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1. 发明授权

US08837060B2 Image capture lens module and wafer level packaged image capture devices 有权
标题翻译：图像采集镜头模块和晶圆级封装图像捕获设备
公开(公告)号：US08837060B2
公开(公告)日：2014-09-16
申请号：US13035391
申请日：2011-02-25
申请人： Chun-Chi Lin , Jau-Jan Deng , Wei-Ping Chen
发明人： Chun-Chi Lin , Jau-Jan Deng , Wei-Ping Chen
IPC分类号： G02B9/04 , G02B9/08 , G02B13/00 , G02B5/00 , H01L27/146 , G02B9/02
CPC分类号： G02B13/003 , G02B5/005 , G02B9/02 , G02B9/04 , G02B9/08 , G02B13/004 , G02B13/0085 , H01L27/14618 , H01L2924/0002 , H01L2924/00
摘要： Image capture lens modules and wafer level packaged image capture devices are presented. The image capture lens module includes a compound lens with a first lens element and a second lens element molded on both sides of a substrate, and a field stop disposed at an interface between the first lens element and the substrate or at an interface between the second lens element and the substrate, wherein the field stop is a coating layer with a polygonal transparent area.
摘要翻译：提出了图像采集镜头模块和晶片级封装图像捕获设备。图像拍摄透镜模块包括具有第一透镜元件和模制在基板的两侧上的第二透镜元件的复合透镜，以及设置在第一透镜元件和基板之间或第二透镜元件的第二透镜元件透镜元件和基板，其中场挡板是具有多边形透明区域的涂层。

2. 发明申请

US20130112825A1 EXPANSION CARD RETAINING STRUCTURE 审中-公开
标题翻译：扩展卡保留结构
公开(公告)号：US20130112825A1
公开(公告)日：2013-05-09
申请号：US13355515
申请日：2012-01-21
申请人： LUNG-CHUAN LIAO , HSIAO-MING CHEN , CHUN-CHI LIN
发明人： LUNG-CHUAN LIAO , HSIAO-MING CHEN , CHUN-CHI LIN
IPC分类号： H05K7/14
CPC分类号： G06F1/184 , G06F1/185
摘要： The present invention relates to a retaining structure for securing at least one expansion card (such as a Peripheral Component Interconnect, PCI card) on a motherboard. The retaining structure includes a frame member and a handle. The frame member has a main body, and the main body has at least one outer fixing portion and an inner fixing portion. The main body has a top piece and a connecting piece. The connecting piece is arranged away from the outer fixing portion and connected to the inner fixing portion. The handle is connected to the connecting piece. Upon mounting of the retaining structure, the distance between the handle and a base plate of a housing is less than the distance between the top piece and the base plate of the housing. This retaining structure may be easily dismounted in restricted space internal of the housing.
摘要翻译：本发明涉及用于将至少一个扩展卡（例如外围部件互连，PCI卡）固定在母板上的保持结构。保持结构包括框架构件和把手。框架构件具有主体，并且主体具有至少一个外部固定部分和内部固定部分。主体具有顶部和连接件。连接件远离外部固定部分设置并连接到内部固定部分。手柄连接到连接件上。在安装保持结构时，手柄与壳体的基板之间的距离小于顶部件和壳体的底板之间的距离。该保持结构可以容易地在壳体内部的限制空间中拆卸。

