专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 外观设计

USD876168S1 Dish 有权
公开(公告)号：USD876168S1
公开(公告)日：2020-02-25
申请号：US29659155
申请日：2018-08-07
申请人： Hyun Joo Kim
设计人： Hyun Joo Kim

2. 发明申请

US20100100619A1 METHOD AND APPARATUS FOR VISUALIZING NETWORK SECURITY STATE 有权
标题翻译：用于可视化网络安全状态的方法和装置
公开(公告)号：US20100100619A1
公开(公告)日：2010-04-22
申请号：US12517091
申请日：2007-10-24
申请人： Beom Hwan Chang , Chi Yoon Jeong , Seon Gyoung Sohn , Soo Hyung Lee , Hyo Chan Bang , Geon Lyang Kim , Hyun Joo Kim , Won Joo Park , Jong Ho Ryu , Jong Hyun Kim , Jung Chan Na , Jong Soo Jang , Sung Won Sohn
发明人： Beom Hwan Chang , Chi Yoon Jeong , Seon Gyoung Sohn , Soo Hyung Lee , Hyo Chan Bang , Geon Lyang Kim , Hyun Joo Kim , Won Joo Park , Jong Ho Ryu , Jong Hyun Kim , Jung Chan Na , Jong Soo Jang , Sung Won Sohn
IPC分类号： G06F11/32
CPC分类号： H04L41/28 , H04L41/0631 , H04L41/22 , H04L63/1425 , H04L63/20
摘要： There are provided a network security state visualization device and method, the device including: a security event collector collecting original security event information from network security apparatuses; a security event analyzer analyzing the original security event information collected by the security event collector and extracting characteristic data corresponding to a security event; and a three-dimensional visualization display unit visualizing a correlation between the characteristic data extracted by the security event analyzer as a three-dimensional screen to be displayed.
摘要翻译：提供了网络安全状态可视化设备和方法，该设备包括：安全事件收集器，从网络安全设备收集原始安全事件信息; 分析安全事件收集器收集的原始安全事件信息并提取对应于安全事件的特征数据的安全事件分析器; 以及三维可视化显示单元，将由安全事件分析器提取的特征数据之间的相关性可视化为要显示的三维屏幕。

3. 发明授权

US07200866B2 System and method for defending against distributed denial-of-service attack on active network 有权
标题翻译：用于防御活动网络上的分布式拒绝服务攻击的系统和方法
公开(公告)号：US07200866B2
公开(公告)日：2007-04-03
申请号：US10640400
申请日：2003-08-14
申请人： Hyun Joo Kim , Jung-Chan Na , Sung Won Sohn
发明人： Hyun Joo Kim , Jung-Chan Na , Sung Won Sohn
IPC分类号： G06F11/00
CPC分类号： H04L63/1458
摘要： A system for defending against a distributed denial-of-service attack includes an intrusion detection system, an active security management system and an active security node. The intrusion detection system generates alert data if a denial-of-service attack is detected. The active security management system manages a domain, analyzes the alert data, generates and transmits a backtracking sensor in a case of the distributed denial-of-service attack, transmits mobile sensors to a host backtracked by the backtracking sensor to remove a master or an agent program within the host; and generates and transmits a backtracking sensor by using an IP address of a host that has transmitted a packet to the removed master or agent program. The active security node executes the transmitted backtracking sensor to backtrack an attacking host of the distributed denial-of-service attack and, if the backtracked host is determined as a real attacker, intercepts a traffic generated from the real attacker.
摘要翻译：防范分布式拒绝服务攻击的系统包括入侵检测系统，主动安全管理系统和主动安全节点。如果检测到拒绝服务攻击，入侵检测系统会生成警报数据。主动安全管理系统管理域，分析警报数据，在分布式拒绝服务攻击的情况下生成并发送回溯传感器，将移动传感器发送到由回溯传感器回溯的主机，以移除主服务器或主机内的代理程序; 并通过使用已经向已移除的主机或代理程序发送分组的主机的IP地址来生成并发送回溯传感器。主动安全节点执行传输的回溯传感器以回溯攻击主机的分布式拒绝服务攻击，并且如果回溯主机被确定为真正的攻击者，则截获从真实攻击者产生的流量。

