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1. 发明授权

US08053796B2 Solid state light emitting device 失效
标题翻译：固态发光装置
公开(公告)号：US08053796B2
公开(公告)日：2011-11-08
申请号：US11964845
申请日：2007-12-27
申请人： Chun-Wei Wang , Hung-Kuang Hsu , Wen-Jang Jiang
发明人： Chun-Wei Wang , Hung-Kuang Hsu , Wen-Jang Jiang
IPC分类号： H01L33/00
CPC分类号： H01L25/167 , H01L33/486 , H01L2224/45144 , H01L2224/48227 , H01L2924/09701 , H01L2924/12032 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A solid state light emitting device includes a laminated substrate structure (120), an LED chip (30), a transparent capsulation material (50) and an electric component (40). The laminated substrate structure includes a first substrate (10) and a second substrate (20) attached to each other by a sintering process. The first substrate has a mounting surface (100) and a receiving through hole (11) defined in the mounting surface thereof. The LED chip is mounted on the mounting surface of the first substrate. The transparent capsulation material envelops the LED chip therein. The electric component is received in the receiving hole and mounted on the second substrate. The electric component is located below the mounting surface of the first substrate.
摘要翻译：固态发光器件包括层叠基板结构（120），LED芯片（30），透明封装材料（50）和电气部件（40）。层压基板结构包括通过烧结工艺彼此连接的第一基板（10）和第二基板（20）。第一基板具有在其安装表面中限定的安装表面（100）和接收通孔（11）。 LED芯片安装在第一基板的安装表面上。透明封装材料包围其中的LED芯片。电气部件容纳在接收孔中并安装在第二基板上。电气部件位于第一基板的安装面的下方。

2. 发明授权

US07842965B2 Light emitting diode illuminating device 有权
标题翻译：发光二极管照明装置
公开(公告)号：US07842965B2
公开(公告)日：2010-11-30
申请号：US12135871
申请日：2008-06-09
申请人： Hung-Kuang Hsu , Chun-Wei Wang
发明人： Hung-Kuang Hsu , Chun-Wei Wang
IPC分类号： H01L33/00
CPC分类号： F21V29/70 , F21K9/00 , F21S6/00 , F21S6/003 , F21V17/164 , F21V19/001 , F21V19/045 , F21V23/0442 , F21V29/89 , F21Y2105/00 , F21Y2115/10 , H01L33/64 , H01L2924/0002 , H01R12/714 , H01R13/7175 , Y10S362/80 , H01L2924/00
摘要： An illuminating device (1) includes a light source module (10) and a power source module (30). The light source module includes a base (11), a plurality of LEDs (12) and a plurality of electrode contacts (13, 14) located on the base. The LEDs is electrically connected to the electrode contacts. The power source module includes an enclosure (31) defining a light source chamber (311) therein and a plurality of electrical terminals (33, 34) received in the light source chamber. The light source module is detachably inserted into the light source chamber of the power source module, and the electrode contacts abut against the corresponding electrical terminals respectively.
摘要翻译：照明装置（1）包括光源模块（10）和电源模块（30）。光源模块包括基座（11），多个LED（12）和位于基座上的多个电极触头（13,14）。 LED电连接到电极触点。电源模块包括在其中限定光源室（311）的壳体（31）和容纳在光源室中的多个电端子（33,34）。光源模块可拆卸地插入电源模块的光源室中，并且电极触点分别抵靠相应的电端子。

3. 发明授权

US07762692B2 Surface mount light emitting diode assembly and backlight module using the same 有权
标题翻译：表面贴装发光二极管组件和背光模组使用相同
公开(公告)号：US07762692B2
公开(公告)日：2010-07-27
申请号：US12013920
申请日：2008-01-14
申请人： Chih-Ming Lai , Hung-Kuang Hsu
发明人： Chih-Ming Lai , Hung-Kuang Hsu
IPC分类号： F21V3/00 , F21V29/00
CPC分类号： G02B6/0021 , G02B6/003 , G02B6/0073 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A surface mount LED assembly (10) comprises a substrate (11), a bonding pad, an LED chip (12) and a lens package (13). The bonding pad, the LED chip and the lens package are positioned on the substrate. The LED chip is electrically connected with the bonding pad. The lens package covers the LED chip. The lens package comprises a light emitting surface (132) located away from the LED chip. The light emitting surface is a curved surface protruding away from the substrate.
摘要翻译：表面贴装LED组件（10）包括衬底（11），接合焊盘，LED芯片（12）和透镜封装（13）。接合焊盘，LED芯片和透镜封装件位于基板上。 LED芯片与接合焊盘电连接。镜头包装覆盖了LED芯片。透镜组包括位于远离LED芯片的发光表面（132）。发光面是从基板突出的弯曲表面。

