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1. 发明申请

US20140175486A1 NARROW VIEWING ANGLE PLASTIC LEADED CHIP CARRIER 有权
标题翻译： NARROW查看角度塑料领先的芯片载体
公开(公告)号：US20140175486A1
公开(公告)日：2014-06-26
申请号：US14036297
申请日：2013-09-25
申请人： Eng Chuan ONG , Meng Ee LEE , Chiau Jin LEE
发明人： Eng Chuan ONG , Meng Ee LEE , Chiau Jin LEE
IPC分类号： H01L33/60 , H01L33/62
CPC分类号： H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： The PLCC package enables a narrow viewing angle without requiring a second lens by providing the PLCC package with a reflector cup having multiple stages where the geometry or some other characteristic of one stage is different from the geometry or some other characteristic of another stage.
摘要翻译： PLCC封装通过为PLCC封装提供具有多级的反射器杯而不需要第二透镜，从而能够实现窄视角，其中一级的几何形状或其他特性与另一级的几何形状或其他特性不同。

2. 发明申请

US20120211785A1 HIGH POWER PLASTIC LEADED CHIP CARRIER WITH INTEGRATED METAL REFLECTOR CUP AND DIRECT HEAT SINK 有权
标题翻译：具有集成金属反射杯和直接散热器的高功率塑料引线芯片
公开(公告)号：US20120211785A1
公开(公告)日：2012-08-23
申请号：US13033520
申请日：2011-02-23
申请人： Keat Chuan Ng , Kheng Leng Tan , Chiau Jin Lee
发明人： Keat Chuan Ng , Kheng Leng Tan , Chiau Jin Lee
IPC分类号： H01L33/60 , H01L33/64
CPC分类号： H01L33/647 , H01L23/49562 , H01L33/486 , H01L33/60 , H01L33/642 , H01L2224/48465 , H01L2933/0075
摘要： A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package includes a lead frame with an integrated reflector cup. The reflector cup is directly connected to a heat sink, which improves the ability of the PLCC package to distribute heat away from the light source that is provided in the reflector cup.
摘要翻译：公开了一种塑料引线芯片载体（PLCC）封装。 PLCC包装包括带有集成反射杯的引线框架。反射杯直接连接到散热器，这提高了PLCC封装将热量从设置在反射杯中的光源分散的能力。

3. 发明申请

US20110044062A1 LIGHT SOURCE 有权
标题翻译：光源
公开(公告)号：US20110044062A1
公开(公告)日：2011-02-24
申请号：US12544140
申请日：2009-08-19
申请人： Keat Chuan Ng , Chiau Jin Lee , Kheng Leng Tan , Aizar Abdul Karim Norfidathul
发明人： Keat Chuan Ng , Chiau Jin Lee , Kheng Leng Tan , Aizar Abdul Karim Norfidathul
IPC分类号： F21V21/00
CPC分类号： F21K9/00 , F21Y2113/13 , F21Y2115/10
摘要： An embodiment of a light source comprises a first lead and a second lead. The first lead comprises a first mounting surface wherein a first light emitter is connectable to the first mounting surface, a support member attached to the first mounting surface, a conductor portion attached to the support member, and at least one tab extending from the first mounting surface, the at least one tab being used to hold the first lead during fabrication. The second lead is second lead located adjacent the first lead and comprises a second mounting surface wherein a second light emitter is connectable to the second mounting surface, at least two support members attached to the second mounting surface, and a conductor portion attached to each of the support members.
摘要翻译：光源的实施例包括第一引线和第二引线。第一引线包括第一安装表面，其中第一光发射器可连接到第一安装表面，附接到第一安装表面的支撑构件，附接到支撑构件的导体部分和从第一安装面延伸的至少一个突出部表面，所述至少一个突片用于在制造期间保持第一引线。第二引线是位于第一引线附近的第二引线，并且包括第二安装表面，其中第二光发射器可连接到第二安装表面，附接到第二安装表面的至少两个支撑构件和连接到第二安装表面的导体部分支持成员。

