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1. 发明授权

US09270005B2 Laminate structures having a hole surrounding a probe for propagating millimeter waves 有权
标题翻译：具有围绕探针的孔的叠层结构，用于传播毫米波
公开(公告)号：US09270005B2
公开(公告)日：2016-02-23
申请号：US13527698
申请日：2012-06-20
申请人： Yigal Leiba , Elad Dayan
发明人： Yigal Leiba , Elad Dayan
IPC分类号： H01P5/107 , H01P3/00 , H01P3/12 , H01P11/00
CPC分类号： H01P5/107 , H01P3/003 , H01P3/121 , H01P11/002 , Y10T156/1052
摘要： Various embodiments of millimeter-wave systems on a printed circuit board, including a microstrip, a probe, and an RF integrated circuit, as well as methods for manufacturing said systems. Various embodiments have holes extending through lamina in the PCB, thereby improving radiation propagation. Various embodiments have conductive cages created by multiple through-holes extending through lamina in the PCB, thereby increasing radiation propagation. The manufacture of such systems is easier and less expensive than the manufacture of current systems.
摘要翻译：包括微带，探针和RF集成电路的印刷电路板上的毫米波系统的各种实施例，以及用于制造所述系统的方法。各种实施例具有延伸穿过PCB中的层的孔，从而改善辐射传播。各种实施例具有通过延伸穿过PCB中的层的多个通孔产生的导电笼，从而增加辐射传播。这种系统的制造比当前系统的制造更容易且更便宜。

2. 发明授权

US08912859B2 Transition between a laminated PCB and a waveguide including a lamina with a printed conductive surface functioning as a waveguide-backshort 有权
标题翻译：叠层PCB和波导之间的转换，其包括具有用作波导 - 回溯的印刷导电表面的层
公开(公告)号：US08912859B2
公开(公告)日：2014-12-16
申请号：US13031285
申请日：2011-02-21
申请人： Yigal Leiba , Elad Dayan , Baruch Schwarz , Amir Shmuel
发明人： Yigal Leiba , Elad Dayan , Baruch Schwarz , Amir Shmuel
IPC分类号： H01P5/107 , H01P3/12 , H01P11/00
CPC分类号： H01P5/107 , H01P3/121 , H01P11/002
摘要： A system for directing electromagnetic millimeter-waves towards a waveguide using an electrically conductive formation within a Printed Circuit Board (PCB). The system includes a waveguide having an aperture and at least two laminas belonging to a PCB. A first electrically conductive surface printed on one of the laminas is located over the aperture such that the first electrically conductive surface covers at least most of the aperture. A plurality of Vertical Interconnect Access (VIA) holes, optionally filled or plated with an electrically conductive material, are electrically connecting the first electrically conductive surface to the waveguide, forming an electrically conductive cage over the aperture. Optionally, a probe printed on one of the laminas of the PCB is located inside the cage and over the aperture.
摘要翻译：使用印刷电路板（PCB）内的导电结构将电磁毫米波引向波导的系统。该系统包括具有孔和至少两个属于PCB的薄片的波导。印刷在一个薄片上的第一导电表面位于孔的上方，使得第一导电表面至少覆盖大部分孔。可选地填充或镀有导电材料的多个垂直互连访问（VIA）孔将第一导电表面电连接到波导，在孔上形成导电笼。可选地，印刷在PCB的一个层压板上的探针位于笼内并且在孔上方。

3. 发明申请

US20120050125A1 SYSTEMS FOR INTERFACING WAVEGUIDE ANTENNA FEEDS WITH PRINTED CIRCUIT BOARDS 有权
标题翻译：波导天线馈线与印刷电路板接口的系统
公开(公告)号：US20120050125A1
公开(公告)日：2012-03-01
申请号：US12873105
申请日：2010-08-31
申请人： Yigal Leiba , Elad Dayan
发明人： Yigal Leiba , Elad Dayan
IPC分类号： H01Q1/00 , H01Q19/10
CPC分类号： H01Q1/38 , H01L2224/16225 , H01L2224/73265 , H01Q1/2283 , H01Q1/48 , H01Q9/0407 , H01Q9/38 , H01Q9/40 , H01Q13/02
摘要： A millimeter-wave communication system includes (i) an antenna comprising a reflector and a feed, the feed comprising a first waveguide, (ii) a Printed Circuit Board (PCB) comprising a modem, a processor, and a radio receiver coupled with a probe, the PCB is mechanically fixed to one end of the feed, such that the PCB is mechanically held by the feed, and the probe is located in a position allowing reception of millimeter-waves exiting the first waveguide towards the PCB, (iii) an Ethernet connector, (iv) at least one flexible cable operative to carry Ethernet signals between the first PCB and the Ethernet connector, and (v) a box housing the PCB and the Ethernet connector. The Ethernet connector and the feed are mechanically fixed to the box, and the only mechanical connection between the PCB and the box is via the feed.
摘要翻译：毫米波通信系统包括（i）包括反射器和馈电的天线，所述馈电包括第一波导，（ii）包括调制解调器，处理器和无线电接收器的印刷电路板（PCB）探针，PCB被机械地固定在馈电的一端，使得PCB被进给机械地保持，并且探头位于允许接收离开第一波导的毫米波朝向PCB的位置，（iii）以太网连接器，（iv）至少一个可操作以在第一PCB和以太网连接器之间传送以太网信号的柔性电缆，以及（v）容纳PCB和以太网连接器的盒子。以太网连接器和进给机构机械固定在箱体上，PCB和箱体之间的唯一机械连接是通过进给。

