专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US11626357B2 3D electrical integration using component carrier edge connections to a 2D contact array 有权
公开(公告)号：US11626357B2
公开(公告)日：2023-04-11
申请号：US17333890
申请日：2021-05-28
申请人： FormFactor, Inc.
发明人： Roy J. Henson , Shawn O. Powell
IPC分类号： H01L23/498 , H01L25/065 , H01L23/13 , H01L23/538 , H05K1/18 , H01R12/52
摘要： 3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.

2. 发明授权

US11460485B2 Direct metalized guide plate 有权
公开(公告)号：US11460485B2
公开(公告)日：2022-10-04
申请号：US16164326
申请日：2018-10-18
申请人： FormFactor, Inc.
发明人： Jason William Cosman , Benjamin N. Eldridge , Eric Hill , John Ebner , Edin Sijercic
IPC分类号： G01R1/073 , G01R3/00 , H03H7/38 , G01R1/067
摘要： Improved electrically conductive guide plates for vertical probe arrays are provided by patterning a thin metal layer disposed on an insulating substrate. Holes passing through the guide plate for guiding probes can be electrically connected or isolated from each other in any pattern according to the deposition of the metal. Such structures can include several distinct ground and/or voltage planes. Furthermore, passive electrical components can be included in the guide plate, by patterning of the deposited metal and/or by integration of passive electrical components with the deposited metal traces.

3. 发明申请

US20220236304A1 Probe Head Including a Guide Plate with Angled Holes to Determine Probe Flexure Direction 有权
公开(公告)号：US20220236304A1
公开(公告)日：2022-07-28
申请号：US17587898
申请日：2022-01-28
申请人： FormFactor, Inc.
发明人： Sterling Tadashi Collins , Jason William Cosman , Lich Thanh Tran , Vinh-Lam Olivier Buu
IPC分类号： G01R1/073
摘要： Vertical probe arrays having angled guide plates are provided. With this configuration, the probes can be straight conductors (when mechanically undeformed) and the mechanical bias provided by the angled guide plates can ensure the probes have a well-defined deformation when the probe array make contact to the device under test. This allows the use of straight conductors as probes without suffering from probe shorting and mechanical interference caused by straight probes buckling in unpredictable directions when vertically compressed.

4. 发明授权

US10527647B2 Probe head with inductance reducing structure 有权
公开(公告)号：US10527647B2
公开(公告)日：2020-01-07
申请号：US16016141
申请日：2018-06-22
申请人： FormFactor, Inc.
发明人： Benjamin N. Eldridge , Edin Sijercic , Eric Hill , John Ebner
IPC分类号： G01R31/02 , G01R1/067 , G01R1/073
摘要： Improved impedance matching is provided in vertical probe arrays having conductive guide plates by providing ground pins connecting the guide plates that do not mechanically touch the device under test or the input test apparatus. Such ground pins can be disposed in predetermined patterns around corresponding signal probes to improve an impedance match between the probes and the test apparatus and/or the device under test. Preferably all impedances are matched to 50Ω as is customary for high frequency work.

5. 发明申请

US20190293685A1 Probe tip with embedded skate 审中-公开
公开(公告)号：US20190293685A1
公开(公告)日：2019-09-26
申请号：US16362239
申请日：2019-03-22
申请人： FormFactor, Inc.
发明人： January Kister , Chun-Chih Wang
IPC分类号： G01R1/067 , G01R3/00
摘要： A skate on a tip of a probe for testing electrical devices is a reduced thickness probe tip contact. Such a skate can advantageously increase contact pressure, but it can also undesirably reduce probe lifetime due to rapid mechanical wear of the skate. Here multilayer skate probes are provided where the overall shape of the probe tip is a smooth curved surface, as opposed to the conventional fin-like skate configuration. The skate layer is the most mechanically wear-resistant layer in the structure, so abrasive processing of the probe tip leads to a probe skate defined by the skate layer. The resulting probes provide the advantage of increased contact pressure without the disadvantage of reduced lifetime.

6. 发明申请

US20180196086A1 Shielding for Vertical Probe Heads 审中-公开
公开(公告)号：US20180196086A1
公开(公告)日：2018-07-12
申请号：US15868737
申请日：2018-01-11
申请人： FormFactor, Inc.
发明人： Benjamin N. Eldridge
IPC分类号： G01R1/073
摘要： Crosstalk between probes in a vertical probe array is reduced by providing a grounded metal carrier disposed between the guide plates of the probe array. The metal carrier includes pockets that are laterally separated from each other by the metal carrier. Probes in different pockets are thereby electrically shielded from each other.