4. 发明申请

US20060225299A1 Method of transferring a substrate 审中-公开
标题翻译：转移基材的方法
公开(公告)号：US20060225299A1
公开(公告)日：2006-10-12
申请号：US11451315
申请日：2006-06-13
申请人： Hyun-Joo Kim , Yo-Han Ahn , Dong-Seok Ham , Jae-Bong Kim
发明人： Hyun-Joo Kim , Yo-Han Ahn , Dong-Seok Ham , Jae-Bong Kim
IPC分类号： F26B21/06
CPC分类号： H01L21/67017 , H01L21/67772
摘要： A method of controlling contamination in a substrate transfer chamber that is disposed between a load port for supporting a container to receive a plurality of substrates and a substrate process module for processing the substrates includes supplying a purge gas into the substrate transfer chamber to purge an interior of the substrate transfer chamber, circulating the purge gas supplied into the substrate transfer chamber through a gas circular pipe, removing particles and airborne molecular contaminants from the purge gas being circulated, and resupplying the circulated purge gas into the substrate transfer chamber.
摘要翻译：一种控制衬底传送室中的污染物的方法，该衬底传送室设置在用于支撑容器以容纳多个衬底的负载端口和用于处理衬底的衬底处理模块之间，包括将清洗气体供应到衬底传送室中以净化内部的衬底传送室，通过气体环形管循环供给到衬底传送室的吹扫气体，从循环的吹扫气体中除去颗粒和空气传播的分子污染物，并将循环的净化气体再供给到衬底传送室中。

5. 发明授权

US11136779B2 Seismic isolation device 有权
公开(公告)号：US11136779B2
公开(公告)日：2021-10-05
申请号：US16476230
申请日：2017-05-23
申请人： Heung Yeol Kim , Hyun Joo Kim , Nicole Yoonjung Kim
发明人： Heung Yeol Kim
IPC分类号： E04H9/02 , E04B1/98
摘要： The present invention relates to a seismic isolation device, including: a sliding platform (100) having a sliding surface (120) of a downwardly concave spherical shape formed on an upper surface thereof; and a sliding body (200) placed on the sliding surface (120) being capable of sliding on the sliding surface (120) by means of a sliding means, wherein the sliding body (200) slides on the sliding surface (120) in a situation where an earthquake occurs to effectively absorb vibrations applied to a structure, such that the structure can be safely protected.

6. 发明授权

US09559080B2 Integrated circuit device packages and methods for manufacturing integrated circuit device packages 有权
标题翻译：集成电路器件封装以及用于制造集成电路器件封装的方法
公开(公告)号：US09559080B2
公开(公告)日：2017-01-31
申请号：US14395116
申请日：2013-03-18
申请人： Jae-Sung Lim , Ju-Hyung Kim , Jin-Wook Jeong , Hyun-Joo Kim , Hyouk Lee
发明人： Jae-Sung Lim , Ju-Hyung Kim , Jin-Wook Jeong , Hyun-Joo Kim , Hyouk Lee
IPC分类号： H01L21/02 , H01L25/065 , H01L23/498 , H01L23/538 , H01L23/00 , H01L21/768 , H01L23/04 , H01L23/522 , H01L23/528 , H01L23/532 , H01L25/00 , H01L23/31
CPC分类号： H01L25/0657 , H01L21/768 , H01L23/04 , H01L23/3121 , H01L23/3135 , H01L23/4985 , H01L23/5226 , H01L23/528 , H01L23/53228 , H01L23/53242 , H01L23/53257 , H01L23/5389 , H01L23/564 , H01L24/16 , H01L24/24 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/92 , H01L25/50 , H01L2224/04105 , H01L2224/16145 , H01L2224/24145 , H01L2224/24226 , H01L2224/32145 , H01L2224/32225 , H01L2224/73209 , H01L2224/73267 , H01L2224/8203 , H01L2224/821 , H01L2224/9202 , H01L2224/92144 , H01L2224/92244 , H01L2225/06513 , H01L2225/06524 , H01L2225/06541 , H01L2924/12042 , H01L2924/00
摘要： An integrated circuit device package may include a flexible substrate having a first wiring, an integrated circuit device having a second wiring, a flexible insulation structure having a first opening and a second opening exposing the first wiring and the second wiring, respectively, a third wiring electrically connecting the first wiring to the second wiring, and a flexible protection member covering the third wiring. A stacked flexible integrated circuit device package may include a flexible substrate, a first flexible integrated circuit device including a first connection pad, a second flexible integrated circuit device including a second connection pad, a connection wiring electrically connecting the first and the second connection pads to an external device, and a flexible protection member disposed on the second flexible integrated circuit device.
摘要翻译：集成电路器件封装可以包括具有第一布线的柔性基板，具有第二布线的集成电路器件，具有第一开口的柔性绝缘结构和分别暴露第一布线和第二布线的第二开口;第三布线将第一布线电连接到第二布线，以及覆盖第三布线的柔性保护构件。层叠的柔性集成电路器件封装可以包括柔性衬底，包括第一连接焊盘的第一柔性集成电路器件，包括第二连接焊盘的第二柔性集成电路器件，将第一和第二连接焊盘电连接到外部装置和设置在第二柔性集成电路装置上的柔性保护构件。

