Cobbley , Timothy Jackson
发明人： Chad Cobbley , Timothy Jackson
IPC分类号： H01L21/66
CPC分类号： H01L25/50 , H01L22/20 , H01L23/481 , H01L24/48 , H01L25/0657 , H01L2224/05599 , H01L2224/16 , H01L2224/32145 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2225/0651 , H01L2225/06541 , H01L2225/06555 , H01L2225/06562 , H01L2225/06579 , H01L2225/06596 , H01L2924/00014 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , Y10T156/10 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： Embodiments of the present technique relate to forming die stacks. Specifically, embodiments of the present technique include a method of forming and testing semiconductor die comprising forming a die stack of at least two semiconductor die without attaching either of the at least two semiconductor die to a substrate. Further, present embodiments include testing the semiconductor die in the die stack after the die stack is formed and prior to attaching either of the at least two semiconductor die to the substrate.
摘要翻译：本技术的实施例涉及形成管芯堆叠。具体地，本技术的实施例包括形成和测试半导体管芯的方法，其包括在不将至少两个半导体管芯中的任一个连接到衬底上的情况下形成至少两个半导体管芯的管芯堆叠。此外，本实施例包括在形成管芯堆叠之后并且在将至少两个半导体管芯中的任一个连接到衬底之前，在管芯堆叠中测试半导体管芯。

2. 发明申请

US20050191787A1 Methods of fabrication of package assemblies for optically interactive electronic devices 有权
标题翻译：用于光学交互式电子设备的封装组件的制造方法
公开(公告)号：US20050191787A1
公开(公告)日：2005-09-01
申请号：US11118498
申请日：2005-04-29
申请人： Todd Bolken , Chad Cobbley
发明人： Todd Bolken , Chad Cobbley
IPC分类号： H01L21/50 , H01L23/31 , H01L31/0203 , H01L31/00
CPC分类号： H01L23/00 , B33Y80/00 , H01L21/50 , H01L23/02 , H01L23/3128 , H01L24/97 , H01L27/14618 , H01L27/14632 , H01L27/14636 , H01L27/14687 , H01L31/0203 , H01L2224/05573 , H01L2224/13025 , H01L2224/16235 , H01L2224/48091 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/16195 , H01L2924/16235 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/05599
摘要： Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a first embodiment, a transparent cover is attached to a wafer of semiconductor material containing a plurality of optically interactive devices. The wafer is singulated, and the optically interactive devices are mounted on an interposer and electrically connected with wire bonds. In a second embodiment, the optically interactive devices are electrically connected to the interposer with backside conductive elements. In a third embodiment, the optically interactive devices are mounted to the interposer prior to attaching a transparent cover. A layer of encapsulant material is formed over the interposer, and the interposer and encapsulant material are cut to provide individual packaging assemblies. In a fourth embodiment, the optically interactive devices are mounted in a preformed leadless chip carrier.
摘要翻译：用于光学交互式装置的包装组件和以有效方式形成包装组件的方法，其消除或减少工艺污染物的发生。在第一实施例中，透明盖附着到包含多个光学交互装置的半导体材料的晶片上。晶片被分离，并且光学交互设备安装在插入器上并与引线键合电连接。在第二实施例中，光学交互式设备与背面导电元件电连接到插入器。在第三实施例中，在附加透明盖之前，将光学交互式装置安装到插入器。在该插入件上方形成一层密封材料，并且切断插入物和密封剂材料以提供单独的包装组件。在第四实施例中，光学交互式装置安装在预先形成的无引线芯片载体中。

3. 发明申请

US20050116355A1 Packages for image sensitive electronic devices 审中-公开
标题翻译：图像敏感电子设备的包装
公开(公告)号：US20050116355A1
公开(公告)日：2005-06-02
申请号：US11002945
申请日：2004-12-02
申请人： Todd Bolken , Chad Cobbley
发明人： Todd Bolken , Chad Cobbley
IPC分类号： H01L21/44 , H01L21/48 , H01L23/02 , H01L23/48 , H01L27/146
CPC分类号： H01L27/14618 , B33Y80/00 , H01L23/293 , H01L23/3128 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L27/14603 , H01L27/14625 , H01L27/14683 , H01L31/0203 , H01L2224/05599 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/484 , H01L2224/73265 , H01L2224/85399 , H01L2224/8592 , H01L2224/92 , H01L2224/92247 , H01L2225/06506 , H01L2225/06555 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/014 , H01L2924/15174 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/1815 , Y10S257/924 , H01L2224/45099 , H01L2924/00012 , H01L2924/00 , H01L2924/00011
摘要： The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections such as wire bonds and bond pads, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, chip encapsulation is accomplished with a unitary shell of entirely transparent material. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment. The transfer mold is then filled with molding compound to encapsulate the chip and interconnections, and to retain the transparent lid.
摘要翻译：本发明提供了用于轻或其它辐射敏感的电子设备的封装方法，例如包括CCD或CMOS芯片的图像传感器。在本发明的一个实施例中，图像传感器封装通过围绕具有转移模具化合物的屏障的芯片组装并用透明盖覆盖芯片来组装。在本发明的另一个实施例中，芯片的周边区域（包括诸如引线接合和接合焊盘的互连）用液体分配的环氧树脂封装，并且附着有透明盖。在本发明的另一个实施例中，芯片封装通过完全透明材料的整体外壳完成。在本发明的另一个实施例中，将衬底安装的芯片和透明盖子装载到转移模具中，以使它们保持最佳对准。然后将转移模具填充模塑料以封装芯片和互连，并保持透明盖。

