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1. 发明授权

US09134342B2 Intergrated apparatus and method for testing of semiconductor components using a turret machine 有权
标题翻译：使用转塔机测试半导体元件的集成设备和方法
公开(公告)号：US09134342B2
公开(公告)日：2015-09-15
申请号：US13901658
申请日：2013-05-24
申请人： EXIS TECH SDN BHD
发明人： Heng Lee Lee
IPC分类号： G01R31/26 , G01R1/04 , G01R31/01 , G01R31/28
CPC分类号： G01R1/0408 , G01R31/01 , G01R31/26 , G01R31/2893
摘要： The invention discloses a semiconductor components delivery system associated with a turret type testing apparatus for testing integrity and functionality of semiconductor components wherein at least two input feeders loadable with semiconductor components to be vision checked, tested and/or packed are provided. The delivery system is also provided with multiple output means such as a tube, a tape or a bin or a combination thereof for semiconductor components determined to be non defective.
摘要翻译：本发明公开了一种与用于测试半导体部件的完整性和功能性的转台式测试装置相关联的半导体部件传送系统，其中至少两个输入馈送器可以被半导体部件加载以进行视觉检查，测试和/或打包。输送系统还设置有被确定为无缺陷的半导体部件的多个输出装置，例如管，带或箱或其组合。

2. 发明申请

US20140212246A1 APPARATUS FOR PICKING, PLACING AND PRESSING SEMICONDUCTOR COMPONENTS 有权
标题翻译：拾取，放置和压制半导体元件的装置
公开(公告)号：US20140212246A1
公开(公告)日：2014-07-31
申请号：US14164361
申请日：2014-01-27
申请人： EXIS TECH SDN BHD
发明人： HENG LEE LEE
IPC分类号： H01L21/677
CPC分类号： H01L21/67132 , G01R31/26 , H05K13/0404 , H05K13/041
摘要： An apparatus for picking and placing or for picking and transferring or for picking, placing and pressing semiconductor components (10) is disclosed. The apparatus (10) comprises a motor for generating power to rotate a turret (6) which holds a plurality of pick up heads (7), a plurality of pressers (8), wherein each of said pressers (8) is a voice coil assembly (3) which consist of voice coil actuator assemblies (31), at least one stationary frame (1, 2) to secure said voice coil assemblies (3) and a controller means to control the direction and magnitude of displacement of said voice coil actuator assemblies (31). When current flows into voice coil in said voice coil actuator assembly (31), electromagnetic force is generated in vertical direction, forcing said actuators to press said pick up heads (7) located directly below said actuators at a particular moment, which in turn reaches to and press on wafers or semiconductor components located below said pick up heads. The pressing force, speed and direction of each actuator can be controlled individually. Furthermore, this invention includes safety measures wherein a real time actuator position feedback system is used to confirm the displacement of said actuators and an urging device (35) is used to return the actuators back to their original position in the event of power outage.
摘要翻译：公开了一种用于拾取和放置或用于拾取和转移或用于拾取，放置和按压半导体部件（10）的设备。所述装置（10）包括用于产生动力的马达，用于旋转保持多个拾取头（7）的转台（6），多个按压器（8），其中每个所述按压件（8）是音圈组件（3），其由音圈致动器组件（31）组成，至少一个固定框架（1,2），用于固定所述音圈组件（3）;以及控制器装置，用于控制所述音圈的位移方向和幅度致动器组件（31）。当电流流入所述音圈致动器组件（31）中的音圈时，在垂直方向上产生电磁力，迫使所述致动器在特定时刻将位于所述致动器正下方的所述拾取头（7）按压并且压在位于所述拾取头下方的晶片或半导体元件上。每个执行器的按压力，速度和方向可以单独控制。此外，本发明包括安全措施，其中使用实时致动器位置反馈系统来确认所述致动器的位移，并且在停电的情况下使用推动装置（35）使致动器返回到其原始位置。

3. 发明申请

US20160240416A1 DEVICE AND METHOD FOR CONVEYING AND FLIPPING A COMPONENT 审中-公开
标题翻译：用于输送和分配组件的装置和方法
公开(公告)号：US20160240416A1
公开(公告)日：2016-08-18
申请号：US14737891
申请日：2015-06-12
申请人： EXIS TECH SDN BHD
发明人： HENG LEE LEE
IPC分类号： H01L21/677 , H01L21/67 , H01L21/68 , B65G47/248
CPC分类号： H01L21/67718 , H01L21/67721
摘要： The present invention relates to a device (1) and method for conveying and flipping a component (10) for use in conjunction with a rotary turret module (30). The device (1) includes at least a pair of spaced apart flipping arms, a first and second flipping arms (100 and 300) mounted on a platform (500). Each of the flipping arms (100, 300) is provided with one nozzle (110, 310) having one end (111) configured to pick the component (10) and another end (311) fixedly mounted on a shaft (130, 330) supported on the flipping arm (100, 300) and is operatively connected to a rotary actuating means (150, 350). The rotary actuating means (150, 350) is adapted to be capable of affecting a rotational motion of the shaft (130, 330), thereby rotating the nozzles (110, 310) in a counter direction by substantially 90 degrees. The device is also provided with a linear actuating means (400) suitably mounted on the platform (500). The linear actuating means (400) is operatively connected to at least one of to the flipping arms (100, 300 or 100 and 300) and is adapted to be capable of moving the flipping arm (100, 300) or arms (100 and 300) in a horizontal direction so as to position the nozzles (110, 310) substantially proximate to each other for transferring of the component (10) between the nozzles (110, 310) and thereby, flipping the component (10) at 180 degrees.
摘要翻译：本发明涉及一种用于与旋转转塔模块（30）一起使用的用于输送和翻转部件（10）的装置（1）和方法。装置（1）至少包括一对间隔开的翻转臂，安装在平台（500）上的第一和第二翻转臂（100和300）。每个翻转臂（100,300）设置有一个喷嘴（110,310），其具有构造成拾取部件（10）的一端（111）和固定地安装在轴（130,330）上的另一端（311）支撑在翻转臂（100,300）上并且可操作地连接到旋转致动装置（150,350）。旋转致动装置（150,350）适于能够影响轴（130,330）的旋转运动，从而使喷嘴（110,310）在相反方向上旋转大致90度。该装置还设置有适当地安装在平台（500）上的线性致动装置（400）。线性致动装置（400）可操作地连接到翻转臂（100,300或100和300）中的至少一个，并且适于能够移动翻转臂（100,300）或臂（100和300）），以便将喷嘴（110,310）基本上彼此靠近定位，以将部件（10）在喷嘴（110,310）之间传送，从而将部件（10）翻转成180度。

