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1. 发明授权

US06531382B1 Use of a capping layer to reduce particle evolution during sputter pre-clean procedures 有权
标题翻译：在溅射预清洁过程中使用覆盖层来减少颗粒的发生
公开(公告)号：US06531382B1
公开(公告)日：2003-03-11
申请号：US10140662
申请日：2002-05-08
申请人： Tao Cheng , Wen-Hsin Huang , Jiun-Pyng You , Lin-June Wu , Shih-Tzung Chang , Ming-Jei Lee , Chun-Chang Chen , Yu-Ku Lin , Tong-Hua Kuan , Ying-Lang Wang
发明人： Tao Cheng , Wen-Hsin Huang , Jiun-Pyng You , Lin-June Wu , Shih-Tzung Chang , Ming-Jei Lee , Chun-Chang Chen , Yu-Ku Lin , Tong-Hua Kuan , Ying-Lang Wang
IPC分类号： H01L213205
CPC分类号： H01L21/76802 , H01L21/76838
摘要： A process for preparing a surface of a lower level metal structure, exposed at the bottom of a sub-micron diameter opening, to allow a low resistance interface to be obtained when overlaid with an upper level metal structure, has been developed. A disposable, capping insulator layer is first deposited on the composite insulator layer in which the sub-micron diameter opening will be defined in, to protect underlying components of the composite insulator from a subsequent metal pre-metal procedure. After anisotropically defining the sub-micron diameter opening in the capping insulator, and composite insulator layers, and after removal of the defining photoresist shape, an argon sputtering procedure is used to remove native oxide from the surface of the lower level metal structure. In addition to native oxide removal the argon sputtering procedure, featuring a negative DC bias applied to the substrate, also removes the capping insulator layer from the top surface of the composite insulator layer. An in situ metal deposition then allows a clean interface to result between the overlying metal layer, and the underlying plasma treated, metal surface.
摘要翻译：已经开发了制备在亚微米直径开口的底部露出的下层金属结构的表面以允许在与上层金属结构重叠时获得低电阻界面的方法。首先将一次性封盖绝缘体层沉积在复合绝缘体层上，在该复合绝缘层上将限定亚微米直径的开口，以保护复合绝缘子的下面的部件免于后续的金属预金属工艺。在各向异性地限定封盖绝缘体中的亚微米直径开口和复合绝缘体层之后，并且在去除限定的光致抗蚀剂形状之后，使用氩溅射方法从下层金属结构的表面去除自然氧化物。除了自然氧化物除去之外，具有施加到衬底的负DC偏压的氩溅射工艺也从复合绝缘体层的顶表面去除封盖绝缘体层。原位金属沉积然后允许在上覆的金属层和下面的等离子体处理的金属表面之间产生干净的界面。

2. 发明授权

US09847437B1 Method of forming conductive electrode grids over silicon wafer surfaces 有权
公开(公告)号：US09847437B1
公开(公告)日：2017-12-19
申请号：US15465557
申请日：2017-03-21
申请人： Jiun Pyng You
发明人： Jiun Pyng You
IPC分类号： H01L31/0224 , H01L31/18 , H01L31/028
CPC分类号： H01L31/022433 , H01L31/028 , H01L31/1804
摘要： Conductive thick-film paste is useful in forming front-side contact of a solar cell or other semiconductor devices. Unlike conventional conductive frit pastes, a conductive paste according to the present invention does not include frit particles, and contains silver particles, nano-sized inorganic additives and an organic solvent. The conductive paste according to the present invention provides better etching ability through the anti-reflecting coating on the semiconductor substrate than conventional conductive frit pastes.

3. 发明授权

US06734525B2 Low stress integrated circuit fusible link 失效
标题翻译：低应力集成电路熔断连接
公开(公告)号：US06734525B2
公开(公告)日：2004-05-11
申请号：US10144014
申请日：2002-05-13
申请人： Chieh-Chih Chou , Jiun-Pyng You , Yu-Ching Chang
发明人： Chieh-Chih Chou , Jiun-Pyng You , Yu-Ching Chang
IPC分类号： H01L2900
CPC分类号： H01L23/5258 , H01L2924/0002 , H01L2924/00
摘要： A fuse structure and method for fabricating same are disclosed. The fuse structure is designed for opening by conventional laser energy application. The fuse structure is characterized by an absence of high stress areas in the surrounding substrate thereby resulting in higher fabrication yields due to lower occurrence of substrate fracturing or other damage occasioned by the opening of the fuse.
摘要翻译：公开了一种熔丝结构及其制造方法。保险丝结构设计用于通过常规激光能量打开。熔丝结构的特征在于在周围基板中不存在高应力区域，由此导致更高的制造成本，这是由于基板断裂的较少发生或由熔断器的开启引起的其它损坏。

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