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1. 发明授权

US09435966B2 Lens device attachment to printed circuit board 有权
公开(公告)号：US09435966B2
公开(公告)日：2016-09-06
申请号：US14714672
申请日：2015-05-18
申请人： David J. K. Meadowcroft , Paul Yu
发明人： David J. K. Meadowcroft , Paul Yu
IPC分类号： G02B6/36 , G02B6/42 , H05K1/02 , H05K3/30 , G02B6/12
CPC分类号： G02B6/4244 , G02B6/12004 , G02B6/4214 , G02B6/4226 , G02B6/4237 , G02B6/4257 , H05K1/0269 , H05K1/0274 , H05K3/303 , H05K2201/09918 , H05K2201/10121 , H05K2203/1305 , H05K2203/1327 , Y02P70/613 , Y10T29/4913
摘要： An optical assembly can be formed by providing a frame made of a plastic material on a surface of a printed circuit board (PCB), mounting at least one opto-electronic element on the surface of the PCB within the frame, and laser-welding a lens device onto the frame.

2. 发明授权

US08974125B2 Air-cooled optical transceiver module system 有权
标题翻译：风冷光收发模块系统
公开(公告)号：US08974125B2
公开(公告)日：2015-03-10
申请号：US13595784
申请日：2012-08-27
申请人： Laurence R. McColloch , David J. K. Meadowcroft , Paul Yu
发明人： Laurence R. McColloch , David J. K. Meadowcroft , Paul Yu
IPC分类号： G02B6/36 , H04B10/00 , H04B10/40
CPC分类号： H04B10/40 , Y10T29/49826
摘要： In an opto-electronic system having one or more optical transceiver modules and an enclosure, air is forced through the interior of the transceiver module to dissipate heat generated by the opto-electronic and electronic elements.
摘要翻译：在具有一个或多个光收发器模块和外壳的光电系统中，迫使空气通过收发器模块的内部以散发由光电子元件和电子元件产生的热量。

3. 发明授权

US08911158B2 Z-pluggable optical communications module, an optical communications system, and a method 有权
标题翻译： Z可插拔光通信模块，光通信系统和方法
公开(公告)号：US08911158B2
公开(公告)日：2014-12-16
申请号：US13543930
申请日：2012-07-09
申请人： Laurence R. McColloch , Seng-Kum Chan , David J. K. Meadowcroft
发明人： Laurence R. McColloch , Seng-Kum Chan , David J. K. Meadowcroft
IPC分类号： G02B6/36
CPC分类号： H04B10/14 , G02B6/4278 , Y10T29/49117
摘要： A Z-pluggable optical communications module (OCM) is provided that contains multiple parallel OCMs (POCMs) and that is configured to be removably plugged into an opening formed in a front panel of an optical communications system. When the Z-pluggable OCM is plugged in a forward Z-direction into the opening formed in the front panel, an actuator mechanism is actuated to impart motion to the Z-pluggable OCM in the downward Y-direction to cause the Z-pluggable OCM to be mounted on an upper surface of a motherboard PCB. In order to unplug the Z-pluggable OCM, the actuator mechanism is actuated to impart motion to the Z-pluggable OCM in the upward Y-direction to cause it to be dismounted from the motherboard PCB.
摘要翻译：提供了一种可插拔光通信模块（OCM），其包含多个并行OCM（POCM），并且被配置为可移除地插入形成在光通信系统的前面板中的开口中。当Z可插拔OCM插入到前面板中形成的开口的Z方向时，致动器机构被致动以向Z方向的可插拔OCM施加运动，以使可插拔的OCM 以安装在母板PCB的上表面上。为了拔下可插拔的OCM，致动器机构被致动，以向上Y方向的Z可插拔OCM提供运动，使其从主板PCB上卸下。

4. 发明授权

US08456185B2 Test adapter and method for achieving optical alignment and thermal coupling thereof with a device under test 有权
标题翻译：用于实现与被测器件的光学对准和热耦合的测试适配器和方法
公开(公告)号：US08456185B2
公开(公告)日：2013-06-04
申请号：US12858424
申请日：2010-08-17
申请人： Frank Yashar , David J. K. Meadowcroft , Seng-Kum Chan
发明人： Frank Yashar , David J. K. Meadowcroft , Seng-Kum Chan
IPC分类号： G01R31/20
CPC分类号： G01R31/2893 , H01S5/0014
摘要： Independent assemblies are compliantly mounted to a force transfer mechanism to optically align and thermally couple a device under test (DUT) to a test apparatus. A first assembly includes an optical connector. The first assembly has an alignment feature and a first compliant interface. A second assembly includes a thermal control member and force transfer members coupled to a structure. A passage permits a portion of the arm of the first assembly to extend through the structure. The force transfer members provide respective seats for an additional compliant interface. The alignment feature engages a corresponding feature to align the optical connector with the DUT before the compliant interfaces compress under an external force. Compliant mounting of the assemblies accommodates manufacturing tolerances in the DUT so that contact forces on the DUT are relatively consistent and thereby enable consistent optical and thermal coupling between the test apparatus and the DUT.
摘要翻译：独立的组件被顺从地安装到力传递机构以将测试装置（DUT）光学对准和热耦合到测试装置。第一组件包括光连接器。第一组件具有对准特征和第一兼容接口。第二组件包括耦合到结构的热控制构件和力传递构件。通道允许第一组件的臂的一部分延伸穿过结构。力传递构件为附加的柔性接口提供相应的座。对准特征在相应的接口在外力作用下压缩之前，将相应的特征与光学连接器与DUT对准。组件的标准安装容纳DUT中的制造公差，使得DUT上的接触力相对一致，从而实现测试设备和DUT之间的一致的光学和热耦合。

