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1. 发明申请

US20090275278A1 ULTRA-PURE AIR SYSTEM FOR NANO WAFER ENVIRONMENT 有权
标题翻译：用于纳米WAVER环境的超纯空气系统
公开(公告)号：US20090275278A1
公开(公告)日：2009-11-05
申请号：US12112385
申请日：2008-04-30
申请人： Tzu-Sou Chuang , James Jeng-Jyi Hwang
发明人： Tzu-Sou Chuang , James Jeng-Jyi Hwang
IPC分类号： B01L1/04 , F24F3/12
CPC分类号： H01L21/67017
摘要： In one embodiment, an air filtration system includes a first ventilation path connected between at least one external air supply and a clean room. The first ventilation path is configured to direct air from the at least one external air supply to the clean room. A second ventilation path is connected to the clean room. The second ventilation path is configured to recirculate air in the clean room. A third ventilation path, separate from the first path, is connected between the at least one external air supply and a tool environment disposed within the clean room. The third ventilation path includes an ultra-pure air filtration unit disposed between the outdoor air supply and the tool environment. The ultra-pure air filtration unit includes a compressor and a dryer.
摘要翻译：在一个实施例中，空气过滤系统包括连接在至少一个外部空气源和洁净室之间的第一通风路径。第一通风路径构造成将空气从至少一个外部空气供应引导到洁净室。第二个通风道连接到洁净室。第二通风路径构造成使洁净室中的空气再循环。与第一路径分离的第三通风路径连接在至少一个外部空气源和设置在洁净室内的工具环境之间。第三通风路径包括设置在室外空气供应和工具环境之间的超纯空气过滤单元。超纯空气过滤装置包括压缩机和烘干机。

2. 发明授权

US09403254B2 Methods for real-time error detection in CMP processing 有权
标题翻译： CMP处理中的实时错误检测方法
公开(公告)号：US09403254B2
公开(公告)日：2016-08-02
申请号：US13211847
申请日：2011-08-17
申请人： James Jeng-Jyi Hwang , Bo-I Lee , Chi-Ming Yang , Chin-Hsiang Lin
发明人： James Jeng-Jyi Hwang , Bo-I Lee , Chi-Ming Yang , Chin-Hsiang Lin
IPC分类号： B24B37/005 , B24B37/04 , B24B37/10 , B24B49/00 , B24B49/10 , B24B49/14
CPC分类号： B24B37/005 , B24B37/042 , B24B37/107 , B24B49/003 , B24B49/10 , B24B49/14
摘要： Methods and apparatus for detecting errors in real time in CMP processing. A method includes disposing a semiconductor wafer onto a wafer carrier in a tool for chemical mechanical polishing (“CMP”); positioning the wafer carrier so that a surface of the semiconductor wafer contacts a polishing pad mounted on a rotating platen; dispensing an abrasive slurry onto the rotating polishing pad while maintaining the surface of the semiconductor wafer in contact with the polishing pad to perform a CMP process on the semiconductor wafer; in real time, receiving signals from the CMP tool into a signal analyzer, the signals corresponding to vibration, acoustics, temperature, or pressure; and comparing the received signals from the CMP tool to expected received signals for normal processing by the CMP tool; outputting a result of the comparing. A CMP tool apparatus is disclosed.
摘要翻译：用于在CMP处理中实时检测误差的方法和装置。一种方法包括将半导体晶片设置在用于化学机械抛光（“CMP”）的工具中的晶片载体上; 定位晶片载体，使得半导体晶片的表面接触安装在旋转台板上的抛光垫; 将研磨浆料分配到旋转的抛光垫上，同时保持半导体晶片的表面与抛光垫接触，以在半导体晶片上执行CMP处理; 实时地从CMP工具接收信号到信号分析仪，信号对应于振动，声学，温度或压力; 以及将来自CMP工具的接收信号与由CMP工具进行正常处理的预期接收信号进行比较; 输出比较结果。公开了一种CMP工具装置。

