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1. 发明授权

US09112121B2 Light emitting device having wavelength converting layer 有权
标题翻译：具有波长转换层的发光器件
公开(公告)号：US09112121B2
公开(公告)日：2015-08-18
申请号：US13984154
申请日：2012-01-31
申请人： Jung Hwa Jung , Jung Doo Kim , Seoung Ho Jung , Min Hye Kim , Yoo Jin Kim
发明人： Jung Hwa Jung , Jung Doo Kim , Seoung Ho Jung , Min Hye Kim , Yoo Jin Kim
IPC分类号： H01L29/06 , H01L31/00 , H01L33/50 , H01L25/075 , H01L33/62
CPC分类号： H01L33/50 , H01L25/0753 , H01L33/46 , H01L33/486 , H01L33/505 , H01L33/508 , H01L33/62 , H01L2224/48091 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： Disclosed is a light emitting device having a wavelength converting layer. The light emitting device comprises a plurality of semiconductor stacked structures; connectors for electrically connecting the plurality of semiconductor stacked structures to one another; a single wavelength converting layer for covering the plurality of semiconductor stacked structures; an electrode electrically connected to at least one of the semiconductor stacked structures; and at least one additional electrode positioned on the electrode, passing through the wavelength converting layer to be exposed to the outside, and forming a current input terminal to the light emitting device or a current output terminal from the light emitting device. Since the single wavelength converting layer covers the plurality of semiconductor stacked structures, the plurality of semiconductor stacked structures can be integrally mounted on a chip mounting member such as a package or a module.
摘要翻译：公开了具有波长转换层的发光器件。发光器件包括多个半导体堆叠结构; 用于将多个半导体堆叠结构彼此电连接的连接器; 用于覆盖多个半导体堆叠结构的单个波长转换层; 电连接到所述半导体堆叠结构中的至少一个的电极; 以及位于电极上的至少一个附加电极，穿过波长转换层以暴露于外部，并且从发光器件形成到发光器件或电流输出端子的电流输入端子。由于单个波长转换层覆盖多个半导体堆叠结构，所以多个半导体堆叠结构可以一体地安装在诸如封装或模块的芯片安装构件上。

2. 发明申请

US20120273813A1 LIGHT EMITTING DIODE PACKAGE AND METHOD FOR FABRICATING THE SAME 审中-公开
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US20120273813A1
公开(公告)日：2012-11-01
申请号：US13518209
申请日：2010-12-10
申请人： Jung Hwa Jung
发明人： Jung Hwa Jung
IPC分类号： H01L33/44 , H01L33/08
CPC分类号： H01L33/505 , H01L25/0753 , H01L33/52 , H01L33/54 , H01L2224/48091 , H01L2933/0041 , H01L2933/005 , H01L2924/00014
摘要： The present disclosure provides an LED package and a method for fabricating the same. The LED package includes a base, at least one LED chip mounted on the base, a transparent wall disposed on the base and extending around the LED chip, and a fluorescent material disposed inside of the transparent wall and covering upper and side surfaces of the LED chip.
摘要翻译：本公开提供了一种LED封装及其制造方法。 LED封装包括基座，安装在基座上的至少一个LED芯片，设置在基座上并围绕LED芯片延伸的透明壁，以及设置在透明壁内部并覆盖LED的上表面和侧表面的荧光材料芯片。

3. 发明申请

US20120193670A1 LIGHT EMITTING DEVICE HAVING WAVELENGTH CONVERTING LAYER AND METHOD OF FABRICATING THE SAME 有权
标题翻译：具有波长转换层的发光装置及其制造方法
公开(公告)号：US20120193670A1
公开(公告)日：2012-08-02
申请号：US13362107
申请日：2012-01-31
申请人： Jung Hun SON , Seok Soon KWON , Jung Doo KIM , Seoung Ho JUNG , Jung Hwa JUNG
发明人： Jung Hun SON , Seok Soon KWON , Jung Doo KIM , Seoung Ho JUNG , Jung Hwa JUNG
IPC分类号： H01L33/50 , H01L33/00
CPC分类号： H01L33/504 , H01L21/568 , H01L33/508 , H01L33/62 , H01L2224/04105 , H01L2224/19 , H01L2224/73267 , H01L2224/92244
摘要： A light emitting device having a wavelength converting layer. The light emitting device includes a substrate; a semiconductor stack having a first conductive-type semiconductor layer, an active layer and a second conductive-type semiconductor layer disposed on the substrate; a first wavelength converting layer covering a top of the semiconductor stack; and a second wavelength converting layer disposed on the first wavelength converting layer and having a width narrower than the first wavelength converting layer. The second wavelength converting layer is employed, thereby being capable of reducing a color variation according to a viewing angle.
摘要翻译：一种具有波长转换层的发光器件。发光装置包括：基板; 具有设置在所述基板上的第一导电型半导体层，有源层和第二导电型半导体层的半导体堆叠; 覆盖半导体堆叠的顶部的第一波长转换层; 以及第二波长转换层，其设置在所述第一波长转换层上，并且具有比所述第一波长转换层窄的宽度。采用第二波长转换层，从而能够根据视角减小颜色变化。