7. 发明授权

US09380371B2 Apparatus and method for recognizing earphone mounting in portable terminal 有权
标题翻译：用于识别便携式终端中的耳机安装的装置和方法
公开(公告)号：US09380371B2
公开(公告)日：2016-06-28
申请号：US12962933
申请日：2010-12-08
申请人： Cheol-Woong Park , You-Sung Lee , Il-Seob Baek , Jung-Eun Hwang , Jun-Ki Seo , Hyun-Joo Kim
发明人： Cheol-Woong Park , You-Sung Lee , Il-Seob Baek , Jung-Eun Hwang , Jun-Ki Seo , Hyun-Joo Kim
IPC分类号： H04R1/00 , H04R1/10 , H01R13/641 , H01R24/58 , H04M1/60 , H01R105/00 , H01R107/00 , H04R5/04
CPC分类号： H04R1/1041 , H01R13/641 , H01R24/58 , H01R2105/00 , H01R2107/00 , H04M1/6058 , H04R5/04 , H04R2420/05 , H04R2420/09
摘要： An apparatus and method for improving the performance of a determination of whether an earphone is mounted to a portable terminal, such as a portable terminal supporting a 3.5 mm earphone plug, are provided. An apparatus for recognizing whether the earphone is mounted to the portable terminal includes a common ground terminal and a switching terminal of an earphone plug receptacle for electrically connecting to each other and the same pole of an earphone plug when the earphone plug is mounted in the earphone plug receptacle, and an external output managing unit for generating an earphone mounting notification signal through a detector.
摘要翻译：提供了一种用于改善确定耳机是否被安装到诸如支持3.5mm耳机插头的便携式终端的便携式终端的性能的装置和方法。用于识别耳机是否安装到便携式终端的装置包括：当耳机插头安装在耳机中时，公共接地端子和用于彼此电连接的耳机插头插座的耳机插头的同一极点的耳机插头插座的开关端子插头插座和外部输出管理单元，用于通过检测器产生耳机安装通知信号。

8. 发明授权

US09229226B2 Hybrid apparatus and methods for analyzing electromagnetic waves 有权
标题翻译：用于分析电磁波的混合装置和方法
公开(公告)号：US09229226B2
公开(公告)日：2016-01-05
申请号：US13494226
申请日：2012-06-12
申请人： Shin-Wook Yi , Masatomo Nakazato , Tetsunori Wada , Hyun-joo Kim , Young-kwan Park , Jae-sung Shin
发明人： Shin-Wook Yi , Masatomo Nakazato , Tetsunori Wada , Hyun-joo Kim , Young-kwan Park , Jae-sung Shin
IPC分类号： G06F7/60 , G06F17/10 , G02B27/00 , G06F17/50 , G02F1/313 , G02F1/00 , G02B6/35
CPC分类号： G02B27/0012 , G02B6/3588 , G02F1/0081 , G02F1/3134 , G06F17/5018
摘要： Analysis of an electromagnetic wave traveling in an optical device, can be performed quickly and correctly. A structure forming process simulator forms an analysis structure of a physical object to be analyzed. A hybrid optical simulator calculates time-independent data and time-dependent data of an electromagnetic field by dividing the analysis structure into parts, determining whether a metallic or magnetic material is included in each of the divided parts, and selectively applying a Beam Propagation Method (BPM) or a Finite Difference Time Domain (FDTD) method to the divided parts. A storage device stores the time-independent data and the time-dependent data output from the hybrid optical simulator as hybrid electric field data. Related methods are also described.
摘要翻译：能够快速，准确地进行光学装置中的电磁波的分析。结构形成过程模拟器形成要分析的物理对象的分析结构。混合光学模拟器通过将分析结构划分为部分来计算电磁场的时间无关数据和时间依赖数据，确定每个分割部分中是否包括金属或磁性材料，以及选择性地应用光束传播方法 BPM）或有限差分时域（FDTD）方法。存储装置将与混合光模拟器输出的时间无关的数据和时间相关数据存储为混合电场数据。还描述了相关方法。

