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    • 9. 发明申请
    • Method for low-temperature organic chemical vapor deposition of tungsten nitride, tungsten nitride films and tungsten nitride diffusion barriers for computer interconnect metallization
    • 用于计算机互连金属化的氮化钨,氮化钨膜和氮化钨扩散阻挡层的低温有机化学气相沉积方法
    • US20030198587A1
    • 2003-10-23
    • US10425823
    • 2003-04-28
    • Gelest, Inc.The Research Foundation of State University of New York
    • Alain E. KaloyerosBarry C. Arkles
    • C23C016/34C01B021/06
    • C01B21/062C01P2002/72C01P2002/77C01P2004/03C01P2004/04C01P2006/10C01P2006/40C23C16/34
    • Processes for producing tungsten nitride and tungsten nitride films are provided in which a tungsten carbonyl compound and a nitrogen-containing reactant gas are reacted at a temperature below about 600null C. Tungsten nitride precursors are also included which comprise a tungsten carbonyl compound capable of forming a tungsten nitride film in the presence of a nitrogen-containing reactant gas at a temperature of less than about 600null C. A process for forming a film by atomic layer deposition is also provided which includes introducing into a substrate having a surface into a deposition chamber and heating the substrate to a temperature sufficient to allow adsorption of a tungsten source precursor or an intermediate of a tungsten source precursor, introducing a tungsten source precursor into the deposition chamber by pulsing for a period of time sufficient to form a self-limiting monolayer of the source precursor or an intermediate of the tungsten source precursor intermediate, introducing an inert gas into the deposition chamber by pulsing the inert gas to purge the deposition to remove the tungsten nitride precursor in the gas phase, introducing a nitrogen-containing gas into the deposition chamber by pulsing to react with the adsorbed precursor monolayer on the substrate surface and to form a first tungsten nitride atomic layer on the substrate surface. An inert gas may then introduced into the deposition chamber for a period of time sufficient to remove the unreacted nitrogen-containing gas and reaction byproducts from the deposition chamber. The entire pulsing sequence including precursor, inert gas, nitrogen-containing gas may be repeated until a film with a desired thickness is achieved.
    • 提供了用于生产氮化钨和氮化钨膜的方法,其中在低于约600℃的温度下使羰基羰基化合物和含氮反应气体反应。还包括含氮化钨前体,其包含能够形成的羰基羰基化合物 在低于约600℃的温度下在含氮反应物气体存在下的氮化钨膜。还提供了通过原子层沉积形成膜的方法,其包括将具有表面的基板引入沉积物 并且将衬底加热到​​足以允许钨源前体或钨源前体的吸附的温度,通过脉冲将钨源前体引入沉积室足以形成自限制单层的时间 的源前体或钨源前体中间体的中间体 通过脉冲惰性气体吹扫沉积物以除去气相中的氮化钨前体而将惰性气体引入沉积室,通过脉冲将含氮气体引入沉积室中以与衬底上的吸附的前体单层反应 并在衬底表面上形成第一氮化钨原子层。 然后可以将惰性气体引入沉积室中足以从沉积室除去未反应的含氮气体和反应副产物的时间。 可以重复包括前体,惰性气体,含氮气体的整个脉冲序列,直到实现具有所需厚度的膜。
    • 10. 发明申请
    • Sulfolane functional silanes, compositions, and methods of use of the same
    • 环丁砜功能硅烷,组合物及其使用方法
    • US20030060636A1
    • 2003-03-27
    • US10193882
    • 2002-07-12
    • Gelest, Inc.
    • Barry C. ArklesYoulin Pan
    • C07F007/02
    • C08K5/45C07F7/0838C07F7/12C07F7/1804C08K5/548C08L21/00
    • The invention includes a sulfolane functional silane comprising a sulfolane ring, an alkoxy group, a hydrocarbon backbone, and a silyl moiety. An oxygen atom of the alkoxy group is bound to the sulfolane ring, and the hydrocarbon backbone has one to fifty carbon atoms and is bound by its first terminal carbon atom to a carbon of the alkoxy group and by its second terminal carbon atom to the silicone atom of the silyl moiety. The silyl moiety comprises at least one hydrolyzable group and/or a non-hydrolyzable group that is a substituted or unsubstituted siloxane group. A method to stabilize a silane solution is described and includes adding the sulfolane functional silane of the invention to a solution containing silane hydrosylates.
    • 本发明包括环丁砜官能的硅烷,其包含环丁砜环,烷氧基,烃骨架和甲硅烷基部分。 烷氧基的氧原子与环丁砜环结合,烃骨架具有一至五十个碳原子,并且其第一末端碳原子与烷氧基的碳和其第二末端碳原子与硅氧烷结合 甲硅烷基部分的原子。 甲硅烷基部分包含至少一个可水解基团和/或作为取代或未取代的硅氧烷基团的不可水解基团。 描述了稳定硅烷溶液的方法,包括将本发明的环丁砜官能的硅烷加入到含有硅烷羟烷基化物的溶液中。