4. 发明申请

US20120007502A1 WHITE LIGHT EMITTING DIODE PACKAGE FOR INCANDESCENT COLOR 有权
标题翻译：白炽灯发光二极管封装
公开(公告)号：US20120007502A1
公开(公告)日：2012-01-12
申请号：US13240558
申请日：2011-09-22
申请人： Jung Hwa JUNG , In Kyu PARK , Byoung Hoon CHOI
发明人： Jung Hwa JUNG , In Kyu PARK , Byoung Hoon CHOI
IPC分类号： H01J1/63
CPC分类号： H01L25/0753 , H01L33/50 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a white light emitting diode (LED) package that includes a blue LED chip to emit blue light; a yellow phosphor excited by the blue light and emit yellow light, the yellow light to produce a primary white light in combination with the blue light; a red LED chip to emit red light, the red light to adjust the primary white light into secondary white light of an incandescent color; and a package member comprising at least a partial transmissive part covering the blue LED chip, the red LED chip, and the yellow phosphor. The primary white light falls in a region of (0.413, 0.502), (0.335, 0.376), (0.37, 0.371), and (0.439, 0.48) based on a CIE color coordinate standard.
摘要翻译：本发明涉及一种白光发光二极管（LED）封装，其包括发射蓝光的蓝色LED芯片; 由蓝光激发的黄色荧光体发出黄色的光，黄色的光线与蓝色的光线结合产生原色的白光; 一个红色的LED芯片发出红光，红色的光线将原来的白光调节成二次白光的白炽色; 以及包括至少覆盖蓝色LED芯片，红色LED芯片和黄色荧光体的部分透射部分的封装构件。基于CIE颜色坐标标准，初级白光落在（0.413,0.502），（0.335,0.376），（0.37,0.371）和（0.439,0.48）的区域中。

5. 发明授权

US07842219B2 Mold for forming a molding member and method of fabricating a molding member using the same 有权
标题翻译：用于形成模制构件的模具和使用其形成模制构件的方法
公开(公告)号：US07842219B2
公开(公告)日：2010-11-30
申请号：US11995196
申请日：2006-06-26
申请人： Jung Hwa Jung , Chung Hoon Lee
发明人： Jung Hwa Jung , Chung Hoon Lee
IPC分类号： B29C45/14 , B29C45/26 , H01L21/56
CPC分类号： H01L21/565 , B29C33/10 , B29C39/006 , B29C39/10 , B29C39/26 , B29C45/14655 , B29C45/34 , B29L2011/00 , H01L23/49861 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2924/00014
摘要： There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral surface and a concave surface surrounded by the outer circumference. Injection and discharge holes extend from the upper surface to the lower surface. Accordingly, after the mold and the package are coupled so that the discharge hole is directed upward, a molding member can be formed on the package by injecting the molding material through the injection hole, whereby it is possible to prevent air bubbles from being captured in the molding member.
摘要翻译：提供了用于形成模制构件的模具和使用其形成模制构件的方法。模具包括上表面和具有外周表面和由外周围包围的凹面的下表面。注射和排出孔从上表面延伸到下表面。因此，在模具和包装件联接成使得排出孔向上指向之后，可以通过从注射孔注入成型材料而在包装上形成成型构件，由此可以防止气泡被捕获模制构件。

6. 发明申请

US20100025700A1 WARM WHITE LIGHT EMITTING APPARATUS AND BACK LIGHT MODULE COMPRISING THE SAME 有权
标题翻译：暖白光发光装置和背光灯组件
公开(公告)号：US20100025700A1
公开(公告)日：2010-02-04
申请号：US12324091
申请日：2008-11-26
申请人： Jung Hwa JUNG , Sang Min Lee
发明人： Jung Hwa JUNG , Sang Min Lee
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , F21K9/62 , F21K9/64 , F21V7/22 , F21V23/009 , F21Y2113/13 , F21Y2115/10 , H01L33/504 , H01L33/507 , H01L2224/48091 , H01L2224/48137 , H01L2224/49107 , H01L2924/00014
摘要： A warm white light emitting apparatus includes a first light emitting diode (LED)-phosphor combination to generatea base light that is white or yellowish white and a second LED-phosphor combination to generate a Color Rendering Index (CRI) adjusting light. The base light the CRI adjusting light together make a warm white light having a color temperature of 2500 to 4500K.
摘要翻译：暖白色发光装置包括第一发光二极管（LED） - 荧光体组合，以产生白色或黄白色的基础光，以及第二LED-荧光体组合以产生调整光的显色指数（CRI）。基础灯CRI调整光一起制成温暖的白色光，色温为2500〜4500K。