4. 发明申请

US20090207111A1 FULL COLOR LIGHT EMITTING DIODE DISPLAY 审中-公开
标题翻译：全彩色发光二极管显示
公开(公告)号：US20090207111A1
公开(公告)日：2009-08-20
申请号：US12198292
申请日：2008-08-26
申请人： Chun-Wei Wang , Hung-Kuang Hsu
发明人： Chun-Wei Wang , Hung-Kuang Hsu
IPC分类号： G09G3/32
CPC分类号： G09F9/33
摘要： A full color LED display includes a plurality of pixel units. Each of the pixel units includes a first sub-pixel unit, a second sub-pixel unit and a third sub-pixel unit. The first sub-pixel unit includes a first LED chip for emitting first light of a first wavelength and a first phosphor layer associated with the first LED chip for converting the first light emitted from the first LED chip into second light of a second wavelength. The second sub-pixel unit includes a first LED chip and a second phosphor layer associated with the first LED chip, for converting the first light emitted from the first LED chip into third light of a third wavelength. The third sub-pixel unit includes a first LED chip for emitting the first light.
摘要翻译：全彩LED显示器包括多个像素单元。每个像素单元包括第一子像素单元，第二子像素单元和第三子像素单元。第一子像素单元包括用于发射第一波长的第一光的第一LED芯片和与第一LED芯片相关联的第一荧光体层，用于将从第一LED芯片发射的第一光转换成第二波长的第二光。第二子像素单元包括与第一LED芯片相关联的第一LED芯片和第二荧光体层，用于将从第一LED芯片发射的第一光转换为第三波长的第三光。第三子像素单元包括用于发射第一光的第一LED芯片。

5. 发明申请

US20090184333A1 LIGHT EMITTING DIODE DEVICE 失效
标题翻译：发光二极管装置
公开(公告)号：US20090184333A1
公开(公告)日：2009-07-23
申请号：US12198284
申请日：2008-08-26
申请人： CHUN-WEI WANG , HUNG-KUANG HSU
发明人： CHUN-WEI WANG , HUNG-KUANG HSU
IPC分类号： H01L33/00
CPC分类号： H01L33/508 , H01L25/0753 , H01L33/507 , H01L2224/45144 , H01L2224/48091 , H01L2924/00 , H01L2924/00014
摘要： An LED device includes a substrate, a plurality of LEDs, a first light pervious layer, a reflective plate, and a plurality of phosphor particles contained in the first light pervious layer. The LEDs are electrically mounted on the substrate and configured for emitting light of a first wavelength. The reflective plate is mounted on the substrate for directing the light of the first wavelength to transmit through the first light pervious layer. The phosphor particles are configured for converting the light of the first wavelength into light of a second wavelength. A distribution of the phosphor particles in the first light pervious layer gradually decreases from a center to a periphery thereof.
摘要翻译： LED装置包括基板，多个LED，第一透光层，反射板和包含在第一透光层中的多个荧光体颗粒。 LED电气地安装在基板上并被配置为发射第一波长的光。反射板安装在基板上，用于引导第一波长的光透过第一透光层。荧光体颗粒被配置为将第一波长的光转换成第二波长的光。第一透光层中的荧光体粒子的分布从中心向周边逐渐减少。

