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    • 2. 发明申请
    • Novel Condition Before TMAH Improved Device Performance
    • TMAH改进设备性能之前的新条件
    • US20130207218A1
    • 2013-08-15
    • US13396870
    • 2012-02-15
    • En-Ting LeeKun-El ChenYu-Sheng WangChien-Chung ChenHuai-Tei Yang
    • En-Ting LeeKun-El ChenYu-Sheng WangChien-Chung ChenHuai-Tei Yang
    • H01L31/02
    • H01L31/0352H01L21/26513H01L27/1446H01L27/1464H01L27/14643H01L27/14687
    • The present disclosure relates to a method of forming a back-side illuminated CMOS image sensor (BSI CIS). In some embodiments, the method comprises forming a plurality of photodetectors within a front-side of a semiconductor substrate. An implant is performed on the back-side of the semiconductor substrate to form an implantation region having a doping concentration that is greater in the center than at the edges of the semiconductor substrate. The back-side of the workpiece is then exposed to an etchant, having an etch rate that is inversely proportional to the doping concentration, which thins the semiconductor substrate to a thickness that allows for light to pass through the back-side of the substrate to the plurality of photodetectors. By implanting the substrate prior to etching, the etching rate is made uniform over the back- side of the substrate improving total thickness variation between the photodetectors and the back-side of the substrate.
    • 本公开涉及形成背面照明CMOS图像传感器(BSI CIS)的方法。 在一些实施例中,该方法包括在半导体衬底的正面内形成多个光电探测器。 在半导体衬底的背面进行注入,以形成掺杂浓度在中心比在半导体衬底的边缘处大的掺杂浓度。 然后将工件的背面暴露于蚀刻剂,其蚀刻速率与掺杂浓度成反比,该掺杂浓度将半导体衬底沉积到允许光通过衬底的背面的厚度到 多个光检测器。 通过在蚀刻之前植入基板,使蚀刻速率在基板的背面上均匀,从而提高光电检测器与基板的背面之间的总厚度变化。
    • 4. 发明授权
    • Sub-micron adjustable mount for supporting a component and method
    • 用于支撑元件和方法的亚微米可调支架
    • US08243375B2
    • 2012-08-14
    • US12689188
    • 2010-01-18
    • Nathan G. WoodardEric C. JohnsonJon F. NielsenJoseph R. DemersChien-Chung Chen
    • Nathan G. WoodardEric C. JohnsonJon F. NielsenJoseph R. DemersChien-Chung Chen
    • G02B7/02
    • G02B7/00
    • An optical assembly includes a light path and at least one optic to be positioned in the path. A support arrangement supports the optic having a foot arrangement including at least one foot that receives a direct manipulation with the foot slidingly engaged against a support surface to move the optic relative to the light path. Movement of the foot may move the optic along a predetermined path. The foot defines a footprint for engaging the support surface and receives the direct manipulation in a way which changes the footprint on the support surface to move the optic responsive to changes in the footprint. A movement arrangement may selectively bias the foot against the support surface during a movement mode, intended to permit movement of the foot against the support surface, and in a locked mode, intended to lock the foot against the support surface.
    • 光学组件包括光路和要定位在路径中的至少一个光学元件。 支撑装置支撑光学元件,其具有足部布置,其包括至少一个脚,其接收直接操纵,脚与滑​​动地抵靠支撑表面接合以相对于光路移动光学元件。 脚的运动可以沿着预定的路径移动光学元件。 脚定义了用于接合支撑表面的足迹,并且以一种方式接收直接操纵,其改变了支撑表面上的占地面积,以响应于占地面积的变化来移动光学器件。 移动装置可以在移动模式期间选择性地将脚抵靠支撑表面偏置,以允许脚抵靠支撑表面移动,并且处于锁定模式,以将脚锁定在支撑表面上。
    • 9. 发明申请
    • ASSEMBLED LIGHT-GUIDING MODULE WITH HIGH LIGHT-GUIDING EFFICIENCY
    • 具有高光引导效率的组装指导模块
    • US20100110717A1
    • 2010-05-06
    • US12500261
    • 2009-07-09
    • Chien-Chung Chen
    • Chien-Chung Chen
    • G02B6/00
    • G02B6/001
    • An assembled light-guiding module with high light-guiding efficiency is composed of a plurality of light-guiding structures. Each light-guiding structure includes a light-guiding body unit and a light-reflecting microstructure unit. The light-guiding body unit has a light-guiding portion, at least one concave light-entering portion is formed on one end of the light-guiding portion, and a hollow portion is formed on a plane surface of the light-guiding portion. The light-reflecting microstructure unit has a plurality of light-reflecting microstructures disposed in the hollow portion. Thereby, the light-guiding structures are assembled to form a light pipe, wherein the concave light-entering portions are mated to form a light-entering groove on one end of the light pipe, and the hollow portions are mated to form a cavity space that is embedded in the light pipe.
    • 具有高导光效率的组装导光模块由多个导光结构组成。 每个导光结构包括导光体单元和光反射微结构单元。 导光体单元具有导光部,在导光部的一端形成有至少一个凹入光入射部,在导光部的平面上形成有中空部。 光反射微结构单元具有设置在中空部分中的多个光反射微结构。 由此,导光结构被组装形成光管,其中凹入的光入射部分配合以在光管的一端上形成入光槽,并且将中空部分配合形成空腔 嵌入在光管中。