3. 发明申请

US20140095083A1 Method Of Identifying Airborne Molecular Contamination Source 有权
标题翻译：识别机载分子污染源的方法
公开(公告)号：US20140095083A1
公开(公告)日：2014-04-03
申请号：US13632530
申请日：2012-10-01
申请人： Tzu-Sou Chuang , Jeng-Jyi Hwang , Cheng-Lung Chou , Chi-Ming Yang , Chin-Hsiang Lin
发明人： Tzu-Sou Chuang , Jeng-Jyi Hwang , Cheng-Lung Chou , Chi-Ming Yang , Chin-Hsiang Lin
IPC分类号： G01N33/00 , G06F15/00
CPC分类号： G01N33/0004 , G06F15/00
摘要： The present disclosure provides a method of identifying an airborne molecular contamination (AMC) leaking source in a fab. The method includes distributing a sensor in the fab, executing a forward computational fluid dynamics (CFD) simulation of an air flow in the fab, setting an inversed modeling of the forward CFD simulation of the air flow in the fab, building up a database of a spatial response probability distribution matrix of the sensor using an AMC measurement data in the fab, and identifying the AMC leaking source using the database of the spatial response probability distribution matrix of the sensor.
摘要翻译：本公开提供了一种在晶圆厂中识别空气传播分子污染（AMC）泄漏源的方法。该方法包括在晶圆厂中分布传感器，对晶圆厂中的空气流进行前向计算流体动力学（CFD）仿真，设置晶圆厂中空气流的前向CFD模拟的反向建模，建立数据库使用工厂中的AMC测量数据的传感器的空间响应概率分布矩阵，以及使用传感器的空间响应概率分布矩阵的数据库来识别AMC泄漏源。

4. 发明授权

US09691641B2 Apparatus and method of cleaning wafers 有权
公开(公告)号：US09691641B2
公开(公告)日：2017-06-27
申请号：US13713007
申请日：2012-12-13
申请人： Chia-Hung Huang , Jeng-Jyi Hwang , Chi-Ming Yang
发明人： Chia-Hung Huang , Jeng-Jyi Hwang , Chi-Ming Yang
IPC分类号： B08B3/04 , H01L21/67 , C11D11/00 , H01L21/687
CPC分类号： H01L21/67051 , B08B3/04 , C11D11/0047 , H01L21/68764 , H01L21/68771
摘要： An apparatus for cleaning wafers includes a chamber, a rotatable substrate holder inside the chamber, a nozzle above the rotatable substrate holder, a cover facing downward and fluidly coupled with the nozzle. The rotatable substrate holder is configured to mount one or more semiconductor wafers on the rotatable substrate holder. The nozzle is configured to spray a cleaning medium onto the one or more semiconductor wafers. The cover is of a shape having a top edge with a top cross-sectional area and a bottom edge with a bottom cross-sectional area.

5. 发明申请

US20140166055A1 APPARATUS AND METHOD OF CLEANING WAFERS 有权
标题翻译：装置和清洗方法
公开(公告)号：US20140166055A1
公开(公告)日：2014-06-19
申请号：US13713007
申请日：2012-12-13
申请人： Chia-Hung HUANG , Jeng-Jyi HWANG , Chi-Ming YANG
发明人： Chia-Hung HUANG , Jeng-Jyi HWANG , Chi-Ming YANG
IPC分类号： B08B3/04
CPC分类号： H01L21/67051 , B08B3/04 , C11D11/0047 , H01L21/68764 , H01L21/68771
摘要： An apparatus for cleaning wafers includes a chamber, a rotatable substrate holder inside the chamber, a nozzle above the rotatable substrate holder, a cover facing downward and fluidly coupled with the nozzle. The rotatable substrate holder is configured to mount one or more semiconductor wafers on the rotatable substrate holder. The nozzle is configured to spray a cleaning medium onto the one or more semiconductor wafers. The cover is of a shape having a top edge with a top cross-sectional area and a bottom edge with a bottom cross-sectional area.
摘要翻译：一种用于清洁晶片的装置，包括一个室，一个可旋转的基板保持器，位于该室内，一个在可转动的基板保持架上方的喷嘴，一个面向下并与该喷嘴流体连接的盖。可旋转衬底保持器被配置为将一个或多个半导体晶片安装在可旋转衬底保持器上。喷嘴构造成将清洁介质喷射到一个或多个半导体晶片上。该盖是具有顶部横截面积的顶部边缘和具有底部横截面积的底部边缘的形状。

