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1. 发明申请

US20160190112A1 CARRIER ARRAY AND LIGHT EMITTING DIODE PACKAGE 有权
标题翻译：载体阵列和发光二极管封装
公开(公告)号：US20160190112A1
公开(公告)日：2016-06-30
申请号：US14979527
申请日：2015-12-28
申请人： INGENII TECHNOLOGIES CORPORATION
发明人： Cheng-Ta Yu
IPC分类号： H01L25/16 , H01L33/54 , H01L33/62
CPC分类号： H01L25/167 , H01L23/00 , H01L33/54 , H01L2224/05554 , H01L2224/48091 , H01L2224/97 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A carrier array adapted for carrying a plurality of chips is provided. The carrier array includes a lead frame, controllers and first packages. The lead frame includes a frame body and a plurality of lead frame units. The lead frame units are connected with each other through the frame body and arranged in an array. Each of the lead frame units includes at least one first pin connected with the frame body and a plurality of second pins not connected with the frame body. The controllers are disposed on the lead frame units, and electrically connected with the corresponding lead frame units, respectively. Each of the first packages is disposed on the lead frame, and respectively has an opening to expose a portion region of the corresponding lead frame unit, and the openings are adapted for accommodating the chips. A light emitting diode package is also provided.
摘要翻译：提供适于承载多个芯片的载体阵列。载体阵列包括引线框架，控制器和第一封装。引线框架包括框体和多个引线框架单元。引线框单元通过框架体彼此连接并排列成阵列。每个引线框架单元包括至少一个与框体连接的第一引脚和多个与框体连接的第二引脚。控制器设置在引线框架单元上，并分别与相应的引线框架单元电连接。每个第一包装被布置在引线框架上，并且分别具有用于暴露相应引线框架单元的部分区域的开口，并且开口适于容纳芯片。还提供了发光二极管封装。

2. 发明授权

US09613940B2 Carrier array and light emitting diode package 有权
公开(公告)号：US09613940B2
公开(公告)日：2017-04-04
申请号：US14979527
申请日：2015-12-28
申请人： INGENII TECHNOLOGIES CORPORATION
发明人： Cheng-Ta Yu
IPC分类号： H01L25/16 , H01L33/54 , H01L33/62 , H01L23/00
CPC分类号： H01L25/167 , H01L23/00 , H01L33/54 , H01L2224/05554 , H01L2224/48091 , H01L2224/97 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A carrier array adapted for carrying a plurality of chips is provided. The carrier array includes a lead frame, controllers and first packages. The lead frame includes a frame body and a plurality of lead frame units. The lead frame units are connected with each other through the frame body and arranged in an array. Each of the lead frame units includes at least one first pin connected with the frame body and a plurality of second pins not connected with the frame body. The controllers are disposed on the lead frame units, and electrically connected with the corresponding lead frame units, respectively. Each of the first packages is disposed on the lead frame, and respectively has an opening to expose a portion region of the corresponding lead frame unit, and the openings are adapted for accommodating the chips. A light emitting diode package is also provided.

3. 发明授权

US10031179B2 Testing method 有权
公开(公告)号：US10031179B2
公开(公告)日：2018-07-24
申请号：US14979508
申请日：2015-12-27
申请人： INGENII TECHNOLOGIES CORPORATION
发明人： Cheng-Ta Yu
IPC分类号： G01R31/02 , G01R31/26 , G01R31/28
摘要： A testing method including the following steps is provided. A lead frame is provided, wherein the lead frame includes a frame body and a plurality of lead frame units which are connected with each other through the frame body and are arranged in array. Each of the lead frame units includes at least one first pin connected with the frame body and a plurality of second pins which are connected with each other. A plurality of controllers are bonded with the lead frame units and each of the controllers is electrically connected with the corresponding lead frame unit. The frame body of each of the lead frame units is electrically isolated from the second pins. A first electrical testing is performed to each of the lead frame units carrying the controllers.

4. 发明申请

US20160187417A1 TESTING METHOD 审中-公开
标题翻译：测试方法
公开(公告)号：US20160187417A1
公开(公告)日：2016-06-30
申请号：US14979508
申请日：2015-12-27
申请人： INGENII TECHNOLOGIES CORPORATION
发明人： Cheng-Ta Yu
IPC分类号： G01R31/28
CPC分类号： G01R31/2898 , G01R31/2893 , G01R31/2896
摘要： A testing method including the following steps is provided. A lead frame is provided, wherein the lead frame includes a frame body and a plurality of lead frame units which are connected with each other through the frame body and are arranged in array. Each of the lead frame units includes at least one first pin connected with the frame body and a plurality of second pins which are connected with each other. A plurality of controllers are bonded with the lead frame units and each of the controllers is electrically connected with the corresponding lead frame unit. The frame body of each of the lead frame units is electrically isolated from the second pins. A first electrical testing is performed to each of the lead frame units carrying the controllers.
摘要翻译：提供了包括以下步骤的测试方法。提供了一种引线框架，其中引线框架包括框体和多个引线框架单元，它们通过框架体彼此连接并排列成阵列。每个引线框架单元包括至少一个与框体连接的第一引脚和彼此连接的多个第二引脚。多个控制器与引线框架单元结合，并且每个控制器与相应的引线框架单元电连接。每个引线框架单元的框体与第二引脚电隔离。对携带控制器的引导框架单元执行第一次电测试。

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