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1. 发明申请

US20120285731A1 ELECTRODE BONDING STRUCTURE, AND MANUFACTURING METHOD FOR ELECTRODE BONDING STRUCTURE 有权
标题翻译：电极结合结构及电极结合结构的制造方法
公开(公告)号：US20120285731A1
公开(公告)日：2012-11-15
申请号：US13459606
申请日：2012-04-30
申请人： Hiroaki KATSURA , Koso Matsuno , Yoji Ueda
发明人： Hiroaki KATSURA , Koso Matsuno , Yoji Ueda
IPC分类号： H05K1/02 , B32B37/12 , B32B38/16 , B32B37/14 , B32B37/06
CPC分类号： H01J11/10 , H01J9/32 , H01J11/48 , Y10T156/10
摘要： An electrode bonding structure sealed with a sealing resin, in which a flexible substrate is bonded to a first substrate via an adhesive, wherein: a region along a bottom face edge of an flexible substrate end part is bonded, via the adhesive, to an inner side region of a region along a top face edge of an first substrate end part; a gap is formed between an inner side region of the region along the bottom face edge of the flexible substrate end part and the region along the top face edge of the first substrate end part; the sealing resin is formed so as to enter, while covering a top face of the flexible substrate end part, at least a portion of the gap; and a height of the gap gets smaller towards the adhesive from the top face edge of the first substrate end part.
摘要翻译：一种用密封树脂密封的电极接合结构，其中通过粘合剂将柔性基板结合到第一基板，其中：沿着柔性基板端部的底面边缘的区域经由粘合剂粘合到内部沿着第一基板端部的顶面边缘的区域的侧面区域; 沿着柔性基板端部的底面边缘的区域的内侧区域和沿着第一基板端部的顶面边缘的区域之间形成间隙; 密封树脂形成为在覆盖柔性基板端部的顶面的同时进入间隙的至少一部分; 并且所述间隙的高度从所述第一基板端部的顶面边缘朝向所述粘合剂变小。

2. 发明授权

US07852102B2 Method and apparatus for inspecting semiconductor device 有权
标题翻译：用于检查半导体器件的方法和装置
公开(公告)号：US07852102B2
公开(公告)日：2010-12-14
申请号：US12294127
申请日：2008-02-26
申请人： Hiroki Kitagawa , Hiroaki Katsura
发明人： Hiroki Kitagawa , Hiroaki Katsura
IPC分类号： G01R31/26
CPC分类号： G01R31/311 , G01N21/93 , G01N21/9501 , G01N21/95607 , H01L22/12
摘要： The magnitude of an amplitude waveform of an electromagnetic wave generated when irradiating a pulse laser beam to a structure A including diffusion regions provided in the structure of a semiconductor device to be inspected is compared with the magnitude of an amplitude waveform of an electromagnetic wave radiated when irradiating the pulse laser beam to a structure A of a reference device measured in advance, and the detection sensitivity of the electromagnetic wave is corrected (S14). Thereafter, measurement errors caused by variations in the detection sensitivity of electromagnetic waves of an inspecting apparatus are eliminated by inspecting the semiconductor device as an inspection target, so that the quality of the semiconductor device is precisely determined (S16).
摘要翻译：当将脉冲激光束照射到包括设在待检查的半导体器件的结构中的扩散区域的结构A的电磁波的幅度波形的大小与当辐射的电磁波的振幅波形的大小进行比较时将脉冲激光束照射到预先测量的参考装置的结构A上，并且校正电磁波的检测灵敏度（S14）。此后，通过检查作为检查对象的半导体装置来消除由检查装置的电磁波的检测灵敏度的变化引起的测量误差，从而精确地确定半导体器件的质量（S16）。