7. 发明申请

US20080268559A1 Mold for Forming a Molding Member and Method of Fabricating a Molding Member Using the Same 有权
标题翻译：用于形成成型构件的模具和使用其的成型构件的制造方法
公开(公告)号：US20080268559A1
公开(公告)日：2008-10-30
申请号：US11995196
申请日：2006-06-26
申请人： Jung Hwa Jung
发明人： Jung Hwa Jung
IPC分类号： H01L33/00 , B29C45/34
CPC分类号： H01L21/565 , B29C33/10 , B29C39/006 , B29C39/10 , B29C39/26 , B29C45/14655 , B29C45/34 , B29L2011/00 , H01L23/49861 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2924/00014
摘要： There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral surface and a concave surface surrounded by the outer circumference. Injection and discharge holes extend from the upper surface to the lower surface. Accordingly, after the mold and the package are coupled so that the discharge hole is directed upward, a molding member can be formed on the package by injecting the molding material through the injection hole, whereby it is possible to prevent air bubbles from being captured in the molding member.
摘要翻译：提供了用于形成模制构件的模具和使用其形成模制构件的方法。模具包括上表面和具有外周表面和由外周围包围的凹面的下表面。注射和排出孔从上表面延伸到下表面。因此，在模具和包装件联接成使得排出孔向上指向之后，可以通过从注射孔注入成型材料而在包装上形成成型构件，由此可以防止气泡被捕获模制构件。

8. 外观设计

USD534504S1 Light emitting diode (LED) 有权
公开(公告)号：USD534504S1
公开(公告)日：2007-01-02
申请号：US29236915
申请日：2005-08-23
申请人： Do Hyung Kim , Jung Hoo Seo , Jung Hwa Jung
设计人： Do Hyung Kim , Jung Hoo Seo , Jung Hwa Jung

9. 发明授权

US09059381B2 Light emitting device having wavelength converting layer and method of fabricating the same 有权
标题翻译：具有波长转换层的发光器件及其制造方法
公开(公告)号：US09059381B2
公开(公告)日：2015-06-16
申请号：US13362107
申请日：2012-01-31
申请人： Jung Hun Son , Seok Soon Kwon , Jung Doo Kim , Seoung Ho Jung , Jung Hwa Jung
发明人： Jung Hun Son , Seok Soon Kwon , Jung Doo Kim , Seoung Ho Jung , Jung Hwa Jung
IPC分类号： H01L33/00 , H01L21/00 , H01L33/50 , H01L33/62
CPC分类号： H01L33/504 , H01L21/568 , H01L33/508 , H01L33/62 , H01L2224/04105 , H01L2224/19 , H01L2224/73267 , H01L2224/92244
摘要： A light emitting device having a wavelength converting layer. The light emitting device includes a substrate; a semiconductor stack having a first conductive-type semiconductor layer, an active layer and a second conductive-type semiconductor layer disposed on the substrate; a first wavelength converting layer covering a top of the semiconductor stack; and a second wavelength converting layer disposed on the first wavelength converting layer and having a width narrower than the first wavelength converting layer. The second wavelength converting layer is employed, thereby being capable of reducing a color variation according to a viewing angle.
摘要翻译：一种具有波长转换层的发光器件。发光装置包括：基板; 具有设置在所述基板上的第一导电型半导体层，有源层和第二导电型半导体层的半导体堆叠; 覆盖半导体堆叠的顶部的第一波长转换层; 以及第二波长转换层，其设置在所述第一波长转换层上，并且具有比所述第一波长转换层窄的宽度。采用第二波长转换层，从而能够根据视角减小颜色变化。

10. 发明授权

US08044587B2 White light emitting diode package for incandescent color 有权
标题翻译：白色发光二极管封装用于白炽灯色
公开(公告)号：US08044587B2
公开(公告)日：2011-10-25
申请号：US12415360
申请日：2009-03-31
申请人： Jung Hwa Jung , In Kyu Park , Byoung Hoon Choi
发明人： Jung Hwa Jung , In Kyu Park , Byoung Hoon Choi
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： H01L25/0753 , H01L33/50 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a white light emitting diode (LED) package that includes a blue LED chip to emit blue light; a yellow phosphor excited by the blue light and emit yellow light, the yellow light to produce a primary white light in combination with the blue light; a red LED chip to emit red light, the red light to adjust the primary white light into secondary white light of an incandescent color; and a package member comprising at least a partial transmissive part covering the blue LED chip, the red LED chip, and the yellow phosphor. The primary white light falls in a region of (0.413, 0.502), (0.335, 0.376), (0.37, 0.371), and (0.439, 0.48) based on a CIE color coordinate standard.
摘要翻译：本发明涉及一种白光发光二极管（LED）封装，其包括发射蓝光的蓝色LED芯片; 由蓝光激发的黄色荧光体发出黄色的光，黄色的光线与蓝色的光线结合产生原色的白光; 一个红色的LED芯片发出红光，红色的光线将原来的白光调节成二次白光的白炽色; 以及包括至少覆盖蓝色LED芯片，红色LED芯片和黄色荧光体的部分透射部分的封装构件。基于CIE颜色坐标标准，初级白光落在（0.413,0.502），（0.335,0.376），（0.37,0.371）和（0.439,0.48）的区域中。

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