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1. 发明授权

US08687954B2 Flash lens and flash module employing the same 有权
标题翻译：闪光镜头和闪光灯模块采用相同的
公开(公告)号：US08687954B2
公开(公告)日：2014-04-01
申请号：US13272683
申请日：2011-10-13
申请人： Jae-sung You , Cheon-ho Park , Sung-kyong Oh , Kwan-young Oh
发明人： Jae-sung You , Cheon-ho Park , Sung-kyong Oh , Kwan-young Oh
IPC分类号： G03G15/05 , G03B15/03
CPC分类号： G03B15/03 , F21V13/04 , G02B3/08 , G02B19/0028 , G02B19/0061 , G03B15/05 , G03B2215/0503
摘要： A flash lens and a flash module employing the same. The flash lens includes a lens unit including an incident surface, a reflecting surface, and a light-emitting surface; and a lens seating portion disposed at a lower portion of an edge of the light-emitting surface, extending and protruding from the reflecting surface, and including a pattern formed in a lower surface thereof. In addition, the flash module according to an embodiment of the present invention may include the flash lens and a light emitting diode (LED) chip integrally formed with the flash lens.
摘要翻译：闪光镜头和使用其的闪光灯模块。闪光镜包括透镜单元，其包括入射表面，反射表面和发光表面; 以及透镜座部，其设置在从所述反射面延伸并突出的所述发光面的边缘的下部，并且包括形成在所述发光面的下表面的图案。此外，根据本发明的实施例的闪光灯模块可以包括闪光镜头和与闪光镜片一体形成的发光二极管（LED）芯片。

2. 发明申请

US20120241797A1 LIGHT EMITTING DIODE, MANUFACTURING METHOD THEREOF, LIGHT EMITTING DIODE MODULE, AND MANUFACTURING METHOD THEREOF 有权
标题翻译：发光二极管，其制造方法，发光二极管模块及其制造方法
公开(公告)号：US20120241797A1
公开(公告)日：2012-09-27
申请号：US13428726
申请日：2012-03-23
申请人： Hak Hwan KIM , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
发明人： Hak Hwan KIM , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
IPC分类号： H01L33/50
CPC分类号： H01L33/62 , H01L21/568 , H01L33/505 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/73265 , H01L2224/73267 , H01L2224/92144 , H01L2224/97 , H01L2924/15153 , H01L2933/0041 , H01L2924/00014 , H01L2224/83
摘要： A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.
摘要翻译：提供了一种发光二极管（LED）的制造方法和LED模块的制造方法。 LED的制造方法可以包括制造多个LED芯片，制造包括多个用于安装多个LED芯片的多个安装区域的荧光体预成型件，在磷光体预成型件内部施加粘合剂，安装多个LED芯片的多个安装区域中的每一个中的LED芯片，并且将安装有多个LED芯片的荧光体预成型件切割成包括各个LED芯片的单元。

3. 发明申请

US20120181559A1 LIGHT-EMITTING DEVICE PACKAGE 失效
标题翻译：发光装置包装
公开(公告)号：US20120181559A1
公开(公告)日：2012-07-19
申请号：US13347163
申请日：2012-01-10
申请人： Jong-kil Park , Jae-sung You , Sung-uk Zhang , Tae-gyu Kim , Bang-weon Lee
发明人： Jong-kil Park , Jae-sung You , Sung-uk Zhang , Tae-gyu Kim , Bang-weon Lee
IPC分类号： H01L33/50 , H01L33/58
CPC分类号： H01L33/58 , H01L33/507 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/12044 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.
摘要翻译：一种发光器件封装，包括：包括空腔的封装主体和包括设置在所述空腔中的安装部分和多个端子部分的引线框架; 安装在所述安装部上的发光装置芯片; 多个用于电连接所述多个端子部分和所述发光器件芯片的接合线; 填充在空腔中的透光封装层; 以及设置在所述空腔中并阻挡所述封装层以接触所述多个接合线的透光盖构件。