3. 发明申请

US20090301201A1 Ultrasonic Flaw Detection Method and Ultrasonic Flaw Detection Device 有权
标题翻译：超声波探伤法和超声波探伤仪
公开(公告)号：US20090301201A1
公开(公告)日：2009-12-10
申请号：US11918327
申请日：2006-06-12
申请人： Hiroaki Katsura , Yoichiro Ueda , Kazuya Ushirokawa
发明人： Hiroaki Katsura , Yoichiro Ueda , Kazuya Ushirokawa
IPC分类号： G01N29/00
CPC分类号： G01N29/28 , G01N2291/101 , G01N2291/2638 , G01N2291/2697
摘要： An ultrasonic transmission medium is received in a medium container, and an opening of the container is sealed by a polymer membrane. An inspection object is received in an inspection object receiving container body that is a separate body from the medium container and whose opening is formed opposite the polymer membrane of the medium container. The opening of the inspection object receiving container body is covered by the polymer membrane of the medium container, and a measurement environment space formed by a frame body, the polymer membrane, and the inspection object is reduced in pressure to cause the polymer membrane to be in intimate contact with the inspection object. Then, flaw detection is performed by emitting and applying an ultrasonic wave from an ultrasonic probe to the inspection object via the ultrasonic transmission medium and the polymer membrane.
摘要翻译：超声波传播介质被容纳在介质容器中，容器的开口被聚合物膜密封。检查对象被容纳在作为与介质容器分离的主体的检查对象接收容器主体中，并且其开口形成在与介质容器的聚合物膜相对的位置。检查对象接收容器主体的开口由介质容器的聚合物膜覆盖，并且由框体，聚合物膜和检查对象形成的测量环境空间被压缩以使聚合物膜成为与检查对象密切接触。然后，通过经由超声波传播介质和聚合物膜将超声波探头的超声波发射并施加到检查对象来进行探伤。

4. 发明申请

US20080053230A1 Ultrasonic Inspection Method and Ultrasonic Inspection Device 审中-公开
标题翻译：超声波检测方法和超声波检测装置
公开(公告)号：US20080053230A1
公开(公告)日：2008-03-06
申请号：US11794429
申请日：2006-01-11
申请人： Hiroaki Katsura , Yoichiro Ueda , Kazuya Ushirokawa
发明人： Hiroaki Katsura , Yoichiro Ueda , Kazuya Ushirokawa
IPC分类号： G01N29/28
CPC分类号： G01N29/043 , G01N29/28 , G01N2291/02854 , G01N2291/044 , G01N2291/2697
摘要： A bottom surface of a medium tank 1 is closed with a polymer film 2, the polymer film 2 is stuck to the medium tank 1 by reducing the pressure of the inside of the medium tank 1, an ultrasonic wave transmission medium 5 is injected while reducing the pressure of the inside of the medium tank 1 so that the distal end of an ultrasonic probe 3 is immersed, the inside of the medium tank 1 is pressurized while keeping an inspection object 6 in contact with the polymer film 2, an ultrasonic wave reflected by the inspection object is received by the ultrasonic probe 3.
摘要翻译：介质槽1的底面用聚合物膜2封闭，聚合物膜2通过降低介质槽1的内部的压力而粘附到介质槽1上，同时注入超声波传输介质5，同时还原介质罐1的内部的压力使得超声波探头3的远端被浸没，在保持检查对象6与聚合物膜2接触的同时对介质槽1的内部进行加压，反射的超声波由检查对象由超声波探头3接收。

5. 发明授权

US08867228B2 Electrode bonding structure, and manufacturing method for electrode bonding structure 有权
标题翻译：电极接合结构和电极接合结构的制造方法
公开(公告)号：US08867228B2
公开(公告)日：2014-10-21
申请号：US13459606
申请日：2012-04-30
申请人： Hiroaki Katsura , Koso Matsuno , Yoji Ueda
发明人： Hiroaki Katsura , Koso Matsuno , Yoji Ueda
IPC分类号： H01R9/00 , H01J11/48 , H01J9/32 , H01J11/10
CPC分类号： H01J11/10 , H01J9/32 , H01J11/48 , Y10T156/10
摘要： An electrode bonding structure sealed with a sealing resin, in which a flexible substrate is bonded to a first substrate via an adhesive, wherein: a region along a bottom face edge of an flexible substrate end part is bonded, via the adhesive, to an inner side region of a region along a top face edge of an first substrate end part; a gap is formed between an inner side region of the region along the bottom face edge of the flexible substrate end part and the region along the top face edge of the first substrate end part; the sealing resin is formed so as to enter, while covering a top face of the flexible substrate end part, at least a portion of the gap; and a height of the gap gets smaller towards the adhesive from the top face edge of the first substrate end part.
摘要翻译：一种用密封树脂密封的电极接合结构，其中通过粘合剂将柔性基板结合到第一基板，其中：沿着柔性基板端部的底面边缘的区域经由粘合剂粘合到内部沿着第一基板端部的顶面边缘的区域的侧面区域; 沿着柔性基板端部的底面边缘的区域的内侧区域和沿着第一基板端部的顶面边缘的区域之间形成间隙; 密封树脂形成为在覆盖柔性基板端部的顶面的同时进入间隙的至少一部分; 并且所述间隙的高度从所述第一基板端部的顶面边缘朝向所述粘合剂变小。