3. 发明申请

US20120170180A1 DISPLAY MODULE 有权
标题翻译：显示模块
公开(公告)号：US20120170180A1
公开(公告)日：2012-07-05
申请号：US13109012
申请日：2011-05-17
申请人： Dong-Sen CHEN , Ming-Jheng HUANG , Chun-Hsien YU , Chun-Chi LIN
发明人： Dong-Sen CHEN , Ming-Jheng HUANG , Chun-Hsien YU , Chun-Chi LIN
IPC分类号： H05K5/00
CPC分类号： G06F1/1637 , G02F1/133308 , G02F2001/133314 , G02F2001/13332 , G02F2201/46
摘要： A display module includes a front frame, a rear housing, and a trimming board. The front frame includes a first positioning hole and a clamping hole. The rear housing includes a second positioning hole. The front frame is engaged with the rear housing. The second positioning hole communicates with the first positioning hole. The trimming board includes a bolt structure and a clamping structure. The bolt structure is adapted to pass through the first positioning hole and the second positioning hole for preventing the front frame from separated from the rear housing. The clamping hole is used for the clamping structure to pass through and prevent the clamping structure from separating from the clamping hole.
摘要翻译：显示模块包括前框架，后壳体和修剪板。前框架包括第一定位孔和夹紧孔。后壳体包括第二定位孔。前框架与后壳体接合。第二定位孔与第一定位孔连通。修剪板包括螺栓结构和夹紧结构。螺栓结构适于穿过第一定位孔和第二定位孔，以防止前框架与后壳体分离。夹紧孔用于夹紧结构通过并防止夹紧结构与夹紧孔分离。

4. 发明申请

US20110131539A1 REWIRING USING IRREDUNDANCY REMOVAL AND ADDITION 审中-公开
标题翻译：使用IRREDUNDANCY移除和添加的重新启动
公开(公告)号：US20110131539A1
公开(公告)日：2011-06-02
申请号：US12626801
申请日：2009-11-27
申请人： Chun-Yao WANG , Chun-Chi LIN , Daw-Ming LEE
发明人： Chun-Yao WANG , Chun-Chi LIN , Daw-Ming LEE
IPC分类号： G06F17/50
CPC分类号： G06F17/505
摘要： This invention proposes a new restructuring technique, Rewiring Using IRredundancy Removal and Addition (IRRA) used in the synthesis and optimization of logic designs. This method successfully removes any desired target wire by constructing a corresponding rectification network which exactly corrects the error of the circuit caused by the removal of the target wire. The rectification network can be further simplified to achieve excellent area optimization.
摘要翻译：本发明提出了在逻辑设计的综合和优化中使用的使用IRredundancy Removal和Addition（IRRA）的重组技术。该方法通过构造相应的整流网络成功地去除任何所需的目标线路，该整流网络精确地校正由于目标线路的移除引起的电路的误差。整改网络可以进一步简化，实现优异的面积优化。

5. 发明授权

US06932855B2 Method for recycling metals from swarf 失效
标题翻译：从切屑回收金属的方法
公开(公告)号：US06932855B2
公开(公告)日：2005-08-23
申请号：US10690702
申请日：2003-10-23
申请人： James I. Chang , Neng-Hsin Chiu , You-Ming Jang , Chun-Chi Lin
发明人： James I. Chang , Neng-Hsin Chiu , You-Ming Jang , Chun-Chi Lin
IPC分类号： C22B1/00 , C22B7/00
CPC分类号： C22B7/006 , C22B1/005 , Y02P10/234
摘要： A method for recycling metals from swarf includes steps of removing oil in swarf by means of surfactant having a feature of strong hydrophilicity. The steps involves repeated stirring and washing, separating solid from liquid, and separating oil from water so as to force oil separate from the surface of solid, finishing all the steps in 10–30 minutes. Metals after finished the treatment may have only 1% of oil remained thereon, possible to be reused in metalworking. Oil and washing solution are also reusable after treated, so the method is effective both for treating waste and for recycling resources.
摘要翻译：用于从切屑回收金属的方法包括通过具有强亲水性特征的表面活性剂除去切屑中的油的步骤。这些步骤包括反复搅拌和洗涤，将固体与液体分离，并从水中分离油，以使油从固体表面分离，在10-30分钟内完成所有步骤。完成处理后的金属可能只剩下1％的油，可能在金属加工中重复使用。油和洗涤液在处理后也可重复使用，因此该方法对于处理废物和回收资源都是有效的。

