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    • 2. 发明授权
    • Semiconductor device manufacturing method, and semiconductor device
    • 半导体器件制造方法和半导体器件
    • US08017468B2
    • 2011-09-13
    • US12349595
    • 2009-01-07
    • Hiroyuki Fujimoto
    • Hiroyuki Fujimoto
    • H01L21/22
    • H01L29/7827H01L27/10876H01L29/66666
    • A method of manufacturing a semiconductor device in which the formation of buried wiring is facilitated includes: forming columnar patterns, which are arranged in a two-dimensional array, and bridge patterns, which connect the columnar patterns in a column direction, on a main surface of a silicon substrate; injecting an impurity in a surface portion of each of the columnar patterns and bridge patterns and in surface portions of the silicon substrate, thereby forming impurity injection layers; forming a side wall on sides of the columnar patterns and bridge patterns; removing the impurity injection layer, which has been formed in the silicon substrate, with the exception of the impurity injection layer covered by the bottom portions of the side walls; removing the side walls by etch-back; and thermally oxidizing the surface portion of the bridge patterns and then etching away the same. Buried wiring extending in the column direction of the columnar patterns is formed within the silicon substrate.
    • 制造掩埋布线形成的半导体器件的方法包括:形成以二维阵列布置的柱状图案和将柱状图案沿列方向连接在主表面上的桥接图案 的硅衬底; 在每个柱状图案和桥接图案的表面部分和硅衬底的表面部分中注入杂质,从而形成杂质注入层; 在柱状图案和桥形图案的侧面上形成侧壁; 去除已经形成在硅衬底中的杂质注入层,除了由侧壁的底部覆盖的杂质注入层之外; 通过蚀刻去除侧壁; 并对桥状图案的表面部分进行热氧化,然后将其蚀刻掉。 在硅衬底内形成在柱状图案的列方向上延伸的埋入布线。
    • 3. 发明申请
    • NONAQUEOUS ELECTROLYTE SECONDARY BATTERY
    • 非电解电解质二次电池
    • US20110195309A1
    • 2011-08-11
    • US13023951
    • 2011-02-09
    • Fumiharu NinaAkihiro SuzukiShingo TodeToshikazu YoshidaYoshinori KidaHiroyuki Fujimoto
    • Fumiharu NinaAkihiro SuzukiShingo TodeToshikazu YoshidaYoshinori KidaHiroyuki Fujimoto
    • H01M4/52H01M4/50
    • H01M10/0525H01M4/485H01M4/505H01M4/525Y02E60/122Y02T10/7011
    • A positive electrode active material of a nonaqueous electrolyte secondary battery is improved by using an inexpensive lithium transition metal oxide containing nickel and manganese as main components. Output characteristics of the battery under various temperature conditions are thereby improved, and the battery is suitable as a power supply of a hybrid vehicle. The battery includes a positive electrode including a positive electrode active material, a negative electrode including a negative electrode active material, and a nonaqueous electrolyte prepared by dissolving a solute in a nonaqueous solvent. The positive electrode active material includes positive electrode active material particles composed of a lithium transition metal complex oxide having a layered structure containing nickel and manganese as main components, and at least one niobium-containing material selected from a Li—Nb—O compound and a Li—Ni—Nb—O compound, the at least one niobium-containing material being sintered onto surfaces of the positive electrode active material particles.
    • 通过使用廉价的含有镍和锰的锂过渡金属氧化物作为主要成分,提高了非水电解质二次电池的正极活性物质。 因此,在各种温度条件下的电池的输出特性得到改善,并且电池适合作为混合动力车辆的电源。 该电池包括正极,其包括正极活性物质,负极包括负极活性物质,以及通过将溶质溶解在非水溶剂中制备的非水电解质。 正极活性物质包括由具有镍和锰作为主要成分的层状结构的锂过渡金属复合氧化物构成的正极活性物质粒子,以及选自Li-Nb-O系化合物和 Li-Ni-Nb-O化合物,将至少一种含铌材料烧结在正极活性物质颗粒的表面上。
    • 10. 发明申请
    • SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE
    • 半导体器件制造方法和半导体器件
    • US20090184367A1
    • 2009-07-23
    • US12349595
    • 2009-01-07
    • Hiroyuki FUJIMOTO
    • Hiroyuki FUJIMOTO
    • H01L27/088H01L21/22
    • H01L29/7827H01L27/10876H01L29/66666
    • A method of manufacturing a semiconductor device in which the formation of buried wiring is facilitated includes: forming columnar patterns, which are arranged in a two-dimensional array, and bridge patterns, which connect the columnar patterns in a column direction, on a main surface of a silicon substrate; injecting an impurity in a surface portion of each of the columnar patterns and bridge patterns and in surface portions of the silicon substrate, thereby forming impurity injection layers; forming a side wall on sides of the columnar patterns and bridge patterns; removing the impurity injection layer, which has been formed in the silicon substrate, with the exception of the impurity injection layer covered by the bottom portions of the side walls; removing the side walls by etch-back; and thermally oxidizing the surface portion of the bridge patterns and then etching away the same. Buried wiring extending in the column direction of the columnar patterns is formed within the silicon substrate.
    • 制造掩埋布线形成的半导体器件的方法包括:形成以二维阵列布置的柱状图案和将柱状图案沿列方向连接在主表面上的桥接图案 的硅衬底; 在每个柱状图案和桥接图案的表面部分和硅衬底的表面部分中注入杂质,从而形成杂质注入层; 在柱状图案和桥形图案的侧面上形成侧壁; 去除已经形成在硅衬底中的杂质注入层,除了由侧壁的底部覆盖的杂质注入层之外; 通过蚀刻去除侧壁; 并对桥状图案的表面部分进行热氧化,然后将其蚀刻掉。 在硅衬底内形成在柱状图案的列方向上延伸的埋入布线。