4. 发明授权

US06269742B1 Method and stencil for extruding material on a substrate 有权
标题翻译：在基材上挤出材料的方法和模版
公开(公告)号：US06269742B1
公开(公告)日：2001-08-07
申请号：US09572738
申请日：2000-05-17
申请人： Chad Cobbley , Ford B. Grigg
发明人： Chad Cobbley , Ford B. Grigg
IPC分类号： B41N124
CPC分类号： B41F15/0818 , B41M1/12 , B41N1/24 , B41N1/248 , H01L24/11 , H01L24/81 , H01L2224/1132 , H01L2224/13099 , H01L2224/16 , H01L2224/81801 , H01L2924/00014 , H01L2924/01033 , H01L2924/01087 , H01L2924/014 , H01L2924/14 , H05K3/1225 , H05K3/321 , H05K3/3436 , H05K3/3484 , H05K2201/10719 , H01L2224/0401
摘要： A stencil for use in fabricating semiconductor devices is disclosed that has an aperture having a first portion extending from a first side thereof and a second portion extending from a second side thereof to minimize the shear stress between the material extruded therethrough and the stencil. The stencil allows for material to be extruded through the top of the stencil to the surface of the substrate and not contact the wall of the second portion of the aperture of the stencil. Since the material only contacts a small area of the first portion of the aperture near the top of the stencil, the material remains on the substrate and not in the aperture of the stencil.
摘要翻译：公开了一种用于制造半导体器件的模板，其具有孔，其具有从其第一侧延伸的第一部分和从其第二侧延伸的第二部分，以最小化穿过其中挤出的材料与模板之间的剪切应力。模板允许材料通过模版的顶部挤出到基底的表面，并且不接触模板的孔的第二部分的壁。由于该材料仅接触靠近模板顶部的孔的第一部分的小区域，所以材料保留在基板上而不留在模板的孔中。

5. 发明授权

US08189420B2 Advanced detection of memory device removal, and methods, devices and connectors 有权
标题翻译：高级检测存储器件拆卸，以及方法，设备和连接器
公开(公告)号：US08189420B2
公开(公告)日：2012-05-29
申请号：US12478422
申请日：2009-06-04
申请人： James Cooke , Peter Feeley , Victor Tsai , William H. Radke , Neal Galbo , Chad Cobbley
发明人： James Cooke , Peter Feeley , Victor Tsai , William H. Radke , Neal Galbo , Chad Cobbley
IPC分类号： G11C5/14
CPC分类号： G06F13/4068
摘要： Memory devices, connectors and methods for terminating an operation are provided, including a memory device configured to terminate an internal operation such as a programming or erase operation responsive to receiving a signal during removal of the memory device from a connector, such as a socket. The memory device may be specially configured to generate the removal signal, such as by including a dedicated removal terminal. The memory card may respond to the signal by terminating a programming or erase operation before power is lost. The removal terminal may have a dimension that is different from a dimension of a power terminal through which the memory device receives power. Alternatively, the connector may be specially configured to generate a signal that causes a host to terminate programming or erase operations in the memory device prior to memory card removal, such as by including a switch that is actuated when the memory device moves to a pre-power loss position.
摘要翻译：提供了用于终止操作的存储器件，连接器和方法，包括响应于在从诸如插座的连接器移除存储器设备期间接收信号而终止诸如编程或擦除操作之类的内部操作的存储器件。存储器件可以被特别地配置为产生去除信号，例如通过包括专用的移除终端。存储卡可以通过在断电之前终止编程或擦除操作来响应信号。移除终端可以具有不同于存储设备通过其接收电力的功率端子的尺寸的尺寸。或者，连接器可以被特别地配置成产生一个信号，使得主机在存储卡移除之前终止在存储器设备中的编程或擦除操作，例如通过包括当存储器件移动到预定位置时被致动的开关，断电位置

