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    • 4. 发明授权
    • Cornercube offset tool
    • Cornercube偏移工具
    • US06412683B1
    • 2002-07-02
    • US09912024
    • 2001-07-24
    • David T. BeatsonChristian HoffmanJames E. EderJohn Ditri
    • David T. BeatsonChristian HoffmanJames E. EderJohn Ditri
    • B23K3112
    • B23K31/12B23K20/002B23K20/10B23K2101/40H05K13/08
    • A vision system and method for use with a bonding tool that takes into account variations due to temperature changes and other nonrandom systemic effects. The vision system includes a cornercube offset tool having a plurality of total internal reflection surfaces, the cornercube offset tool located below the vision plane of the optical system; and an optical detector to receive an indirect image of the bonding tool through the cornercube offset tool. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the bonding tool; and receiving an indirect image of the bonding tool through the cornercube offset tool.
    • 一种与粘合工具一起使用的视觉系统和方法,其考虑到由于温度变化和其他非随机系统效应引起的变化。 所述视觉系统包括具有多个全内反射面的角架偏移工具,所述角架偏移工具位于所述光学系统的视平面的下方; 以及光学检测器,用于通过角架偏移工具接收粘合工具的间接图像。 该方法包括以下步骤:提供一种具有在接合工具的视平面下方的多个全内反射表面的角架偏移工具; 以及通过角架偏移工具接收粘合工具的间接图像。
    • 9. 发明授权
    • Fluid actuated cooling card retainer
    • 流体驱动冷却卡保持器
    • US08780556B1
    • 2014-07-15
    • US13429658
    • 2012-03-26
    • John Ditri
    • John Ditri
    • H05K7/20
    • H05K7/1404
    • A retaining device for a printed circuit board includes an expandable bladder. The bladder is responsive to a source of pressurized fluid for selectively clamping a printed circuit board within a slot of an associated cooling and/or storage chassis. A method for retaining a circuit card within a chassis includes pressurizing a volume of fluid, and filling an expandable bladder with the pressurized fluid; wherein filling of the bladder causes its expansion and clamps a circuit card within the chassis.
    • 用于印刷电路板的保持装置包括可膨胀囊。 气囊响应于加压流体源,用于选择性地将印刷电路板夹在相关联的冷却和/或存储底盘的狭槽内。 用于将电路卡保持在底盘内的方法包括加压一定体积的流体,并用加压流体填充可膨胀囊; 其中,气囊的填充导致其膨胀并且夹紧底盘内的电路卡。