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    • 5. 发明授权
    • Lithography method
    • 平版印刷法
    • US07312020B2
    • 2007-12-25
    • US10605968
    • 2003-11-10
    • Chin-Lung LinChuen Huei YangMing-Jui ChenVenson Lee
    • Chin-Lung LinChuen Huei YangMing-Jui ChenVenson Lee
    • G03F1/00
    • G03F7/70283G03F1/34
    • A lithography method for forming a plurality of patterns in a photoresist layer. A phase shift mask including a plurality of transparent main features, a plurality of first phase shift transparent regions, and a plurality of second phase shift transparent regions is provided. Each transparent main feature is surrounded by the first phase shift transparent regions and the second phase shift transparent regions interlaced contiguously along a periphery of the transparent main feature. Each of the first phase shift transparent regions has a phase shift relative to each of the second phase shift transparent regions. An exposure process is performed to irradiate the phase shift mask with light so that the patterns corresponding to the transparent main features are formed in the photoresist layer.
    • 一种用于在光致抗蚀剂层中形成多个图案的光刻方法。 提供了包括多个透明主要特征,多个第一相移透明区域和多个第二相移透明区域的相移掩模。 每个透明主要特征被第一相移透明区域包围,而第二相移透明区域沿着透明主要特征的周边连续交错。 第一相移透明区域中的每一个相对于第二相移透明区域中的每一个具有相移。 执行曝光处理以用光照射相移掩模,使得在光致抗蚀剂层中形成对应于透明主要特征的图案。
    • 7. 发明授权
    • Process utilizing relationship between reflectivity and resist thickness
for inhibition of side effect caused by halftone phase shift masks
    • 工艺利用反射率和抗蚀剂厚度之间的关系来抑制由半色调相移掩模引起的副作用
    • US5916717A
    • 1999-06-29
    • US44058
    • 1998-03-19
    • Chuen-Huei YangChang-Ming Dai
    • Chuen-Huei YangChang-Ming Dai
    • G03F7/16G03F9/00
    • G03F7/162
    • A method of forming and exposing a layer of resist which will minimize or eliminate side lobe effect resulting from the use of phase shifting masks or attenuating phase shifting masks in the exposed and developed layer of resist. The curve of reflectivity as a function of resist thickness, or swing curve, is calculated using the index of refraction, n, and the extinction coefficient, k, of the resist material and plotted. An optimum thickness of the resist corresponding to a relative maximum of the swing curve is chosen. The angular velocity used to spin the resist onto wafers is selected to produce the optimum thickness. Wafers having a resist layer with the optimum thickness are then prepared, exposed, and developed. The layer of resist may have a layer of anti-reflective material on the top surface of the layer of resist if desired.
    • 形成和曝光抗蚀剂层的方法,其将最小化或消除在曝光和显影的抗蚀剂层中使用相移掩模或衰减相移掩模产生的旁瓣效应。 使用折射率n和抗蚀剂材料的消光系数k来计算反射率作为抗蚀剂厚度或摆动曲线的函数的曲线,并绘制。 选择对应于摆动曲线的相对最大值的抗蚀剂的最佳厚度。 选择用于将抗蚀剂旋转到晶片上的角速度以产生最佳厚度。 然后制备具有最佳厚度的抗蚀剂层的晶片,曝光和显影。 如果需要,抗蚀剂层可以在抗蚀剂层的顶表面上具有一层抗反射材料。