7. 发明授权

US09958476B2 Floating nest for a test socket 有权
公开(公告)号：US09958476B2
公开(公告)日：2018-05-01
申请号：US15359245
申请日：2016-11-22
申请人： FormFactor, Inc.
发明人： Benjamin N. Eldridge
IPC分类号： G01R31/20 , G01R1/04
CPC分类号： G01R1/0441
摘要： A test socket for facilitating testing of a device under test (DUT) includes a holder comprising a mounting structure for attaching the holder to other components of the socket and a floating nest structure in which the DUT can be disposed. The floating nest structure can have a seat cavity sized and shaped to receive and hold the DUT such that at least some of the DUT terminals are in contact with corresponding contacts of a test board while the test socket is attached to the test board. A flexure located laterally between the mounting structure and the floating nest structure and can allow the nest structure to move relative to the mounting structure and thus float.

8. 发明授权

US09689915B2 Automated attaching and detaching of an interchangeable probe head 有权
公开(公告)号：US09689915B2
公开(公告)日：2017-06-27
申请号：US14274889
申请日：2014-05-12
申请人： FormFactor, Inc.
发明人： Toshihiro Kasai , Masanori Watanabe , Yoichi Urakawa
IPC分类号： G01R31/00 , G01R31/28
CPC分类号： G01R31/2887 , Y10T29/49117
摘要： A probe card apparatus can comprise a tester interface to a test controller, probes for contacting terminals of electronic devices to be tested, and electrical connections there between. The probe card apparatus can comprise a primary sub-assembly, which can include the tester interface. The probe card apparatus can also comprise an interchangeable probe head, which can include the probes. The interchangeable probe head can be attached to and detached from the primary sub-assembly while the primary sub-assembly is secured to or in a housing of a test system. Different probe heads each having probes disposed in different patterns to test different types of electronic devices can thus be interchanged while the primary sub-assembly is secured to or in a housing of the test system.

9. 发明申请

US20170146566A1 Floating Nest for a Test Socket 有权
公开(公告)号：US20170146566A1
公开(公告)日：2017-05-25
申请号：US15359245
申请日：2016-11-22
申请人： FormFactor, Inc.
发明人： Benjamin N. Eldridge
IPC分类号： G01R1/04
CPC分类号： G01R1/0441
摘要： A test socket for facilitating testing of a device under test (DUT) includes a holder comprising a mounting structure for attaching the holder to other components of the socket and a floating nest structure in which the DUT can be disposed. The floating nest structure can have a seat cavity sized and shaped to receive and hold the DUT such that at least some of the DUT terminals are in contact with corresponding contacts of a test board while the test socket is attached to the test board. A flexure located laterally between the mounting structure and the floating nest structure and can allow the nest structure to move relative to the mounting structure and thus float.

10. 发明申请

US20140340103A1 Automated Attaching And Detaching Of An Interchangeable Probe Head 有权
标题翻译：自动安装和拆卸可互换探头
公开(公告)号：US20140340103A1
公开(公告)日：2014-11-20
申请号：US14274889
申请日：2014-05-12
申请人： FormFactor, Inc.
发明人： Toshihiro Kasai , Masanori Watanabe
IPC分类号： G01R1/067
CPC分类号： G01R31/2887 , Y10T29/49117
摘要： A probe card apparatus can comprise a tester interface to a test controller, probes for contacting terminals of electronic devices to be tested, and electrical connections there between. The probe card apparatus can comprise a primary sub-assembly, which can include the tester interface. The probe card apparatus can also comprise an interchangeable probe head, which can include the probes. The interchangeable probe head can be attached to and detached from the primary sub-assembly while the primary sub-assembly is secured to or in a housing of a test system. Different probe heads each having probes disposed in different patterns to test different types of electronic devices can thus be interchanged while the primary sub-assembly is secured to or in a housing of the test system.
摘要翻译：探针卡装置可以包括到测试控制器的测试器接口，用于接触要测试的电子设备的端子的探针以及其间的电连接。探针卡装置可以包括主要子组件，其可以包括测试器接口。探针卡装置还可以包括可互换探针头，其可以包括探针。可互换探针头可以连接到主子组件并从主子组件拆卸，同时将主子组件固定到测试系统的壳体或壳体中。因此，可以将主要子组件固定到测试系统的壳体中或其中的每个具有以不同图案设置的探针以测试不同类型的电子设备的不同探针头。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式