6. 发明申请

US20100231253A1 METHOD AND APPARATUS FOR INSPECTING SEMICONDUCTOR DEVICE 有权
标题翻译：用于检查半导体器件的方法和装置
公开(公告)号：US20100231253A1
公开(公告)日：2010-09-16
申请号：US12294127
申请日：2008-02-26
申请人： Hiroki Kitagawa , Hiroaki Katsura
发明人： Hiroki Kitagawa , Hiroaki Katsura
IPC分类号： G01R31/26 , G01R13/38
CPC分类号： G01R31/311 , G01N21/93 , G01N21/9501 , G01N21/95607 , H01L22/12
摘要： The magnitude of an amplitude waveform of an electromagnetic wave generated when irradiating a pulse laser beam to a structure A including diffusion regions provided in the structure of a semiconductor device to be inspected is compared with the magnitude of an amplitude waveform of an electromagnetic wave radiated when irradiating the pulse laser beam to a structure A of a reference device measured in advance, and the detection sensitivity of the electromagnetic wave is corrected (S14). Thereafter, measurement errors caused by variations in the detection sensitivity of electromagnetic waves of an inspecting apparatus are eliminated by inspecting the semiconductor device as an inspection target, so that the quality of the semiconductor device is precisely determined (S16).
摘要翻译：当将脉冲激光束照射到包括设在待检查的半导体器件的结构中的扩散区域的结构A的电磁波的幅度波形的大小与当辐射的电磁波的振幅波形的大小进行比较时将脉冲激光束照射到预先测量的参考装置的结构A上，并且校正电磁波的检测灵敏度（S14）。此后，通过检查作为检查对象的半导体装置来消除由检查装置的电磁波的检测灵敏度的变化引起的测量误差，从而精确地确定半导体器件的质量（S16）。

7. 发明授权

US07793546B2 Ultrasonic flaw detection method and ultrasonic flaw detection device 有权
标题翻译：超声波探伤法和超声波探伤仪
公开(公告)号：US07793546B2
公开(公告)日：2010-09-14
申请号：US11918327
申请日：2006-06-12
申请人： Hiroaki Katsura , Yoichiro Ueda , Kazuya Ushirokawa
发明人： Hiroaki Katsura , Yoichiro Ueda , Kazuya Ushirokawa
IPC分类号： G01N29/28
CPC分类号： G01N29/28 , G01N2291/101 , G01N2291/2638 , G01N2291/2697
摘要： An ultrasonic transmission medium is received in a medium container, and an opening of the container is sealed by a polymer membrane. An inspection object is received in an inspection object receiving container body that is separate from the medium container and whose opening is formed opposite the polymer membrane of the medium container. The opening of the inspection object receiving container body is covered by the polymer membrane of the medium container, and a measurement environment space formed by a frame body, the polymer membrane, and the inspection object is reduced in pressure to cause the polymer membrane to be in intimate contact with the inspection object. Then, flaw detection is performed by emitting and applying an ultrasonic wave from an ultrasonic probe to the inspection object via the ultrasonic transmission medium and the polymer membrane.
摘要翻译：超声波传播介质被容纳在介质容器中，容器的开口被聚合物膜密封。检查对象被容纳在与介质容器分离的检查对象接收容器主体中，并且其开口形成在与介质容器的聚合物膜相对的位置。检查对象接收容器主体的开口由介质容器的聚合物膜覆盖，并且由框体，聚合物膜和检查对象形成的测量环境空间被压缩以使聚合物膜成为与检查对象密切接触。然后，通过经由超声波传播介质和聚合物膜将超声波探头的超声波发射并施加到检查对象来进行探伤。

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