6. 发明授权

US08394156B2 Ultra-pure air system for nano wafer environment 有权
标题翻译：用于纳米晶圆环境的超纯空气系统
公开(公告)号：US08394156B2
公开(公告)日：2013-03-12
申请号：US12112385
申请日：2008-04-30
申请人： Tzu-Sou Chuang , James Jeng-Jyi Hwang
发明人： Tzu-Sou Chuang , James Jeng-Jyi Hwang
IPC分类号： B01D46/00
CPC分类号： H01L21/67017
摘要： In one embodiment, an air filtration system includes a first ventilation path connected between at least one external air supply and a clean room. The first ventilation path is configured to direct air from the at least one external air supply to the clean room. A second ventilation path is connected to the clean room. The second ventilation path is configured to recirculate air in the clean room. A third ventilation path, separate from the first path, is connected between the at least one external air supply and a tool environment disposed within the clean room. The third ventilation path includes an ultra-pure air filtration unit disposed between the outdoor air supply and the tool environment. The ultra-pure air filtration unit includes a compressor and a dryer.
摘要翻译：在一个实施例中，空气过滤系统包括连接在至少一个外部空气供应和洁净室之间的第一通风路径。第一通风路径构造成将空气从至少一个外部空气供应引导到洁净室。第二个通风道连接到洁净室。第二通风路径构造成使洁净室中的空气再循环。与第一路径分离的第三通风路径连接在至少一个外部空气源和设置在洁净室内的工具环境之间。第三通风路径包括设置在室外空气供应和工具环境之间的超纯空气过滤单元。超纯空气过滤装置包括压缩机和烘干机。

7. 发明申请

US20130044004A1 Apparatus and Methods for Real-Time Error Detection in CMP Processing 有权
标题翻译： CMP处理中的实时误差检测装置与方法
公开(公告)号：US20130044004A1
公开(公告)日：2013-02-21
申请号：US13211847
申请日：2011-08-17
申请人： James Jeng-Jyi Hwang , Bo-I Lee , Chi-Ming Yang , Chin-Hsiang Lin
发明人： James Jeng-Jyi Hwang , Bo-I Lee , Chi-Ming Yang , Chin-Hsiang Lin
IPC分类号： G08B21/00 , H01L21/66 , B24B51/00
CPC分类号： B24B37/005 , B24B37/042 , B24B37/107 , B24B49/003 , B24B49/10 , B24B49/14
摘要： Methods and apparatus for detecting errors in real time in CMP processing. A method includes disposing a semiconductor wafer onto a wafer carrier in a tool for chemical mechanical polishing (“CMP”); positioning the wafer carrier so that a surface of the semiconductor wafer contacts a polishing pad mounted on a rotating platen; dispensing an abrasive slurry onto the rotating polishing pad while maintaining the surface of the semiconductor wafer in contact with the polishing pad to perform a CMP process on the semiconductor wafer; in real time, receiving signals from the CMP tool into a signal analyzer, the signals corresponding to vibration, acoustics, temperature, or pressure; and comparing the received signals from the CMP tool to expected received signals for normal processing by the CMP tool; outputting a result of the comparing. A CMP tool apparatus is disclosed.
摘要翻译：用于在CMP处理中实时检测误差的方法和装置。一种方法包括将半导体晶片设置在用于化学机械抛光（CMP）的工具中的晶片载体上; 定位晶片载体，使得半导体晶片的表面接触安装在旋转台板上的抛光垫; 将研磨浆料分配到旋转的抛光垫上，同时保持半导体晶片的表面与抛光垫接触，以在半导体晶片上执行CMP处理; 实时地从CMP工具接收信号到信号分析仪，信号对应于振动，声学，温度或压力; 以及将来自CMP工具的接收信号与由CMP工具进行正常处理的预期接收信号进行比较; 输出比较结果。公开了一种CMP工具装置。

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