4. 发明申请

US20110140799A1 Low-Loss Millimeter-Wave Interface Comprising a Bare-Die 有权
标题翻译：低损耗毫米波接口包括裸芯片
公开(公告)号：US20110140799A1
公开(公告)日：2011-06-16
申请号：US13031291
申请日：2011-02-21
申请人： Yonatan Biran , Elad Dayan , Baruch Schwarz , Amir Shmuel , Yigal Leiba
发明人： Yonatan Biran , Elad Dayan , Baruch Schwarz , Amir Shmuel , Yigal Leiba
IPC分类号： H03H7/38 , H03H7/42
CPC分类号： H01P5/107 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/16195 , H01P3/121 , H01P5/08 , H01P11/002 , H01L2924/00014
摘要： A system for matching impedances of a bare-die Integrated Circuit and bonding wires. A bare-die Integrated Circuit is configured to output or input, at an impedance of Z3, a millimeter-wave signal from three electrically conductive contacts. Three electrically conductive pads, printed on one of the laminas of a Printed Circuit Board (PCB) are connected to the three electrically conductive contacts via three bonding wires respectively, the bonding wires have a characteristic impedance of Z1, wherein Z1>Z3. One of the electrically conductive pads extends to form a transmission line signal trace of length L, the transmission line signal trace having a first width resulting in characteristic impedance of Z2, wherein Z2>Z3. The transmission line signal trace widens to a second width, higher than the first width, after the length of L, decreasing the characteristic impedance of the transmission line signal trace to substantially Z3 after the length L and onwards.
摘要翻译：用于匹配裸片集成电路和接合线的阻抗的系统。裸片集成电路被配置为以三个导电触点的Z3的阻抗输出或输入毫米波信号。印刷在印刷电路板（PCB）的层叠之一上的三个导电焊盘分别通过三个接合线连接到三个导电触点，接合线具有Z1的特性阻抗，其中Z1> Z3。导电焊盘中的一个延伸以形成长度为L的传输线信号迹线，传输线信号迹线具有导致Z2的特性阻抗的第一宽度，其中Z2> Z3。在长度L之后，传输线信号迹线变宽到高于第一宽度的第二宽度，在传输线信号迹线的特征阻抗在长度L和之后降低到基本上Z3。

5. 发明授权

US08917151B2 Transition between a laminated PCB and a waveguide through a cavity in the laminated PCB 有权
标题翻译：层压PCB和波导之间的过渡通过层压PCB中的空腔
公开(公告)号：US08917151B2
公开(公告)日：2014-12-23
申请号：US13031277
申请日：2011-02-21
申请人： Elad Dayan , Yigal Leiba , Baruch Schwarz , Amir Shmuel
发明人： Elad Dayan , Yigal Leiba , Baruch Schwarz , Amir Shmuel
IPC分类号： H01P5/107 , H01P3/12 , H01P11/00
CPC分类号： H01P5/107 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01P3/121 , H01P11/002 , H01L2924/00014
摘要： A system for injecting and guiding millimeter-waves through a Printed Circuit Board (PCB) including at least two laminas belonging to a PCB, an electrically conductive plating applied on the insulating walls of a cavity formed perpendicularly through the laminas, and optionally a probe located above the cavity printed on a lamina belonging to the PCB. Optionally, the cavity guides millimeter-waves injected by the probe at one side of the cavity to the other side of the cavity.
摘要翻译：一种用于通过印刷电路板（PCB）注入和引导毫米波的系统，该印刷电路板包括至少两个属于PCB的薄片，施加在垂直穿过薄片形成的空腔的绝缘壁上的导电电镀，以及可选地位于在印刷在属于PCB的层板上的空腔之上。可选地，空腔将由探针在腔的一侧注入的毫米波引导到空腔的另一侧。