6. 发明申请

US20090147516A1 SOLID ILLUMINATION DEVICE 审中-公开
标题翻译：固体照明装置
公开(公告)号：US20090147516A1
公开(公告)日：2009-06-11
申请号：US12016144
申请日：2008-01-17
申请人： CHUN-WEI WANG , HUNG-KUANG HSU
发明人： CHUN-WEI WANG , HUNG-KUANG HSU
IPC分类号： F21V7/00
CPC分类号： G02F1/133603 , F21K9/00 , G02F1/133606 , G02F1/133609 , G02F1/133611 , G02F2001/133607 , G02F2001/133628
摘要： A solid illumination device includes a light emitting module (30), a heat sink (20), a plurality of supporters (25) and a plurality of optical protrusions (40). The light emitting module includes a plurality of printed circuit broads (34) and a plurality of point light sources (32) electrically connected to each of the printed circuit broads. The heat sink includes a substrate (21) which has a supporting surface (210). The supporter has slanted side faces (250b, 250c). An acute angle θ is formed between each of the side faces and a normal line F of the supporting surface. The optical protrusions are located on the supporting surface of the substrate. The point light sources are located on the side faces and a portion of light emitted from the point light sources is irradiated downwardly towards the supporting surface and reflected by the optical protrusions.
摘要翻译：固体照明装置包括发光模块（30），散热器（20），多个支撑体（25）和多个光学突起（40）。发光模块包括电连接到每个印刷电路板的多个印刷电路板（34）和多个点光源（32）。散热器包括具有支撑表面（210）的基板（21）。支架具有倾斜的侧面（250b，250c）。在支撑表面的每个侧面和法线F之间形成锐角θ。光学突起位于基板的支撑表面上。点光源位于侧面，并且从点光源发射的光的一部分向下朝向支撑表面照射并被光学突起反射。

7. 发明申请

US20090097265A1 LIGHT SOURCE MODULE 审中-公开
标题翻译：光源模块
公开(公告)号：US20090097265A1
公开(公告)日：2009-04-16
申请号：US12057699
申请日：2008-03-28
申请人： Chih-Hsien Sun , Ching-Chung Nien , Hung-Kuang Hsu
发明人： Chih-Hsien Sun , Ching-Chung Nien , Hung-Kuang Hsu
IPC分类号： F21V29/00
CPC分类号： F21V29/51 , F21V29/763 , F21Y2115/10 , F28D15/0233 , F28D15/0275 , F28F1/12 , F28F21/084 , F28F21/085 , H01L2924/0002 , H01L2924/00
摘要： The light source module (10) includes a circuit board (11), a heat dissipating module (13) and a plurality of light emitting members (121). The circuit board defines a first surface 112 for supporting the plurality of light emitting members and an opposite second surface (114) for supporting the heat dissipation module. The heat dissipating module includes a base (1312), a plurality of heat dissipation fins (1313) and a plurality of heat pipes (132). The base has a top surface (1316) and an opposite bottom surface (1315). The plurality of heat dissipation fins are protruded upwardly from the top surface of the base. A plurality of grooves (1314) are defined in the bottom surface of the base. The heat pipes are received in the plurality of grooves of the base respectively. Each of the heat pipes includes a flat sidewall (1321) and an arc-shaped sidewall (1322).
摘要翻译：光源模块（10）包括电路板（11），散热模块（13）和多个发光元件（121）。电路板限定用于支撑多个发光构件的第一表面112和用于支撑散热模块的相对的第二表面（114）。散热模块包括基座（1312），多个散热翅片（1313）和多个热管（132）。底座具有顶表面（1316）和相对的底表面（1315）。多个散热片从基座的顶面向上突出。多个槽（1314）限定在底座的底面上。热管分别容纳在基座的多个槽中。每个热管包括平坦侧壁（1321）和弧形侧壁（1322）。

