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    • 1. 发明授权
    • Camera module providing reliable long term adherence
    • 相机模块提供可靠的长期坚持
    • US08164676B2
    • 2012-04-24
    • US12406944
    • 2009-03-18
    • Jia-Jun Tian
    • Jia-Jun Tian
    • H04N5/225
    • H04N5/2254H04N5/2257
    • An camera module includes a substrate, an image sensor chip, and a lens module. The image sensor chip is disposed on and electrically connected to the substrate. The lens module is mounted on the base via an adhesive layer. The lens module includes a bottom surface contacting with the substrate. The bottom surface defines at least one sloped surfaces thereon. At least one gap is defined between the substrate and the at least one sloped surface. The adhesive layer is disposed between the bottom surface and the substrate, the gap is capable of accepting adhesive when the lens module and substrate are pressed together.
    • 相机模块包括基板,图像传感器芯片和透镜模块。 图像传感器芯片设置在基板上并电连接到基板。 透镜模块通过粘合剂层安装在基座上。 透镜模块包括与基板接触的底面。 底面在其上限定至少一个倾斜表面。 在衬底和至少一个倾斜表面之间限定至少一个间隙。 粘合剂层设置在底表面和基底之间,当透镜模块和基底压在一起时,间隙能够接受粘合剂。
    • 3. 发明申请
    • CAMERA MODULE
    • 相机模块
    • US20100165183A1
    • 2010-07-01
    • US12406944
    • 2009-03-18
    • Jia-Jun Tian
    • Jia-Jun Tian
    • H04N5/225
    • H04N5/2254H04N5/2257
    • An camera module includes a substrate, an image sensor chip, and a lens module. The image sensor chip is disposed on and electrically connected to the substrate. The lens module is mounted on the base via an adhesive layer. The lens module includes a bottom surface contacting with the substrate. The bottom surface defines at least one sloped surfaces thereon. At least one gap is defined between the substrate and the at least one sloped surface. The adhesive layer is disposed between the bottom surface and the substrate, the gap is capable of accepting adhesive when the lens module and substrate are pressed together.
    • 相机模块包括基板,图像传感器芯片和透镜模块。 图像传感器芯片设置在基板上并电连接到基板。 透镜模块通过粘合剂层安装在基座上。 透镜模块包括与基板接触的底面。 底面在其上限定至少一个倾斜表面。 在衬底和至少一个倾斜表面之间限定至少一个间隙。 粘合剂层设置在底表面和基底之间,当透镜模块和基底压在一起时,间隙能够接受粘合剂。