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1. 发明授权

US07939919B2 LED-packaging arrangement and light bar employing the same 失效
标题翻译： LED封装布置和使用其的灯条
公开(公告)号：US07939919B2
公开(公告)日：2011-05-10
申请号：US12453943
申请日：2009-05-28
申请人： Chia-Han Hsieh
发明人： Chia-Han Hsieh
IPC分类号： H01L33/64
CPC分类号： H01L33/486 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2924/00014
摘要： An LED-packaging arrangement, comprising: a first connection block with an enclosure groove at the bottom thereof; a second connection block with an enclosure groove at the bottom thereof; a light-emitting chip positioned at the top of the first connection block and via connection wires electrically coupled to the first and second connection blocks; a positioning/packaging body, and a transparent packaging body. Alternatively, a third connection block is provided with an enclosure groove at the bottom thereof. In this case, the electrical connection originally to the first connection block via the connection wire is changed to the third connection block. The first and second connection blocks are enclosed by the lower part of the positioning/packaging body in position such that the bottom surfaces of the first and second connection blocks are exposed. The upper part of the positioning/packaging body encloses the light-emitting chip so as to create a reflection cap. The transparent packaging body is employed to seal and fix the light-emitting chip and the connection wires in position for an optimal protection. In this way, the problem of the prior art is resolved that the heat generated by the light-emitting chip is not easily dissipated. Moreover, the heat-dissipating efficiency and the structural strength can be considerably enhanced.
摘要翻译：一种LED封装装置，包括：在其底部具有封闭槽的第一连接块; 第二连接块，其底部具有封闭槽; 位于所述第一连接块的顶部并经由电连接到所述第一和第二连接块的连接线的发光芯片; 定位/包装体和透明包装体。或者，第三连接块在其底部设置有封闭槽。在这种情况下，原来通过连接线的第一连接块的电连接被改变为第三连接块。第一和第二连接块被定位/包装体的下部包围，使得第一和第二连接块的底面露出。定位/包装主体的上部包围发光芯片以产生反射盖。透明包装体用于将发光芯片和连接线密封并固定在适当的位置以获得最佳保护。以这种方式，解决了现有技术的问题，即由发光芯片产生的热量不容易消散。此外，可以显着提高散热效率和结构强度。

2. 发明申请

US20110156092A1 SMT ENCAPSULATION BODY OF A LIGHT-EMITTING DIODE WITH A WIDE-ANGLE ILLUMINATION LIGHT SHAPE 审中-公开
标题翻译：具有宽角度照明光形状的发光二极管的SMT封装体
公开(公告)号：US20110156092A1
公开(公告)日：2011-06-30
申请号：US12649757
申请日：2009-12-30
申请人： CHIA-HAN HSIEH , MING-YEN CHEN
发明人： CHIA-HAN HSIEH , MING-YEN CHEN
IPC分类号： H01L33/00
CPC分类号： H01L33/54 , H01L33/486 , H01L2924/0002 , H01L2924/00
摘要： An SMT encapsulation body of a light-emitting diode with a wide-angle illumination light shape, comprising: a) a substrate; b) an LED die mounted on the substrate by use of SMT; and c) an encapsulation body positioned around the LED die in the shape of a double dome at the top thereof with the center at a lower position such that the illumination light shape of the light-emitting diode becomes to be a wide-angle and elongated body. The encapsulation body may be formed either in the shape of a batwing or in the shape of a double batwing symmetrically positioned in a cross way. In this way, the light-emitting diode achieves a wide-angle illumination light shape fulfilling the requirements of a certain purpose without the use of the double optical effect of the lens. Meanwhile, the drawbacks of the conventional structure are resolved. Moreover, an increased efficiency in using the light source is ensured.
摘要翻译：一种具有广角照明光形状的发光二极管的SMT封装体，包括：a）衬底; b）使用SMT安装在基板上的LED管芯; 以及c）位于LED模具周围的封装体，其顶部具有双圆顶形状，其中心处于较低位置，使得发光二极管的照明光形状变成广角和细长的身体。封装体可以形成为蝙蝠鱼的形状，也可以形成为双重蝙蝠的形状，以双向对称的方式设置。这样，在不使用透镜的双重光学效果的情况下，发光二极管实现满足特定要求的广角照明光形状。同时，解决了传统结构的缺点。此外，确保了提高使用光源的效率。

3. 发明申请

US20100001298A1 LED-packaging arrangement and light bar employing the same 失效
标题翻译： LED封装布置和使用其的灯条
公开(公告)号：US20100001298A1
公开(公告)日：2010-01-07
申请号：US12453943
申请日：2009-05-28
申请人： Chia-Han Hsieh
发明人： Chia-Han Hsieh
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2924/00014
摘要： An LED-packaging arrangement, comprising: a first connection block with an enclosure groove at the bottom thereof; a second connection block with an enclosure groove at the bottom thereof; a light-emitting chip positioned at the top of the first connection block and via connection wires electrically coupled to the first and second connection blocks; a positioning/packaging body, and a transparent packaging body. Alternatively, a third connection block is provided with an enclosure groove at the bottom thereof. In this case, the electrical connection originally to the first connection block via the connection wire is changed to the third connection block. The first and second connection blocks are enclosed by the lower part of the positioning/packaging body in position such that the bottom surfaces of the first and second connection blocks are exposed. The upper part of the positioning/packaging body encloses the light-emitting chip so as to create a reflection cap. The transparent packaging body is employed to seal and fix the light-emitting chip and the connection wires in position for an optimal protection. In this way, the problem of the prior art is resolved that the heat generated by the light-emitting chip is not easily dissipated. Moreover, the heat-dissipating efficiency and the structural strength can be considerably enhanced.
摘要翻译：一种LED封装装置，包括：在其底部具有封闭槽的第一连接块; 第二连接块，其底部具有封闭槽; 位于所述第一连接块的顶部并经由电连接到所述第一和第二连接块的连接线的发光芯片; 定位/包装体和透明包装体。或者，第三连接块在其底部设置有封闭槽。在这种情况下，原来通过连接线的第一连接块的电连接被改变为第三连接块。第一和第二连接块被定位/包装体的下部包围，使得第一和第二连接块的底面露出。定位/包装主体的上部包围发光芯片以产生反射盖。透明包装体用于将发光芯片和连接线密封并固定在适当的位置以获得最佳保护。以这种方式，解决了现有技术的问题，即由发光芯片产生的热量不容易消散。此外，可以显着提高散热效率和结构强度。

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