6. 发明授权

US08912860B2 Millimeter-wave bare IC mounted within a laminated PCB and usable in a waveguide transition 有权
标题翻译：毫米波裸IC安装在层压PCB中，可用于波导过渡
公开(公告)号：US08912860B2
公开(公告)日：2014-12-16
申请号：US13031289
申请日：2011-02-21
申请人： Yigal Leiba , Elad Dayan , Baruch Schwarz , Amir Shmuel
发明人： Yigal Leiba , Elad Dayan , Baruch Schwarz , Amir Shmuel
IPC分类号： H01P5/107 , H01P11/00 , H01P3/12
CPC分类号： H01P5/107 , H01L2223/6677 , H01L2224/16227 , H01L2224/16235 , H01L2224/48091 , H01L2224/48227 , H01L2924/15153 , H01L2924/15159 , H01L2924/15313 , H01L2924/16195 , H01P3/121 , H01P11/002
摘要： A system enabling interface between a millimeter-wave bare-die and a Printed Circuit Board (PCB). A cavity of depth X is formed in at least one lamina of a PCB. Three electrically conductive pads are printed on one of the laminas of the PCB, the pads optionally reach the edge of the cavity. A bare-die Integrated Circuit having a thickness of optionally X, or a heightened bare-die Integrated Circuit having a thickness of optionally X, output a millimeter-wave signal from three electrically conductive contacts arranged in a ground-signal-ground configuration on an upper side edge of the bare-die Integrated Circuit. The bare-die Integrated Circuit is placed inside the cavity, optionally such that the electrically conductive pads and the upper side edge containing the electrically conductive contacts are arranged side-by-side at substantially the same height. Three bonding wires or strips electrically connect each electrically conductive contact to one of the electrically conductive pads.
摘要翻译：一种能够在毫米波裸片和印刷电路板（PCB）之间进行接口的系统。在PCB的至少一层中形成深度为X的空腔。三个导电焊盘印刷在PCB的一个层叠板上，焊盘可选择地到达空腔的边缘。具有可选择的X的厚度的裸片式集成电路或具有任选的X的厚度的升高的裸芯片集成电路输出来自布置在接地信号地配置中的三个导电触点的毫米波信号裸片集成电路的上侧边缘。裸模集成电路放置在空腔内，可选地使得导电焊盘和包含导电触头的上侧边缘并排设置在基本相同的高度。三个接合线或条带将每个导电触点电连接到导电焊盘之一。

7. 发明授权

US08912858B2 Interfacing between an integrated circuit and a waveguide through a cavity located in a soft laminate 有权
标题翻译：通过位于软层压板中的腔体在集成电路和波导之间进行接合
公开(公告)号：US08912858B2
公开(公告)日：2014-12-16
申请号：US12554987
申请日：2009-09-08
申请人： Elad Dayan , Amir Shmuel , Yigal Leiba , Baruch Schwarz
发明人： Elad Dayan , Amir Shmuel , Yigal Leiba , Baruch Schwarz
IPC分类号： H01P5/107
CPC分类号： H01P5/107 , Y10T29/49016
摘要： A low-loss interface between a mm-wave integrated circuit and a waveguide comprises a surface having a contact location for said integrated circuit and a waveguide location for fixing a waveguide thereon; a transmission line extending along said surface from said contact location to the waveguide location and extending into the waveguide location as a waveguide feed; and a connection bump on a surface of the mm-wave integrated circuit. The mm-wave integrated circuit RFIC is connected to the surface at the contact location through the connection bump, such as to connect a signal output of the RFIC to the transmission line, thereby providing said low loss interface.
摘要翻译：毫米波集成电路和波导之间的低损耗接口包括具有用于所述集成电路的接触位置的表面和用于在其上固定波导的波导位置; 传输线，沿着所述表面从所述接触位置延伸到波导位置，并作为波导馈送延伸到波导位置; 以及在mm波形集成电路的表面上的连接凸块。毫米波集成电路RFIC通过连接凸块连接到接触位置处的表面，例如将RFIC的信号输出连接到传输线，从而提供所述低损耗接口。