4. 发明申请

US20120114323A1 FLASH LENS AND FLASH MODULE EMPLOYING THE SAME 有权
标题翻译：闪光灯和使用其的闪光灯组件
公开(公告)号：US20120114323A1
公开(公告)日：2012-05-10
申请号：US13272683
申请日：2011-10-13
申请人： Jae-sung YOU , Cheon-ho Park , Sung-Kyong Oh , Kwan-young Oh
发明人： Jae-sung YOU , Cheon-ho Park , Sung-Kyong Oh , Kwan-young Oh
IPC分类号： G03B15/03
CPC分类号： G03B15/03 , F21V13/04 , G02B3/08 , G02B19/0028 , G02B19/0061 , G03B15/05 , G03B2215/0503
摘要： A flash lens and a flash module employing the same. The flash lens includes a lens unit including an incident surface, a reflecting surface, and a light-emitting surface; and a lens seating portion disposed at a lower portion of an edge of the light-emitting surface, extending and protruding from the reflecting surface, and including a pattern formed in a lower surface thereof. In addition, the flash module according to an embodiment of the present invention may include the flash lens and a light emitting diode (LED) chip integrally formed with the flash lens.
摘要翻译：闪光镜头和使用其的闪光灯模块。闪光镜包括透镜单元，其包括入射表面，反射表面和发光表面; 以及透镜座部，其设置在从所述反射面延伸并突出的所述发光面的边缘的下部，并且包括形成在所述发光面的下表面的图案。此外，根据本发明的实施例的闪光灯模块可以包括闪光镜头和与闪光镜片一体形成的发光二极管（LED）芯片。

5. 发明授权

US08960932B2 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US08960932B2
公开(公告)日：2015-02-24
申请号：US13436102
申请日：2012-03-30
申请人： Jae Sung You , Jong Sup Song
发明人： Jae Sung You , Jong Sup Song
IPC分类号： F21V9/16 , H01L33/50 , H01L25/075 , H01L33/54 , H01L33/58
CPC分类号： H01L25/0753 , G02B19/0014 , G02B19/0066 , H01L33/54 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A light emitting device includes: a substrate having a bar shape; a plurality of light emitting elements separately mounted in a lengthwise direction of the substrate on an upper surface of the substrate; and a light-transmissive cover formed to be upwardly convex, having one or more localized concave portions, and installed on the substrate to cover at least two of the plurality of light emitting elements together.
摘要翻译：发光器件包括：具有条形的衬底; 多个发光元件，分别安装在基板的上表面上的基板的长度方向上; 以及形成为向上凸起的具有一个或多个局部凹部的透光性盖，并且安装在所述基板上以将所述多个发光元件中的至少两个覆盖在一起。

6. 发明授权

US08896018B2 Vacuum tray and method of manufacturing light emitting device using the same 有权
标题翻译：真空托盘及使用其的制造发光装置的方法
公开(公告)号：US08896018B2
公开(公告)日：2014-11-25
申请号：US13483768
申请日：2012-05-30
申请人： Jong Sup Song , Tae Gyu Kim , Jae Sung You
发明人： Jong Sup Song , Tae Gyu Kim , Jae Sung You
IPC分类号： H01L33/00 , B25B11/00 , H01L33/50
CPC分类号： H01L33/505 , B25B11/005 , H01L2933/0041
摘要： There is provided a vacuum tray including a pocket part; a seating part being stepped downwardly from a bottom surface of the pocket part and having a light emitting device seated therein; and a cavity part being stepped downwardly from edges of the seating part and having an electrode terminal of the light emitting device accommodated therein. The pocket part may include a plurality of pocket parts having a matrix structure, such that the plurality of pocket parts are arranged in columns and rows.
摘要翻译：提供包括袋部的真空托盘; 从所述口袋部的底面向下方突出并具有安置在其中的发光装置的座部; 以及空腔部分，其从所述就座部分的边缘向下阶梯并且容纳有所述发光装置的电极端子。口袋部分可以包括具有矩阵结构的多个口袋部件，使得多个袋部件以列和列排列。

7. 发明授权

US08757833B2 Light emitting device package 有权
标题翻译：发光装置封装
公开(公告)号：US08757833B2
公开(公告)日：2014-06-24
申请号：US13411094
申请日：2012-03-02
申请人： Jae Sung You
发明人： Jae Sung You
IPC分类号： F21V1/00
CPC分类号： H01L33/60 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2933/0058 , H01L2924/00014
摘要： There is provided a light emitting device package, including at least one light emitting device; a lead frame electrically connected to the light emitting device; a body part supporting the light emitting device and the lead frame and including a cavity opened so as to expose the light emitting device and the lead frame; a reflecting part fitted and fixed into the cavity so as to surround the light emitting device; and a sealing part filled in the reflecting part and sealing the light emitting device.
摘要翻译：提供了一种发光器件封装，包括至少一个发光器件; 电连接到所述发光器件的引线框架; 支撑所述发光装置和所述引线框架的主体部分，并且包括敞开以使所述发光装置和所述引线框架露出的空腔; 反射部分，其被安装并固定到所述腔中以围绕所述发光器件; 以及填充在反射部中并密封发光器件的密封部。