6. 发明授权

US09053264B2 What-if simulation methods and systems 有权
标题翻译：假设模拟方法和系统
公开(公告)号：US09053264B2
公开(公告)日：2015-06-09
申请号：US13269085
申请日：2011-10-07
申请人： Chia-Chih Yen , Che-Hua Shih , Chun-Chi Lin
发明人： Chia-Chih Yen , Che-Hua Shih , Chun-Chi Lin
IPC分类号： G06F17/50
CPC分类号： G06F17/5022
摘要： What-if simulation methods and systems are provided. A design coding in HDL (Hardware Description Language) and a simulation result corresponding to the design are provided. A what-if design scope and a what-if time window are received. A portion of the design is extracted from the design according to the what-if design scope, and primary input signals are determined during the extraction of the sub-design. Then, what-if simulation data is extracted from the simulation result according to the primary input signals and the what-if time window. A what-if test bench is generated according to the what-if simulation data, wherein the what-if simulation data is read, and the signal values are fed to a simulator according to the what-if test bench.
摘要翻译：提供假设的模拟方法和系统。提供了HDL（硬件描述语言）中的设计编码和与设计相对应的仿真结果。接收假设设计范围和假设时间窗口。根据设计范围从设计中提取设计的一部分，并且在提取子设计期间确定主输入信号。然后，根据主输入信号和假设时间窗从模拟结果中提取假设的数据。根据假设的仿真数据生成假设的试验台，其中如果假设的仿真数据被读取，并且根据假设的试验台将信号值馈送到模拟器。

7. 发明授权

US08866792B2 Method for scanning projective capacitive touch panel 有权
标题翻译：投影电容式触摸屏扫描方法
公开(公告)号：US08866792B2
公开(公告)日：2014-10-21
申请号：US12957409
申请日：2010-12-01
申请人： Wanqiu Wang , Chun-Chi Lin
发明人： Wanqiu Wang , Chun-Chi Lin
IPC分类号： G06F3/045 , G06F3/041 , G06F3/044
CPC分类号： G06F3/044 , G06F3/0416
摘要： The present invention relates to a method for scanning a projective capacitive touch panel. The method includes the following steps: scanning the mutual capacitance that are divided into at least two groups by applying different frequency excitation signals to different mutual capacitance groups, wherein a frequency of a excitation signal applied to a mutual capacitance group with greater RC constant is lower than that of a excitation signal applied to a mutual capacitance group with smaller RC constant; obtaining a first current voltage of each mutual capacitance; comparing the first current voltage with a first reference voltage to obtain candidate mutual capacitance whose first current voltage exceed the first reference voltage by a first threshold value; scanning the candidate mutual capacitance by applying a low frequency excitation signal; obtaining a second current voltage of each candidate mutual capacitance; comparing the second current voltage of each candidate mutual capacitance with a corresponding second reference voltage to obtain touched mutual capacitance whose second current voltage exceed the corresponding second reference voltage by a second threshold value.
摘要翻译：本发明涉及一种用于扫描投影电容式触摸屏的方法。该方法包括以下步骤：通过向不同的互电容组施加不同的频率激励信号来扫描被分成至少两组的互电容，其中施加到具有较大RC常数的互电容组的激励信号的频率较低比施加到具有较小RC常数的互电容组的激励信号的频率更高; 获得每个互电容的第一电流电压; 将第一电流电压与第一参考电压进行比较，以获得其第一电流电压超过第一参考电压第一阈值的候选互电容; 通过施加低频激励信号来扫描候选互电容; 获得每个候选互电容的第二电流电压; 将每个候选互电容的第二电流电压与对应的第二参考电压进行比较，以获得其第二电流电压超过对应的第二参考电压达到第二阈值的触摸的互电容。

8. 发明申请

US20120218648A1 IMAGE CAPTURE LENS MODULE AND WAFER LEVEL PACKAGED IMAGE CAPTURE DEVICES 有权
标题翻译：图像捕获镜头模块和水平包装图像捕获设备
公开(公告)号：US20120218648A1
公开(公告)日：2012-08-30
申请号：US13035391
申请日：2011-02-25
申请人： Chun-Chi LIN , Jau-Jan DENG , Wei-Ping CHEN
发明人： Chun-Chi LIN , Jau-Jan DENG , Wei-Ping CHEN
IPC分类号： G02B13/18
CPC分类号： G02B13/003 , G02B5/005 , G02B9/02 , G02B9/04 , G02B9/08 , G02B13/004 , G02B13/0085 , H01L27/14618 , H01L2924/0002 , H01L2924/00
摘要： Image capture lens modules and wafer level packaged image capture devices are presented. The image capture lens module includes a compound lens with a first lens element and a second lens element molded on both sides of a substrate, and a field stop disposed at an interface between the first lens element and the substrate or at an interface between the second lens element and the substrate, wherein the field stop is a coating layer with a polygonal transparent area.
摘要翻译：提出了图像采集镜头模块和晶片级封装图像捕获设备。图像拍摄透镜模块包括具有第一透镜元件和模制在基板的两侧上的第二透镜元件的复合透镜，以及设置在第一透镜元件和基板之间或第二透镜元件的第二透镜元件透镜元件和基板，其中场挡板是具有多边形透明区域的涂层。