4. 发明申请

US20090129085A1 OPTICAL DEVICE 有权
标题翻译：光学装置
公开(公告)号：US20090129085A1
公开(公告)日：2009-05-21
申请号：US11941406
申请日：2007-11-16
申请人： Abdul Karim Norfidathul Aizar , Chiau Jin Lee , Keat Chuan Ng , Kiam Soon Ong , Kheng Leng Tan
发明人： Abdul Karim Norfidathul Aizar , Chiau Jin Lee , Keat Chuan Ng , Kiam Soon Ong , Kheng Leng Tan
IPC分类号： F21V7/00
CPC分类号： H01L33/483 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00
摘要： An exemplary embodiment of an optical device may include a lead frame with a plurality of leads and a reflector housing formed around the lead frame. The reflector housing includes a first end face and a second end face and a peripheral sidewall extending between the first end face and the second end face. The reflector housing includes a first pocket with a pocket opening in the first end face and a second pocket with a pocket opening in the second end face. At least one LED die is mounted in the first pocket of the reflector housing, and a light transmitting encapsulant is disposed in the first pocket and encapsulating the at least one LED die.
摘要翻译：光学装置的示例性实施例可以包括具有多个引线的引线框架和围绕引线框架形成的反射器壳体。反射器壳体包括在第一端面和第二端面之间延伸的第一端面和第二端面以及周边侧壁。反射器壳体包括在第一端面中具有口袋开口的第一袋和在第二端面中具有口袋开口的第二袋。至少一个LED管芯安装在反射器壳体的第一凹部中，并且光传输密封剂设置在第一凹部中并封装至少一个LED管芯。

5. 发明申请

US20090129073A1 Illumination Assembly Having Multiple Emitters 有权
标题翻译：具有多个发射器的照明组件
公开(公告)号：US20090129073A1
公开(公告)日：2009-05-21
申请号：US11941627
申请日：2007-11-16
申请人： Yean Chon Yaw , Kum Soon Wong , Chiau Jin Lee
发明人： Yean Chon Yaw , Kum Soon Wong , Chiau Jin Lee
IPC分类号： F21V9/00 , F21V1/00
CPC分类号： G09F9/33 , H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： An exemplary embodiment of an illumination assembly includes a reflector housing having a plurality of cavities formed therein, an a plurality of light emitters mounted in the plurality of cavities. Each of the plurality of cavities contains a single one of the plurality of light emitters.
摘要翻译：照明组件的示例性实施例包括其中形成有多个空腔的反射器壳体，安装在多个空腔中的多个发光体。多个空腔中的每一个包含多个发光体中的单个。

6. 发明申请

US20080273340A1 Solid State Light Source Having a Variable Number of Dies 有权
标题翻译：具有可变数量的固态光源
公开(公告)号：US20080273340A1
公开(公告)日：2008-11-06
申请号：US11690554
申请日：2007-03-23
申请人： Keat Chuan Ng , Chiau Jin Lee
发明人： Keat Chuan Ng , Chiau Jin Lee
IPC分类号： F21V29/00
CPC分类号： H01L25/0753 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2224/49171 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A light source having a die carrier, a lead frame, and an insulating body is disclosed. The die carrier includes a die mounting section connected to a heat transfer section. The die mounting section includes a die mounting area having a lead pad opening contained within the die mounting area. The lead frame includes a lead pad. An electrically insulating material fills the voids between the die carrier and the lead frame to maintain the lead frame and die carrier such that a surface of the heat transfer section is exposed on a surface of the body, the lead pad is positioned in the lead pad opening, and the die carrier is electrically isolated from the lead frame. A plurality of dies are attached to the die mounting area and connected to the lead pad.
摘要翻译：公开了一种具有模具载体，引线框架和绝缘体的光源。模具载体包括连接到传热部分的模具安装部分。模具安装部分包括具有包含在模具安装区域内的引线焊盘开口的管芯安装区域。引线框架包括引线板。电绝缘材料填充模具载体和引线框架之间的空隙以保持引线框架和模具载体，使得传热部分的表面暴露在主体的表面上，引线焊盘位于引线焊盘开口，并且管芯载体与引线框架电隔离。将多个管芯附接到管芯安装区域并连接到引线焊盘。

7. 发明申请

US20080170391A1 Multi-chip Packaged LED Light Source 有权
标题翻译：多芯片封装LED光源
公开(公告)号：US20080170391A1
公开(公告)日：2008-07-17
申请号：US11622753
申请日：2007-01-12
申请人： Aizar Abdul Karim Norfidathul , Chiau Jin Lee , Kheng Leng Tan , Keat Chuan Ng , Kiam Soon Ong
发明人： Aizar Abdul Karim Norfidathul , Chiau Jin Lee , Kheng Leng Tan , Keat Chuan Ng , Kiam Soon Ong
IPC分类号： F21S4/00
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/62 , H01L2224/48247 , H01L2224/49113 , H01L2924/01068 , Y10S362/80
摘要： A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.
摘要翻译：公开了一种具有引线框架，主体和多个管芯的光源，每个管芯具有LED。主体包括顶表面，底表面和多个侧表面。引线框架包括第一部分，第二部分和第三部分，第一部分包括具有穿过主体并终止于底部表面上的焊盘的第一突起的管芯安装区域。第二和第三部分各自包括弯曲以形成沿着一个侧表面延伸的第一和第二引线的突起。每个模具结合到模具安装区域，使得第一触点电连接到模具安装区域，并且第二触点连接到第二和第三部分中的一个。第一部分的第一突起提供改善的热传递。

