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1. 发明授权

US08388793B1 Method for fabricating camera module 有权
标题翻译：相机模块制作方法
公开(公告)号：US08388793B1
公开(公告)日：2013-03-05
申请号：US13219948
申请日：2011-08-29
申请人： Tzy-Ying Lin , Chieh-Yuan Cheng , Hung-Yeh Lin
发明人： Tzy-Ying Lin , Chieh-Yuan Cheng , Hung-Yeh Lin
IPC分类号： B32B37/00 , B32B38/04 , B32B38/10 , B32B43/00
CPC分类号： H01L27/14618 , H01L27/14623 , H01L27/14625 , H01L27/14683 , H01L2924/0002 , Y10T156/11 , H01L2924/00
摘要： The invention provides a method for fabricating a camera module. An exemplary embodiment of the method for fabricating a camera module comprises providing plurality of lens sets. A dry film layer is formed on the plurality of lens sets. The dry film layer is patterned to form a plurality of dry film patterns respectively attaching to a plurality of lens sets. The plurality of lens sets are separated. A lens set separated from the plurality of lens sets is bonded to an image sensor device chip. The dry film pattern on the lens set is removed.
摘要翻译：本发明提供一种制造相机模块的方法。用于制造相机模块的方法的示例性实施例包括提供多个透镜组。在多个透镜组上形成干膜层。图案化干膜层以形成分别连接到多个透镜组的多个干膜图案。多个透镜组被分离。与多个透镜组分离的透镜组被结合到图像传感器装置芯片。去除透镜组上的干膜图案。

2. 发明授权

US09075182B2 Camera module and spacer of a lens structure in the camera module 有权
标题翻译：相机模块中的相机模块和镜头结构的间隔物
公开(公告)号：US09075182B2
公开(公告)日：2015-07-07
申请号：US13152690
申请日：2011-06-03
申请人： Chieh-Yuan Cheng , Hung-Yeh Lin
发明人： Chieh-Yuan Cheng , Hung-Yeh Lin
IPC分类号： H01L27/146 , G03B17/12 , G02B7/02 , G02B7/00
CPC分类号： H01L27/14685 , G02B7/003 , G02B7/02 , G02B7/021 , G03B17/12 , H01L27/14618 , H01L27/14625 , H01L27/14687 , H01L2924/0002 , H01L2924/00
摘要： A camera module and a fabrication method thereof are provided. The camera module includes a lens structure and an image sensor device chip disposed under the lens structure. The lens structure includes a transparent substrate and a lens disposed on the transparent substrate. A spacer is disposed on the transparent substrate to surround the lens, wherein the spacer contains a base pattern and a dry film photoresist. The method includes forming a base pattern on a carrier and attaching a dry film photoresist on the carrier. The dry film photoresist is planarized by a lamination process and then patterned to form a spacer. A transparent substrate having a plurality of lenses is provided. The spacer is stripped from the carrier, attaching on the transparent substrate to surround each of the lenses, and then bonded with image sensor device chips.
摘要翻译：提供了相机模块及其制造方法。相机模块包括透镜结构和设置在透镜结构下方的图像传感器装置芯片。透镜结构包括透明基板和设置在透明基板上的透镜。间隔件设置在透明基板上以围绕透镜，其中间隔件包含基底图案和干膜光致抗蚀剂。该方法包括在载体上形成基底图案并在载体上附着干膜光致抗蚀剂。通过层压方法对干膜光致抗蚀剂进行平面化，然后将其图案化以形成间隔物。提供具有多个透镜的透明基板。间隔件从载体剥离，附着在透明基板上以围绕每个透镜，然后与图像传感器装置芯片粘合。