8. 发明授权

US08740398B2 Camera flash module 有权
标题翻译：相机闪光灯模块
公开(公告)号：US08740398B2
公开(公告)日：2014-06-03
申请号：US13540127
申请日：2012-07-02
申请人： Jae Sung You
发明人： Jae Sung You
IPC分类号： G03B15/02 , F21V5/00
CPC分类号： G03B15/05 , G03B2215/0582 , G03B2215/0592
摘要： A camera flash module is provided. The camera flash module may include a lens having a single refractive surface and a reflector that adjusts a direction of a light emitted from the lens. Accordingly, maintaining of a distance between a light emitting device and the lens may not be needed and thus, the camera flash module may be readily manufactured and a productivity may be improved. An error rate caused by distortion in a tilt and an optical axis between the light emitting device and the lens may be reduced. The reflector may adjust a direction of a light emitted from the lens and thus, an emission pattern requested by a camera may be satisfied, and a velocity of light may be improved. The reflector may surround the lens and thus, may prevent the lens from being detached from a light emitting device package body when an external impact occurs.
摘要翻译：提供相机闪光灯模块。相机闪光灯模块可以包括具有单个折射表面的透镜和调节从透镜发射的光的方向的反射器。因此，可能不需要维持发光装置和透镜之间的距离，因此，可以容易地制造照相机闪光模块并且可以提高生产率。可以减少由发光器件和透镜之间的倾斜和光轴的失真引起的误差率。反射器可以调节从透镜发射的光的方向，从而可以满足由照相机请求的发射图案，并且可以提高光速。反射器可以围绕透镜，因此，当外部冲击发生时，可以防止透镜从发光器件封装体脱离。

9. 发明授权

US08513680B2 Semiconductor package and method of manufacturing the same 有权
公开(公告)号：US08513680B2
公开(公告)日：2013-08-20
申请号：US13234971
申请日：2011-09-16
申请人： Daniel Kim , Jae-sung You , Jong-kil Park
发明人： Daniel Kim , Jae-sung You , Jong-kil Park
IPC分类号： H01L27/15 , H01L31/12 , H01L33/00
CPC分类号： H01L33/60 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device package including a lead frame formed of a metal and on which a light-emitting device chip is mounted; and a mold frame coupled to the lead frame by injection molding. The lead frame includes: a mounting portion on which the light-emitting device chip is mounted; and first and second connection portions that are disposed on two sides of the mounting portion in a first direction and connected to the light-emitting device chip by wire bonding, wherein the first connection portion is stepped with respect to the mounting portion, and a stepped amount is less than a material thickness of the lead frame.

10. 发明申请

US20130049047A1 LIGHT EMITTING DIODE MODULE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：发光二极管模块及其制造方法
公开(公告)号：US20130049047A1
公开(公告)日：2013-02-28
申请号：US13558015
申请日：2012-07-25
申请人： Jae Sung YOU
发明人： Jae Sung YOU
IPC分类号： H01L33/60 , H01L33/48
CPC分类号： H01L33/486 , H01L33/54 , H01L2924/0002 , H01L2933/005 , H01L2924/00
摘要： A light emitting diode (LED) module includes a substrate, an LED disposed on the substrate, a phosphor layer disposed on the LED, and a lens disposed on the substrate. The substrate has a recess defined therein. The lens is fastened to the substrate through the recess. A manufacturing method for the LED includes forming the recess in the substrate, mounting the LED on the substrate, forming the phosphor layer on the LED, and forming the lens directly on the substrate such that the lens is fastened to the substrate through the recess.
摘要翻译：发光二极管（LED）模块包括基板，设置在基板上的LED，设置在LED上的荧光体层和设置在基板上的透镜。衬底具有限定在其中的凹部。透镜通过凹槽固定到基底。 LED的制造方法包括在基板上形成凹部，将LED安装在基板上，在LED上形成荧光体层，直接在基板上形成透镜，使得透镜通过凹部固定于基板。

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