4. 发明授权

US09443747B2 Apparatus for transferring and manipulating semiconductor components 有权
标题翻译：用于传送和操纵半导体元件的装置
公开(公告)号：US09443747B2
公开(公告)日：2016-09-13
申请号：US14164361
申请日：2014-01-27
申请人： EXIS TECH SDN BHD
发明人： Heng Lee Lee
IPC分类号： G01R31/00 , H01L21/67 , G01R31/26 , H05K13/04
CPC分类号： H01L21/67132 , G01R31/26 , H05K13/0404 , H05K13/041
摘要： An apparatus for picking and placing or for picking and transferring or for picking, placing and pressing semiconductor components (10) is disclosed. The apparatus (10) comprises a motor for generating power to rotate a turret (6) which holds a plurality of pick up heads (7), a plurality of pressers (8), wherein each of said pressers (8) is a voice coil assembly (3) which consist of voice coil actuator assemblies (31), at least one stationary frame (1, 2) to secure said voice coil assemblies (3) and a controller means to control the direction and magnitude of displacement of said voice coil actuator assemblies (31). When current flows into voice coil in said voice coil actuator assembly (31), electromagnetic force is generated in vertical direction, forcing said actuators to press said pick up heads (7) located directly below said actuators at a particular moment, which in turn reaches to and press on wafers or semiconductor components located below said pick up heads. The pressing force, speed and direction of each actuator can be controlled individually. Furthermore, this invention includes safety measures wherein a real time actuator position feedback system is used to confirm the displacement of said actuators and an urging device (35) is used to return the actuators back to their original position in the event of power outage.
摘要翻译：公开了一种用于拾取和放置或用于拾取和转移或用于拾取，放置和按压半导体部件（10）的设备。所述装置（10）包括用于产生动力的马达，用于旋转保持多个拾取头（7）的转台（6），多个按压器（8），其中每个所述按压件（8）是音圈组件（3），其由音圈致动器组件（31）组成，至少一个固定框架（1,2），用于固定所述音圈组件（3）;以及控制器装置，用于控制所述音圈的位移方向和幅度致动器组件（31）。当电流流入所述音圈致动器组件（31）中的音圈时，在垂直方向上产生电磁力，迫使所述致动器在特定时刻将位于所述致动器正下方的所述拾取头（7）按压并且压在位于所述拾取头下方的晶片或半导体元件上。每个执行器的按压力，速度和方向可以单独控制。此外，本发明包括安全措施，其中使用实时致动器位置反馈系统来确认所述致动器的位移，并且在停电的情况下使用推动装置（35）使致动器返回到其原始位置。

5. 发明申请

US20130314113A1 INTERGRATED APPARATUS AND METHOD FOR TESTING OF SEMICONDUCTOR COMPONENTS USING A TURRET MACHINE 有权
标题翻译：使用电脑机器测量半导体元件的互动装置和方法
公开(公告)号：US20130314113A1
公开(公告)日：2013-11-28
申请号：US13901658
申请日：2013-05-24
申请人： EXIS TECH SDN BHD
发明人： HENG LEE LEE
IPC分类号： G01R1/04 , G01R31/26
CPC分类号： G01R1/0408 , G01R31/01 , G01R31/26 , G01R31/2893
摘要： The invention discloses a semiconductor components delivery system associated with a turret type testing apparatus for testing integrity and functionality of semiconductor components wherein at least two input feeders loadable with semiconductor components to be vision checked, tested and/or packed are provided. The delivery system is also provided with multiple output means such as a tube, a tape or a bin or a combination thereof for semiconductor components determined to be non defective.
摘要翻译：本发明公开了一种与用于测试半导体部件的完整性和功能性的转台式测试装置相关联的半导体部件传送系统，其中至少两个输入馈送器可以被半导体部件加载以进行视觉检查，测试和/或打包。输送系统还设置有被确定为无缺陷的半导体部件的多个输出装置，例如管，带或箱或其组合。

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