5. 发明授权

US08414309B2 Receptacle for an optical transceiver module for protecting the module from airborne particles 有权
标题翻译：用于保护模块免受空气传播的颗粒的光收发模块的插座
公开(公告)号：US08414309B2
公开(公告)日：2013-04-09
申请号：US12772462
申请日：2010-05-03
申请人： David J. K. Meadowcroft , Seng-Kum Chan
发明人： David J. K. Meadowcroft , Seng-Kum Chan
IPC分类号： H01R4/38
CPC分类号： G02B6/4251 , G02B6/4214 , G02B6/4246 , G02B6/4249 , G02B6/4261 , G02B6/4284 , G02B6/4292
摘要： A protective socket is provided for use with a parallel optical transceiver module. When the parallel optical transceiver module is seated within a receptacle of the protective socket, the side walls and bottom that define the receptacle of the protective socket protect the internal components of the parallel optical transceiver module from dirt, dust, gases, and other airborne matter.
摘要翻译：提供了一个用于并行光收发模块的保护插座。当并行光收发器模块位于保护插座的插座中时，限定保护插座的插座的侧壁和底部保护并行光收发器模块的内部组件免受灰尘，灰尘，气体和其他空气物质的影响。

6. 发明授权

US08098437B2 Lens device having protective elements 失效
标题翻译：具有保护元件的透镜装置
公开(公告)号：US08098437B2
公开(公告)日：2012-01-17
申请号：US12819879
申请日：2010-06-21
申请人： Seng-Kum Chan , David J. K. Meadowcroft , Paul Yu
发明人： Seng-Kum Chan , David J. K. Meadowcroft , Paul Yu
IPC分类号： G02B27/10 , G03B21/60
CPC分类号： G02B6/4206 , G02B3/0025 , G02B6/4249
摘要： A lens device has a body with a base surface, a plurality of lenses on the base surface, and a plurality of projections extending above the base surface and defining a protective plane above the plurality of lenses. The plurality of projections can include, for example, post-like regions, ridge-like regions, or a combination thereof.
摘要翻译：透镜装置具有基体表面的主体，基底表面上的多个透镜，以及在基底表面上延伸并在多个透镜上方形成保护平面的多个突起。多个突起可以包括例如后状区域，脊状区域或其组合。

7. 发明授权

US08041160B2 Optical communications device having a mounting core and method 有权
标题翻译：具有安装核心和方法的光通信设备
公开(公告)号：US08041160B2
公开(公告)日：2011-10-18
申请号：US12424273
申请日：2009-04-15
申请人： David J. K. Meadowcroft , An-Nien Cheng , Ronald T. Kaneshiro
发明人： David J. K. Meadowcroft , An-Nien Cheng , Ronald T. Kaneshiro
IPC分类号： G02B6/12
CPC分类号： G02B6/4249 , Y10T29/49117
摘要： A parallel optical communications device is provided that has a mounting core that functions as a mounting system for mounting core components of the parallel optical communications device. In addition, the mounting core functions as a heat dissipation system for the core components of the parallel optical communications device, and also protects the core components and other elements of the communications device from dust and damage that can be caused by handling and other factors. In addition to performing the aforementioned functions, the mounting core is configured to enable the parallel optical communications device to be made extremely small in size while also protecting signal integrity.
摘要翻译：提供了一种并行光通信设备，其具有用作安装并行光通信设备的核心部件的安装系统的安装芯。此外，安装芯体用作并行光通信设备的核心部件的散热系统，并且还保护通信设备的核心部件和其他元件免受可能由处理和其他因素引起的灰尘和损坏。除了执行上述功能之外，安装芯被配置为使并行光通信设备的尺寸非常小，同时也保护信号完整性。