6. 发明申请

US20070063335A1 Packaged microelectronic devices with interconnecting units and methods for manufacturing and using the interconnecting units 有权
标题翻译：具有互连单元的封装微电子器件以及用于制造和使用互连单元的方法
公开(公告)号：US20070063335A1
公开(公告)日：2007-03-22
申请号：US11516455
申请日：2006-09-05
申请人： Chad Cobbley
发明人： Chad Cobbley
IPC分类号： H01L23/48
CPC分类号： H01L23/3121 , H01L21/565 , H01L23/13 , H01L23/4985 , H01L24/48 , H01L24/83 , H01L2224/4824 , H01L2224/83 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , Y10T29/49146 , Y10T29/49171 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged microelectronic device assembly includes a microelectronic die, a substrate attached to the die, a protective casing covering a portion of the substrate, and a barrier projecting away from the surface of the substrate. The microelectronic die can have an integrated circuit and a plurality of bond-pads operatively coupled to the integrated circuit. The substrate can have a cap-zone defined by an area that is to be covered by the protective casing, a plurality of contact elements arranged in the cap-zone, a plurality of ball-pads arranged in a ball-pad array outside of the cap-zone, and a plurality of conductive lines coupling the contact elements to the ball-pads. The contact elements are electrically coupled to corresponding bond-pads on the microelectronic die, and the protective casing covers the cap-zone. The barrier on the surface of the substrate is configured so that at least a portion of the barrier is outside of the cap-zone and adjacent to at least a portion of the molded section. The barrier is a seal that inhibits the thermosetting material of the protective casing from covering a portion of the substrate outside of the cap-zone. As such, the barrier prevents thermosetting material from leaking between the substrate and a mold outside of the cap-zone during a molding process.
摘要翻译：用于将微电子管芯或其他部件封装在封装的微电子器件的制造中的方法和装置。在本发明的一个方面，封装的微电子器件组件包括微电子管芯，连接到管芯的衬底，覆盖衬底的一部分的保护壳体以及远离衬底的表面突出的阻挡层。微电子管芯可以具有集成电路和可操作地耦合到集成电路的多个接合焊盘。衬底可以具有由被保护壳体覆盖的区域限定的帽区域，布置在帽区域中的多个接触元件，布置在球垫阵列外部的球垫阵列中的多个球垫帽区，以及将接触元件耦合到球垫的多个导线。接触元件电耦合到微电子管芯上的相应接合焊盘，并且保护套管覆盖盖区。衬底表面上的阻挡层被构造成使得阻挡层的至少一部分在帽区域的外部并且与模制部分的至少一部分相邻。阻挡层是抑制保护壳体的热固性材料在盖帽区域外部覆盖基底的一部分的密封件。因此，在模制过程中，屏障防止热固性材料在盖区之外的基板和模具之间泄漏。

7. 发明申请

US20060180907A1 Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectonic devices 审中-公开
标题翻译：具有压力释放元件的封装的微电子器件以及用于制造和使用这种封装的微电子器件的方法
公开(公告)号：US20060180907A1
公开(公告)日：2006-08-17
申请号：US11401514
申请日：2006-04-11
申请人： Stephen James , Chad Cobbley
发明人： Stephen James , Chad Cobbley
IPC分类号： H01L23/02
CPC分类号： H01L23/564 , H01L21/565 , H01L23/13 , H01L23/3107 , H01L23/3114 , H01L23/3121 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/4824 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2224/85399 , H01L2924/00014 , H01L2924/01057 , H01L2924/12042 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： Packaged microelectronic devices, interconnecting units for packaged microelectronic devices, and methods and apparatuses for packaging microelectronic devices with pressure release elements. In one aspect of the invention, a packaged microelectronic device includes a microelectronic die, an interconnecting unit coupled to the die, and a protective casing over the die. The interconnecting unit can have a substrate with a first side and a second side to which the die is attached, a plurality of contact elements operatively coupled to corresponding bond-pads on the die, and a plurality of ball-pads on the first side of the substrate electrically coupled to the contact elements. The protective casing can have at least a first cover encapsulating the die on the first side of the substrate. The packaged microelectronic device can also include a pressure relief element through at least a portion of the first cover and/or the substrate. The pressure relief element can have an opening to an external environment and a passageway to an internal location within the packaged microelectronic device. In operation, the pressure relief element releases gases or other forms of moisture entrapped by the casing and/or the substrate during high temperature processing of the packaged microelectronic device.
摘要翻译：封装的微电子器件，用于封装的微电子器件的互连单元，以及用于封装具有压力释放元件的微电子器件的方法和装置。在本发明的一个方面，封装的微电子器件包括微电子管芯，耦合到管芯的互连单元以及管芯上的保护壳体。互连单元可以具有基板，该基板具有连接芯片的第一侧和第二侧，多个接触元件可操作地连接到管芯上相应的接合焊盘，以及在第一侧上的多个球垫所述基板电耦合到所述接触元件。保护壳体可以具有至少第一盖，该第一盖在基板的第一侧封装模具。封装的微电子器件还可以包括通过第一盖和/或基底的至少一部分的压力释放元件。减压元件可以具有到外部环境的开口和通向包装的微电子器件内的内部位置的通道。在操作中，压力释放元件在包装的微电子器件的高温处理期间释放由壳体和/或衬底截留的气体或其它形式的水分。