8. 发明申请

US20110299256A1 PACKAGING FOR A MILLIMETER WAVE RADIO-FREQUENCY INTEGRATED CIRCUIT (RFIC) 有权
标题翻译：用于微波无线电频率集成电路（RFIC）的封装
公开(公告)号：US20110299256A1
公开(公告)日：2011-12-08
申请号：US12791936
申请日：2010-06-02
申请人： Yigal Leiba , Elad Dayan
发明人： Yigal Leiba , Elad Dayan
IPC分类号： H05K7/02 , H05K3/10
CPC分类号： H05K3/4697 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/16 , H01L2224/05554 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H01L2924/30111 , H01Q1/2283 , H05K1/0219 , H05K1/0243 , H05K1/025 , H05K1/185 , H05K3/4629 , H05K2201/09618 , H05K2201/09727 , H05K2201/10098 , Y10T29/49155 , H01L2924/00 , H01L2224/05599
摘要： Millimeter wave radio-frequency integrated circuit device comprises a housing and a millimeter wave radio frequency integrated circuit, the housing comprising a plurality of layers laminated together and two cavities defined by apertures within the layers which are positioned to correspond as the layers are laminated together. The radio frequency integrated circuit is located within the first cavity, and the second cavity serves as a radiating cavity. The RFIC is bonded to a transmission line which connects to the radiating cavity.
摘要翻译：毫米波射频集成电路装置包括外壳和毫米波射频集成电路，所述外壳包括层叠在一起的多个层和由所述层内的孔限定的两个空腔，所述孔被定位成层叠在一起时对应。射频集成电路位于第一腔内，第二腔用作辐射腔。 RFIC结合到连接到辐射腔的传输线。

9. 发明申请

US20110057741A1 INTERFACING BETWEEN AN INTEGRATED CIRCUIT AND A WAVEGUIDE 有权
标题翻译：集成电路与波形之间的接口
公开(公告)号：US20110057741A1
公开(公告)日：2011-03-10
申请号：US12554987
申请日：2009-09-08
申请人： Elad DAYAN , Amir Shmuel , Yigal Leiba , Baruch Schwarz
发明人： Elad DAYAN , Amir Shmuel , Yigal Leiba , Baruch Schwarz
IPC分类号： H01P5/107
CPC分类号： H01P5/107 , Y10T29/49016
摘要： A low-loss interface between a mm-wave integrated circuit and a waveguide comprises a surface having a contact location for said integrated circuit and a waveguide location for fixing a waveguide thereon; a transmission line extending along said surface from said contact location to the waveguide location and extending into the waveguide location as a waveguide feed; and a connection bump on a surface of the mm-wave integrated circuit. The mm-wave integrated circuit RFIC is connected to the surface at the contact location through the connection bump, such as to connect a signal output of the RFIC to the transmission line, thereby providing said low loss interface.
摘要翻译：毫米波集成电路和波导之间的低损耗接口包括具有用于所述集成电路的接触位置的表面和用于在其上固定波导的波导位置; 传输线，沿着所述表面从所述接触位置延伸到波导位置，并作为波导馈送延伸到波导位置; 以及在mm波形集成电路的表面上的连接凸块。毫米波集成电路RFIC通过连接凸块连接到接触位置处的表面，例如将RFIC的信号输出连接到传输线，从而提供所述低损耗接口。

10. 发明申请

US20100302101A1 ANTENNA ALIGNMENT METHOD AND APPARATUS 有权
标题翻译：天线对准方法和装置
公开(公告)号：US20100302101A1
公开(公告)日：2010-12-02
申请号：US12475625
申请日：2009-06-01
申请人： Yigal LEIBA , Baruch SCHWARZ , Elad DAYAN , Izhak KIRSHENBAUM
发明人： Yigal LEIBA , Baruch SCHWARZ , Elad DAYAN , Izhak KIRSHENBAUM
IPC分类号： H01Q3/00
CPC分类号： H01Q1/1257
摘要： A method of automatic alignment of two directional beams having a known path attenuation, and an antenna gain pattern, for mutual transmission, comprises: determining a beam width between two angles of minimal detectable connection on either side of a beam maximum; then mapping points onto a scan field in a regular pattern, the pattern based on the beam width, such that a beam with the determined beam width is detected once if the beam is in the scan field at all; scanning the first antenna over the mapped scan points; and for each point allowing the second antenna to scan over all of its own set of mapped scan points, thereby providing a coarse alignment of the two antennas to achieve at least a minimal mutual connection. The coarse alignment may be followed by a fine alignment to maximize the signal.
摘要翻译：用于相互传输的具有已知路径衰减的两个方向性波束和天线增益模式的自动对准的方法包括：确定波束最大值两侧的最小可检测连接的两个角度之间的波束宽度; 然后以规则图案将点映射到扫描场上，基于波束宽度的图案，使得如果波束完全在扫描场中，则检测到具有确定的波束宽度的波束一次; 在映射的扫描点上扫描第一个天线; 并且对于允许第二天线扫描其所有自己的映射扫描点集合的每个点，从而提供两个天线的粗略对准以实现至少最小的相互连接。粗略对准可以跟随精细对准以使信号最大化。

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