8. 发明授权

US07906372B2 Lens support and wirebond protector 有权
标题翻译：镜头支架和导线保护器
公开(公告)号：US07906372B2
公开(公告)日：2011-03-15
申请号：US12169784
申请日：2008-07-09
申请人： David J. K. Meadowcroft
发明人： David J. K. Meadowcroft
IPC分类号： H01L21/00
CPC分类号： H01S5/02248 , G02B6/4201 , G02B6/4246 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/48091 , H01L2224/484 , H01L2224/4899 , H01L2224/49175 , H01L2224/78 , H01L2224/85201 , H01L2224/85205 , H01L2224/8592 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/12042 , H01L2924/12043 , H01L2924/181 , H01L2924/3025 , H01S5/005 , H01S5/183 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要： A wirebond protector has an elongated shape that corresponds to the elongated array of wirebonds along the edge of a microelectronic device that connect a semiconductor die to electrical conductors on a substrate. In making the microelectronic device with wirebond protection, wirebonds are first formed in the conventional manner The wirebond protector is then attached to the device in an orientation in which it extends along the array of wirebonds to at least partially cover the wirebonds.
摘要翻译：引线键保护器具有细长形状，其对应于沿着将半导体管芯连接到衬底上的电导体的微电子器件的边缘的细长的引线阵列。在制造具有引线接合保护的微电子器件时，首先以常规方式形成引线。然后，引线键合保护器以沿着引线键阵列延伸的方向附接到器件，以至少部分地覆盖引线键。

9. 发明申请

US20100232800A1 PARALLEL OPTICAL TRANSCEIVER MODULE HAVING A HEAT DISSIPATION SYSTEM THAT DISSIPATES HEAT AND PROTECTS COMPONENTS OF THE MODULE FROM PARTICULATES AND HANDLING 有权
标题翻译：具有热分散系统的平行光学收发器模块，用于散热和保护模块的组件从颗粒和处理中分离
公开(公告)号：US20100232800A1
公开(公告)日：2010-09-16
申请号：US12400919
申请日：2009-03-10
申请人： David J. K. Meadowcroft , Debo Adebiyi
发明人： David J. K. Meadowcroft , Debo Adebiyi
IPC分类号： H04B10/00
CPC分类号： G02B6/4246 , H01L2924/0002 , H01L2924/00
摘要： A parallel optical transceiver module is provided that has a heat dissipation system that dissipates large amounts of heat, while also protecting the laser diodes, ICs and other components of the module from particulates, such as dust, for example, and from mechanical handling forces. The heat dissipation system is configured to be secured to the optical subassembly (OSA) of the module such that when the OSA is secured to the upper surface of the leadframe of the module, the OSA and the heat dissipation system cooperate to encapsulate at least the laser diodes and laser diode driver IC in a way that protects these components from dust and other particulates and from external mechanical forces. The heat dissipation system of the module is disposed for coupling with an external heat dissipation system, e.g., with a heat dissipation system that is provided by the customer.
摘要翻译：提供了一种并行光收发器模块，其具有消散大量热量的散热系统，同时还保护模块的激光二极管，IC和其它部件免受诸如灰尘等微粒和机械处理力的影响。散热系统被配置为固定到模块的光学子组件（OSA），使得当OSA被固定到模块的引线框架的上表面时，OSA和散热系统协作以至少封装激光二极管和激光二极管驱动器IC，以保护这些部件免受灰尘和其他颗粒物和外部机械力的影响。模块的散热系统设置成与外部散热系统（例如，由客户提供的散热系统）耦合。

10. 发明授权

US09146368B2 Methods and systems for dissipating heat in optical communications modules 有权
标题翻译：在光通信模块中散热的方法和系统
公开(公告)号：US09146368B2
公开(公告)日：2015-09-29
申请号：US13600334
申请日：2012-08-31
申请人： Seng-Kum Chan , David J. K. Meadowcroft
发明人： Seng-Kum Chan , David J. K. Meadowcroft
IPC分类号： G02B6/42 , H05K1/02 , H05K1/00 , H05K7/20
CPC分类号： G02B6/428 , G02B6/4269 , H05K1/0209 , H05K7/2039 , H05K7/2049 , H05K2201/10106 , H05K2201/10121 , H05K2201/10174
摘要： Heat dissipation resources are allocated in an optical communications module based on the sensitivity of electrical and optoelectronic components of the module to temperature. Components that have a higher sensitivity to temperature are allocated a greater proportion of available heat dissipation resources than components that have a lower sensitivity to temperature. In addition, heat dissipation resources that are allocated to components that have different sensitivities to temperature are thermally decoupled from one another.
摘要翻译：散热资源根据模块的电气和光电组件对温度的灵敏度在光通信模块中分配。具有较高温度敏感性的组件比具有较低温度敏感性的组分分配更多的可用散热资源。此外，分配给具有不同温度敏感度的部件的散热资源彼此热分解。

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