8. 发明授权

US07365407B2 Light emitting diode package with direct leadframe heat dissipation 有权
标题翻译：具有直接引线框散热的发光二极管封装
公开(公告)号：US07365407B2
公开(公告)日：2008-04-29
申请号：US11415548
申请日：2006-05-01
申请人： Kee Yean Ng , Hui Peng Koay , Chiau Jin Lee , Kheng Leng Tan , Wei Liam Loo , Keat Chuan Ng , Alzar Abdul Karim Norfidathul
发明人： Kee Yean Ng , Hui Peng Koay , Chiau Jin Lee , Kheng Leng Tan , Wei Liam Loo , Keat Chuan Ng , Alzar Abdul Karim Norfidathul
IPC分类号： H01L31/0203 , H01L23/495 , H01L29/267 , H01L29/22 , H01L29/24 , H01L21/00 , H01L21/50
CPC分类号： H01L23/49568 , H01L24/48 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01078 , H01L2924/12041 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.
摘要翻译：公开了一种用于封装集成电路的封装电路和方法。封装电路具有引线框，集成电路芯片和封装层。引线框架具有第一和第二部分，第一部分包括横向部分，芯片安装区域和第一延伸部分。集成电路芯片安装在芯片安装区域并与芯片安装区域热接触。封装层具有顶部，底部以及第一和第二侧表面。第一延伸部被弯曲以提供从芯片安装区域到底部表面的第一热路径。热路将热芯片安装区域连接到底面而不通过第一和第二侧表面，并且提供比通过横向部分或第二部分的热路径热阻小的热路径。

9. 发明授权

US09269875B2 Light emitter 有权
标题翻译：光发射器
公开(公告)号：US09269875B2
公开(公告)日：2016-02-23
申请号：US12469297
申请日：2009-05-20
申请人： Eng Chuan Ong , Meng Ee Lee , Chiau Jin Lee
发明人： Eng Chuan Ong , Meng Ee Lee , Chiau Jin Lee
IPC分类号： H01L33/00 , H01L33/58 , H01L33/60 , H01L33/54 , H01L33/62
CPC分类号： H01L33/58 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00012 , H01L2924/00
摘要： A light emitter is disclosed herein. The light emitter may have a lead frame and a plastic reflector cup. The lead frame may have a planar portion; a bond area having a light-emitting diode attached thereto; and at least two terminals configured for surface mount technology. The reflector cup may be proximate the bond area and may have an opening, wherein light emitted from the light-emitting diode passes through the opening; a side wall extending between the planar portion and the opening; and a clear lens located proximate the opening and attached to the reflector cup. The combination of the lens and the reflector cup causes a light beam originating from the light-emitting diode to be less than fifteen degrees.
摘要翻译：本文公开了一种发光体。光发射器可以具有引线框和塑料反射杯。引线框架可以具有平面部分; 具有连接到其上的发光二极管的接合区域; 以及至少两个端子，用于表面贴装技术。反射器杯可以靠近接合区域并且可以具有开口，其中从发光二极管发射的光穿过开口; 在所述平面部和所述开口之间延伸的侧壁; 以及位于开口附近并附接到反射杯的透明透镜。透镜和反射杯的组合使得源自发光二极管的光束小于十五度。

10. 发明授权

US08120055B2 Light source 有权
标题翻译：光源
公开(公告)号：US08120055B2
公开(公告)日：2012-02-21
申请号：US12426768
申请日：2009-04-20
申请人： Aizar Abdul Karim Norfidathul , Chiau Jin Lee , Keat Chuan Ng
发明人： Aizar Abdul Karim Norfidathul , Chiau Jin Lee , Keat Chuan Ng
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/486 , H01L33/647 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of a light source are disclosed herein. An embodiment of the light source comprises a first terminal and a second terminal. The first terminal comprises a first terminal first portion and a first terminal second portion, wherein at least a portion of the first terminal second portion is located on a first plane, the first terminal second portion comprising at least two contacts separated by a space. A second terminal comprises a second terminal first portion and a second terminal second portion. The second terminal first portion is located proximate the first terminal first portion. The second terminal second portion is located substantially on the first plane and in the space. A light emitter is affixed to the first terminal first portion, the light emitter is electrically connected to the first terminal first portion. A connection exists between the light emitter and the second terminal first portion.
摘要翻译：本文公开了光源的实施例。光源的实施例包括第一端子和第二端子。第一端子包括第一端子第一部分和第一端子第二部分，其中第一端子第二部分的至少一部分位于第一平面上，第一端子第二部分包括由空间分开的至少两个触点。第二端子包括第二端子第一部分和第二端子第二部分。第二端子第一部分位于第一端子第一部分附近。第二端子第二部分基本上位于第一平面上并在该空间中。光发射器固定到第一端子第一部分，光发射器电连接到第一端子第一部分。光发射器和第二端子第一部分之间存在连接。

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