8. 发明申请

US20090090926A1 SOLID STATE LIGHT EMITTING DEVICE 失效
标题翻译：固态发光装置
公开(公告)号：US20090090926A1
公开(公告)日：2009-04-09
申请号：US11964845
申请日：2007-12-27
申请人： CHUN-WEI WANG , HUNG-KUANG HSU , WEN-JANG JIANG
发明人： CHUN-WEI WANG , HUNG-KUANG HSU , WEN-JANG JIANG
IPC分类号： H01L33/00
CPC分类号： H01L25/167 , H01L33/486 , H01L2224/45144 , H01L2224/48227 , H01L2924/09701 , H01L2924/12032 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A solid state light emitting device includes a laminated substrate structure (120), an LED chip (30), a transparent capsulation material (50) and an electric component (40). The laminated substrate structure includes a first substrate (10) and a second substrate (20) attached to each other by a sintering process. The first substrate has a mounting surface (100) and a receiving through hole (11) defined in the mounting surface thereof. The LED chip is mounted on the mounting surface of the first substrate. The transparent capsulation material envelops the LED chip therein. The electric component is received in the receiving hole and mounted on the second substrate. The electric component is located below the mounting surface of the first substrate.
摘要翻译：固态发光器件包括层叠基板结构（120），LED芯片（30），透明封装材料（50）和电气部件（40）。层压基板结构包括通过烧结工艺彼此连接的第一基板（10）和第二基板（20）。第一基板具有在其安装表面中限定的安装表面（100）和接收通孔（11）。 LED芯片安装在第一基板的安装表面上。透明封装材料包围其中的LED芯片。电气部件容纳在接收孔中并安装在第二基板上。电气部件位于第一基板的安装面的下方。

9. 发明申请

US20090046470A1 SURFACE MOUNT LIGHT EMITTING DIODE ASSEMBLY AND BACKLIGHT MODULE USING THE SAME 有权
标题翻译：表面安装发光二极管组件和使用其的背光模块
公开(公告)号：US20090046470A1
公开(公告)日：2009-02-19
申请号：US12013920
申请日：2008-01-14
申请人： Chih-Ming Lai , Hung-Kuang Hsu
发明人： Chih-Ming Lai , Hung-Kuang Hsu
IPC分类号： F21V5/04
CPC分类号： G02B6/0021 , G02B6/003 , G02B6/0073 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A surface mount LED assembly (10) comprises a substrate (11), a bonding pad, an LED chip (12) and a lens package (13). The bonding pad, the LED chip and the lens package are positioned on the substrate. The LED chip is electrically connected with the bonding pad. The lens package covers the LED chip. The lens package comprises a light emitting surface (132) located away from the LED chip. The light emitting surface is a curved surface protruding away from the substrate.
摘要翻译：表面贴装LED组件（10）包括衬底（11），接合焊盘，LED芯片（12）和透镜封装（13）。接合焊盘，LED芯片和透镜封装件位于基板上。 LED芯片与接合焊盘电连接。镜头包装覆盖了LED芯片。透镜组包括位于远离LED芯片的发光表面（132）。发光面是从基板突出的弯曲表面。

10. 发明授权

US06880976B2 Hydrodynamic and hydrostatic hybrid bearing and its manufacturing method 失效
标题翻译：流体动力和静压混合轴承及其制造方法
公开(公告)号：US06880976B2
公开(公告)日：2005-04-19
申请号：US10014471
申请日：2001-12-14
申请人： Ching-Hsing Huang , Hung-Kuang Hsu
发明人： Ching-Hsing Huang , Hung-Kuang Hsu
IPC分类号： F16C32/06 , F16C33/10
CPC分类号： F16C32/0618 , F16C17/026 , F16C33/103 , F16C33/107 , F16C33/14 , F16C2220/20 , F16C2220/48 , F16C2220/82
摘要： A hybrid type hydrodynamic and hydrostatic bearing and its manufacturing method are disclosed by the invention. By making use of a penetrated dynamic pressure generating groove carved on the surface of the bushing inside the housing, the processing efficiency of the tiny grooves can be substantially improved. Also, after combining the housing with the bushing, and utilizing porous material that is able to preserve a lubricant, the pressurization by gas can be added externally on the surface of the porous material. After being sealed, the gas prepress can force the lubricant to fill the interval between the bushing and shaft. The bearing can achieve the effect of lubricating and supporting the shaft.
摘要翻译：本发明公开了一种混合型流体动力和静压轴承及其制造方法。通过利用雕刻在壳体内的衬套的表面上的穿透动态压力产生槽，可以显着地提高微小凹槽的处理效率。此外，在将壳体与衬套组合之后，并且利用能够保存润滑剂的多孔材料，可以在多孔材料的表面上外部加入气体加压。密封后，气体预印可以迫使润滑剂填充衬套和轴之间的间隔。轴承可以达到润滑和支撑轴的效果。

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