9. 发明申请

US20120170226A1 PORTABLE ELECTRONIC DEVICE 有权
标题翻译：便携式电子设备
公开(公告)号：US20120170226A1
公开(公告)日：2012-07-05
申请号：US13091150
申请日：2011-04-21
申请人： Dong-Sen CHEN , Jen-Hsiang WANG , Chun-Chi LIN
发明人： Dong-Sen CHEN , Jen-Hsiang WANG , Chun-Chi LIN
IPC分类号： H05K7/14
CPC分类号： G06F1/1656 , G06F1/1613
摘要： A portable electronic device includes a main body, a door and a latch. The main body includes a positioning concave area on a bottom surface thereof. The positioning concave area has a cutout at a first edge, and an inclined surface and a guide edge at an opposite edge. The door is detachably connected with the bottom surface of the main body. The latch is slidably connected with a through hole of the door. The latch has an engaging portion and a guiding portion at two opposite ends. When the door is assembled to the bottom surface of the main body, the engaging portion inserts into the cutout. When the door is taken apart from the bottom surface, the engaging portion is removed from the cutout, and the guiding portion slides along the guide edge to move the door along a direction perpendicular to a long axis of the latch.
摘要翻译：便携式电子设备包括主体，门和闩锁。主体在其底面上具有定位凹部。定位凹区域在第一边缘处具有切口，在相对边缘处具有倾斜表面和引导边缘。门与主体的底面可拆卸地连接。闩锁可滑动地与门的通孔相连。闩锁在两个相对端具有接合部分和引导部分。当门组装到主体的底面时，接合部插入到切口中。当门从底表面分离时，接合部分从切口移除，并且引导部分沿着引导边缘滑动以沿着垂直于闩锁的长轴的方向移动门。

10. 发明授权

US07994531B2 White-light light emitting diode chips and fabrication methods thereof 有权
标题翻译：白光发光二极管芯片及其制造方法
公开(公告)号：US07994531B2
公开(公告)日：2011-08-09
申请号：US12417412
申请日：2009-04-02
申请人： Chun-Chi Lin , Tzu-Han Lin , Wei-Hung Kang
发明人： Chun-Chi Lin , Tzu-Han Lin , Wei-Hung Kang
IPC分类号： H01L33/00
CPC分类号： H01L33/508
摘要： A white-light LED chip and a fabrication method thereof are provided. The white-light LED chip comprises a blue-light LED chip and a phosphor layer directly disposed on a top surface of the blue-light LED chip. The method comprises providing a plurality of blue-light LED chips attached to a substrate, wherein at least one contact pad is formed on the top surface of each blue-light LED chip. A protective layer is formed on the contact pad. A phosphor layer is formed on the top surface of the blue-light LED chip by a molding process, exposing the contact pad. Finally, the protective layer and the substrate are removed from the blue-light LED chip to form a white-light LED chip.
摘要翻译：提供了一种白光LED芯片及其制造方法。白光LED芯片包括蓝光LED芯片和直接设置在蓝光LED芯片的顶表面上的荧光体层。该方法包括提供附着在基板上的多个蓝光LED芯片，其中至少一个接触焊盘形成在每个蓝光LED芯片的顶表面上。在接触垫上形成保护层。通过成型工艺在蓝光LED芯片的顶表面上形成荧光体层，露出接触垫。最后，从蓝光LED芯片去除保护层和基板，以形成白光LED芯片。

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