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    • 1. 发明授权
    • Circuits and methods for hardening volatile memory circuits through one time programming
    • 通过一次编程硬化易失性存储器电路的电路和方法
    • US08611138B1
    • 2013-12-17
    • US13354740
    • 2012-01-20
    • Charles Y. ChuJeffrey Xiaoqi Tung
    • Charles Y. ChuJeffrey Xiaoqi Tung
    • G11C11/00G11C17/00G11C17/18
    • G11C17/146G11C17/16G11C17/18
    • Circuits and techniques for operating a memory cell on an integrated circuit (IC) are disclosed. A disclosed memory cell includes a first inverter coupled to a second inverter to form a first connection and a second connection. The first connection is operable to receive at least a first data signal at a first voltage and the second connection is operable to receive at least a second data signal at a second voltage. A first oxide capacitor and a second oxide capacitor are coupled to the first and second connections respectively. Both the first and second oxide capacitors are coupled to receive a programming signal at a third voltage that may be operable to rupture either one of the first or second oxide capacitor.
    • 公开了用于操作集成电路(IC)上的存储单元的电路和技术。 所公开的存储单元包括耦合到第二反相器以形成第一连接和第二连接的第一反相器。 第一连接可操作以在第一电压下接收至少第一数据信号,并且第二连接可操作以在第二电压下接收至少第二数据信号。 第一氧化物电容器和第二氧化物电容器分别耦合到第一和第二连接。 第一和第二氧化物电容器都被耦合以在第三电压处接收编程信号,该第三电压可操作以破坏第一或第二氧化物电容器中的任一个。
    • 5. 发明授权
    • Stressed transistors with reduced leakage
    • 压力降低的晶体管泄漏
    • US08138791B1
    • 2012-03-20
    • US12694603
    • 2010-01-27
    • Albert RatnakumarJun LiuJeffrey Xiaoqi TungQi Xiang
    • Albert RatnakumarJun LiuJeffrey Xiaoqi TungQi Xiang
    • H03K19/177
    • H03K19/0008H01L27/11807H01L29/78H01L29/7843H01L29/7847H01L29/7848
    • Integrated circuits with stressed transistors are provided. Stressing transistors may increase transistor threshold voltage without the need to increase channel doping. Stressing transistors may reduce total leakage currents. It may be desirable to compressively stress N-channel metal-oxide-semiconductor (NMOS) transistors and tensilely stress P-channel metal-oxide-semiconductor (PMOS) transistors to reduce leakage currents. Techniques that can be used to alter the amount of stressed experienced by transistors may include forming a stress-inducing layer, forming a stress liner, forming diffusion active regions using silicon germanium, silicon carbon, or standard silicon, implementing transistors in single-finger instead of multi-finger configurations, and implanting particles. Any combination of these techniques may be used to provide appropriate amounts of stress to increase the performance or decrease the total leakage current of a transistor.
    • 提供了具有应力晶体管的集成电路。 应力晶体管可以增加晶体管阈值电压,而不需要增加沟道掺杂。 应力晶体管可能会减少总漏电流。 可能需要压缩应力N沟道金属氧化物半导体(NMOS)晶体管和拉伸应力P沟道金属氧化物半导体(PMOS)晶体管以减少漏电流。 可用于改变晶体管经受的应力的技术可包括形成应力诱导层,形成应力衬垫,使用硅锗,硅碳或标准硅形成扩散有源区,以单指代替晶体管 的多指配置和植入颗粒。 可以使用这些技术的任何组合来提供适当量的应力以增加晶体管的性能或降低总泄漏电流。
    • 7. 发明申请
    • ASYMMETRIC METAL-OXIDE-SEMICONDUCTOR TRANSISTORS
    • 不对称金属氧化物半导体晶体管
    • US20100127331A1
    • 2010-05-27
    • US12324789
    • 2008-11-26
    • Albert RatnakumarJun LiuJeffrey Xiaoqi TungQi Xiang
    • Albert RatnakumarJun LiuJeffrey Xiaoqi TungQi Xiang
    • H01L29/78G06F17/50
    • G06F17/5063H01L29/4983H01L29/66545H01L29/78
    • Mixed gate metal-oxide-semiconductor transistors are provided. The transistors may have an asymmetric configuration that exhibits increased output resistance. Each transistor may be formed from a gate insulating layer formed on a semiconductor. The gate insulating layer may be a high-K material. Source and drain regions in the semiconductor may define a transistor gate length. The gate length may be larger than the minimum specified by semiconductor fabrication design rules. The transistor gate may be formed from first and second gate conductors with different work functions. The relative sizes of the first and gate conductors in a given transistor control the threshold voltage for the transistor. A computer-aided design tool may be used to receive a circuit design from a user. The tool may generate fabrication masks for the given design that include mixed gate transistors with threshold voltages optimized to meet circuit design criteria.
    • 提供混合栅极金属氧化物半导体晶体管。 晶体管可以具有表现出增加的输出电阻的非对称配置。 每个晶体管可以由形成在半导体上的栅极绝缘层形成。 栅极绝缘层可以是高K材料。 半导体中的源极和漏极区域可以限定晶体管栅极长度。 栅极长度可以大于由半导体制造设计规则规定的最小值。 晶体管栅极可以由具有不同功函数的第一和第二栅极导体形成。 给定晶体管中的第一和栅极导体的相对尺寸控制晶体管的阈值电压。 计算机辅助设计工具可用于从用户接收电路设计。 该工具可以为给定的设计生成包括混合栅极晶体管的制造掩模,其具有优化的阈值电压以满足电路设计标准。
    • 10. 发明授权
    • Mixed-gate metal-oxide-semiconductor varactors
    • 混合栅极金属氧化物半导体变容二极管
    • US08242581B1
    • 2012-08-14
    • US12324793
    • 2008-11-26
    • Albert RatnakumarWilson WongJun LiuQi XiangJeffrey Xiaoqi Tung
    • Albert RatnakumarWilson WongJun LiuQi XiangJeffrey Xiaoqi Tung
    • H01L29/93
    • H01L29/94H01L29/4983H01L29/93
    • Mixed gate varactors are provided. The mixed gate varactors may include a semiconductor region of a given doping type. A first terminal for the varactor may be formed from a gate structure on the semiconductor region. A second terminal for the varactor may be formed from a heavily doped region in the semiconductor region that has the same doping type as the given doping type. A third terminal for the varactor may be formed from a heavily doped region in the semiconductor region that has a different doping type than the given doping type. The gate structure may include multiple gate conductors on a gate insulator. The gate insulator may be a high-K dielectric. The gate conductors may be metals or other materials that have different work functions. A conductive layer such as a layer of polysilicon may electrically connect the first and second gate conductors.
    • 提供混合栅极变容二极管。 混合栅极变容二极管可以包括给定掺杂型的半导体区域。 用于变容二极管的第一端可以由半导体区域上的栅极结构形成。 用于变容二极管的第二端子可以由具有与给定掺杂类型相同的掺杂类型的半导体区域中的重掺杂区域形成。 用于变容二极管的第三端子可以由具有与给定掺杂类型不同的掺杂类型的半导体区域中的重掺杂区域形成。 栅极结构可以包括栅极绝缘体上的多个栅极导体。 栅极绝缘体可以是高K电介质。 栅极导体可以是具有不同功函数的金属或其它材料。 诸如多晶硅层的导电层可电连接第一和第二栅极导体。