9. 发明申请

US20150076683A1 Integrated Circuit Device Packages And Methods for Manufacturing Integrated Circuit Device Packages 有权
标题翻译：集成电路器件封装及制造集成电路器件封装的方法
公开(公告)号：US20150076683A1
公开(公告)日：2015-03-19
申请号：US14395116
申请日：2013-03-18
申请人： Jae-Sung Lim , Ju-Hyung Kim , Jin-Wook Jeong , Hyun-Joo Kim , Hyouk Lee
发明人： Jae-Sung Lim , Ju-Hyung Kim , Jin-Wook Jeong , Hyun-Joo Kim , Hyouk Lee
IPC分类号： H01L25/065 , H01L23/528 , H01L21/768 , H01L23/522 , H01L25/00 , H01L23/04 , H01L23/00 , H01L23/532
CPC分类号： H01L25/0657 , H01L21/768 , H01L23/04 , H01L23/3121 , H01L23/3135 , H01L23/4985 , H01L23/5226 , H01L23/528 , H01L23/53228 , H01L23/53242 , H01L23/53257 , H01L23/5389 , H01L23/564 , H01L24/16 , H01L24/24 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/92 , H01L25/50 , H01L2224/04105 , H01L2224/16145 , H01L2224/24145 , H01L2224/24226 , H01L2224/32145 , H01L2224/32225 , H01L2224/73209 , H01L2224/73267 , H01L2224/8203 , H01L2224/821 , H01L2224/9202 , H01L2224/92144 , H01L2224/92244 , H01L2225/06513 , H01L2225/06524 , H01L2225/06541 , H01L2924/12042 , H01L2924/00
摘要： An integrated circuit device package may include a flexible substrate having a first wiring, an integrated circuit device having a second wiring, a flexible insulation structure having a first opening and a second opening exposing the first wiring and the second wiring, respectively, a third wiring electrically connecting the first wiring to the second wiring, and a flexible protection member covering the third wiring. A stacked flexible integrated circuit device package may include a flexible substrate, a first flexible integrated circuit device including a first connection pad, a second flexible integrated circuit device including a second connection pad, a connection wiring electrically connecting the first and the second connection pads to an external device, and a flexible protection member disposed on the second flexible integrated circuit device.
摘要翻译：集成电路器件封装可以包括具有第一布线的柔性基板，具有第二布线的集成电路器件，具有第一开口的柔性绝缘结构和分别暴露第一布线和第二布线的第二开口;第三布线将第一布线电连接到第二布线，以及覆盖第三布线的柔性保护构件。层叠的柔性集成电路器件封装可以包括柔性衬底，包括第一连接焊盘的第一柔性集成电路器件，包括第二连接焊盘的第二柔性集成电路器件，将第一和第二连接焊盘电连接到外部装置和设置在第二柔性集成电路装置上的柔性保护构件。

10. 发明授权

US08878349B2 Semiconductor chip and stacked semiconductor package having the same 有权
标题翻译：半导体芯片和具有相同的堆叠半导体封装
公开(公告)号：US08878349B2
公开(公告)日：2014-11-04
申请号：US13586309
申请日：2012-08-15
申请人： Gyu Jei Lee , Kang Won Lee , Hyun Joo Kim
发明人： Gyu Jei Lee , Kang Won Lee , Hyun Joo Kim
IPC分类号： H01L23/20
CPC分类号： H01L23/481 , H01L2224/0401 , H01L2224/05009 , H01L2224/06181 , H01L2224/13 , H01L2224/13025 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/15311 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor chip includes a semiconductor substrate having one surface, an other surface which faces away from the one surface, and through holes which pass through the one surface and the other surface; through electrodes filled in the through holes; and a gettering layer formed of polysilicon interposed between the through electrodes and inner surfaces of the semiconductor substrate whose form is defined by the through holes.
摘要翻译：半导体芯片包括具有一个表面的半导体衬底，一个表面背离其他表面的半导体衬底以及穿过一个表面和另一个表面的通孔; 通过填充在通孔中的电极; 以及由介于通孔之间的多晶硅形成的吸杂层和形成由通孔限定的半导体衬底的内表面。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式