3. 发明申请

US20110292271A1 CAMERA MODULE AND FABRICATION METHOD THEREOF 审中-公开
标题翻译：相机模块及其制作方法
公开(公告)号：US20110292271A1
公开(公告)日：2011-12-01
申请号：US12788612
申请日：2010-05-27
申请人： Tzy-Ying LIN , Chieh-Yuan Cheng , Hung-Yeh Lin
发明人： Tzy-Ying LIN , Chieh-Yuan Cheng , Hung-Yeh Lin
IPC分类号： H04N5/225 , H01L31/18
CPC分类号： G02B13/0085 , H01L27/14618 , H01L31/02327 , H01L2924/0002 , H01L2924/00
摘要： A camera module is disclosed. The camera module includes an imager sensor device comprising a microlens array. A lens set overlies the imager sensor device. A dry film type photoresist spacer is interposed between the imager sensor device and the lens set, wherein the dry film type photoresist spacer has an opening above the microlens array. A fabrication method of the camera module is also disclosed.
摘要翻译：公开了一种相机模块。相机模块包括包括微透镜阵列的成像器传感器装置。镜头组覆盖在成像器传感器装置上。在成像器传感器装置和透镜组之间插入干膜型光刻胶隔离物，其中干膜型光刻胶隔离物在微透镜阵列上方具有开口。还公开了相机模块的制造方法。

4. 发明申请

US20130048208A1 METHOD FOR FABRICATING CAMERA MODULE 有权
标题翻译：制作摄像机模块的方法
公开(公告)号：US20130048208A1
公开(公告)日：2013-02-28
申请号：US13219948
申请日：2011-08-29
申请人： Tzy-Ying LIN , Chieh-Yuan Cheng , Hung-Yeh Lin
发明人： Tzy-Ying LIN , Chieh-Yuan Cheng , Hung-Yeh Lin
IPC分类号： B32B37/02 , B32B38/16 , B32B38/10 , B32B37/12 , B32B37/14
CPC分类号： H01L27/14618 , H01L27/14623 , H01L27/14625 , H01L27/14683 , H01L2924/0002 , Y10T156/11 , H01L2924/00
摘要： The invention provides a method for fabricating a camera module. An exemplary embodiment of the method for fabricating a camera module comprises providing plurality of lens sets. A dry film layer is formed on the plurality of lens sets. The dry film layer is patterned to form a plurality of dry film patterns respectively attaching to a plurality of lens sets. The plurality of lens sets are separated. A lens set separated from the plurality of lens sets is bonded to an image sensor device chip. The dry film pattern on the lens set is removed.
摘要翻译：本发明提供一种制造相机模块的方法。用于制造相机模块的方法的示例性实施例包括提供多个透镜组。在多个透镜组上形成干膜层。图案化干膜层以形成分别连接到多个透镜组的多个干膜图案。多个透镜组被分离。与多个透镜组分离的透镜组被结合到图像传感器装置芯片。去除透镜组上的干膜图案。

5. 发明申请

US20120307139A1 CAMERA MODULE AND FABRICATION METHOD THEREOF 有权
标题翻译：相机模块及其制作方法
公开(公告)号：US20120307139A1
公开(公告)日：2012-12-06
申请号：US13152690
申请日：2011-06-03
申请人： Chieh-Yuan CHENG , Hung-Yeh LIN
发明人： Chieh-Yuan CHENG , Hung-Yeh LIN
IPC分类号： H04N5/225 , H01L31/18
CPC分类号： H01L27/14685 , G02B7/003 , G02B7/02 , G02B7/021 , G03B17/12 , H01L27/14618 , H01L27/14625 , H01L27/14687 , H01L2924/0002 , H01L2924/00
摘要： A camera module and a fabrication method thereof are provided. The camera module includes a lens structure and an image sensor device chip disposed under the lens structure. The lens structure includes a transparent substrate and a lens disposed on the transparent substrate. A spacer is disposed on the transparent substrate to surround the lens, wherein the spacer contains a base pattern and a dry film photoresist. The method includes forming a base pattern on a carrier and attaching a dry film photoresist on the carrier. The dry film photoresist is planarized by a lamination process and then patterned to form a spacer. A transparent substrate having a plurality of lenses is provided. The spacer is stripped from the carrier, attaching on the transparent substrate to surround each of the lenses, and then bonded with image sensor device chips.
摘要翻译：提供了相机模块及其制造方法。相机模块包括透镜结构和设置在透镜结构下方的图像传感器装置芯片。透镜结构包括透明基板和设置在透明基板上的透镜。间隔件设置在透明基板上以围绕透镜，其中间隔件包含基底图案和干膜光致抗蚀剂。该方法包括在载体上形成基底图案并在载体上附着干膜光致抗蚀剂。通过层压方法对干膜光致抗蚀剂进行平面化，然后将其图案化以形成间隔物。提供具有多个透镜的透明基板。间隔件从载体剥离，附着在透明基板上以围绕每个透镜，然后与图像传感器装置芯片粘合。

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