8. 发明申请

US20060169490A1 Molding tool and a method of forming an electronic device package 审中-公开
标题翻译：成型工具和形成电子器件封装的方法
公开(公告)号：US20060169490A1
公开(公告)日：2006-08-03
申请号：US11366793
申请日：2006-03-02
申请人： Todd Bolken , Cary Baerlocher , Steven Heppler , Chad Cobbley
发明人： Todd Bolken , Cary Baerlocher , Steven Heppler , Chad Cobbley
IPC分类号： H01L23/28
CPC分类号： H01L23/28 , B33Y80/00 , H01L21/4803 , H01L21/481 , H01L21/50 , H01L23/055 , H01L23/10 , H01L23/48 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L27/14618 , H01L27/14683 , H01L2224/0401 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/00011 , H01L2224/45099 , H01L2924/00
摘要： Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
摘要翻译：公开了用于防潮图像传感器封装结构和组装方法的模制工具的各种实施例。本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的外壳结构和透明盖。壳体结构可以覆盖基本上所有的插入器芯片表面。在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。壳体结构还可以覆盖基本上所有的插入件附接表面。图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。

9. 发明申请

US20060051892A1 Methods for packaging image sensitive electronic devices 有权
公开(公告)号：US20060051892A1
公开(公告)日：2006-03-09
申请号：US11250907
申请日：2005-10-15
申请人： Todd Bolken , Chad Cobbley
发明人： Todd Bolken , Chad Cobbley
IPC分类号： H01L21/50 , H01L21/44 , H01L21/00
CPC分类号： H01L27/14618 , B33Y80/00 , H01L23/293 , H01L23/3128 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L27/14603 , H01L27/14625 , H01L27/14683 , H01L31/0203 , H01L2224/05599 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/484 , H01L2224/73265 , H01L2224/85399 , H01L2224/8592 , H01L2224/92 , H01L2224/92247 , H01L2225/06506 , H01L2225/06555 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/014 , H01L2924/15174 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/1815 , Y10S257/924 , H01L2224/45099 , H01L2924/00012 , H01L2924/00 , H01L2924/00011
摘要： The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections such as wire bonds and bond pads, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, chip encapsulation is accomplished with a unitary shell of entirely transparent material. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment.

10. 发明授权

US06853058B2 Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member 有权
标题翻译：用于在半导体管芯和半导体管芯接收构件之间提供电连接的工艺
公开(公告)号：US06853058B2
公开(公告)日：2005-02-08
申请号：US10056350
申请日：2002-01-24
申请人： Chad Cobbley
发明人： Chad Cobbley
IPC分类号： H01L23/498 , H01L23/538 , H01L23/495
CPC分类号： H01L23/5382 , H01L23/49838 , H01L24/16 , H01L24/48 , H01L2224/0401 , H01L2224/05554 , H01L2224/05599 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/484 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01014 , H01L2924/01027 , H01L2924/014 , H01L2924/10161 , H01L2924/10253 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , Y10T29/4913 , Y10T29/53178 , Y10T156/10 , H01L2224/45099 , H01L2924/00
摘要： A semiconductor package assembly is disclosed having a semiconductor die receiving member configured to accept a semiconductor die in either the flip-chip or the wirebond orientations. First contact sites on a die receiving surface provide electrical connection with a flip-chip component. Second contact sites provide electrical connection with a wirebond component. Electrically conductive traces connect the first and second contact sites with terminal contact sites. The semiconductor package assembly may further include the flip-chip or wirebond component mounted over the die receiving surface. Further, the assembly may also include a mounting substrate in electrical connection with the terminal contact sites.
摘要翻译：公开了一种半导体封装组件，其具有被配置为以倒装芯片或引线接合方向接受半导体管芯的半导体管芯接收构件。芯片接收表面上的第一接触点提供与倒装芯片部件的电连接。第二接触点提供与引线键部件的电连接。导电迹线将第一和第二接触部位与端子接触部位连接。半导体封装组件还可以包括安装在管芯接收表面上的倒装芯片或引线接合部件。此外，组件还可以包括与端子接触位置电连接的安装衬底。

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