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1. 发明授权

US10431488B2 Lift pin and method for manufacturing same 有权
公开(公告)号：US10431488B2
公开(公告)日：2019-10-01
申请号：US15556167
申请日：2016-01-22
申请人： KOMICO CO., LTD.
发明人： Sung Hee Yoon , Kwon Ho Jung
IPC分类号： C30B25/12 , H01L21/687 , C23C16/24 , C23C16/458 , C23C16/46 , C30B29/06 , H01L21/205
摘要： A lift pin passes through a hole of a susceptor on which a wafer is placed inside a process chamber in which an epitaxial process is performed with respect to the wafer, to support the wafer, and has a surface formed of a glassy carbon material.

2. 发明授权

US09963772B2 Interior material for thin film deposition device and method for manufacturing same 有权
公开(公告)号：US09963772B2
公开(公告)日：2018-05-08
申请号：US15317238
申请日：2015-06-04
申请人： KOMICO CO., LTD.
发明人： Sung Soo Jang , Hyun Chul Ko , Kyung Ic Jang , Sung Jin Choi
IPC分类号： C23C4/08 , C23C14/56 , C23C4/129 , C23C4/134 , H01L21/285 , H01L21/3205 , H01L21/768
CPC分类号： C23C4/08 , C23C4/129 , C23C4/134 , C23C14/564 , H01L21/28506 , H01L21/32051 , H01L21/76838
摘要： An internal member for an apparatus of depositing a conductive thin film includes a chamber structure including a object supporting unit supporting an object on which the conductive thin film is to be deposited, and a target supporting unit supporting a target for depositing the conductive thin film on the object, wherein the target including a first metal material the chamber structure having a reaction space therein and a coating structure formed on an inner surface of the chamber structure, the inner surface being indirectly exposed to the reaction space of the chamber structure via the coating structure, and the coating structure including a second metal material having at least one metal element in the first metal material.

3. 发明申请

US20030129772A1 Method of fabricating and repairing ceramic components for semiconductor fabrication using plasma spray process 有权
标题翻译：使用等离子喷涂工艺制造和修复用于半导体制造的陶瓷部件的方法
公开(公告)号：US20030129772A1
公开(公告)日：2003-07-10
申请号：US10309325
申请日：2002-12-04
申请人： KOMICO Co., Ltd
发明人： Jin-Sik Choi
IPC分类号： H01L021/00
CPC分类号： H01L21/481 , Y10S438/974
摘要： Provided is a method of fabricating and repairing ceramic components for semiconductor fabrication, through which erosion and polymer deposition occurring on ceramic components for semiconductor fabrication are decreased by modifying the dielectric surface of a component having an electrical insulation characteristic so that the ceramic components can be repaired after being used. The method includes activating a surface layer of a component, which is manufactured by sintering a ceramic, and depositing a dielectric coating layer on the surface layer of the ceramic component using a plasma spray process; when the dielectric coating layer is damaged as the ceramic component is used for semiconductor fabrication, removing the dielectric coating layer; and repairing the ceramic component by depositing a dielectric coating layer on the surface layer of the ceramic component from which the damaged dielectric coating layer has been removed.
摘要翻译：提供一种制造和修复用于半导体制造的陶瓷部件的方法，通过这种方法通过改变具有电绝缘特性的部件的电介质表面来降低通过其产生用于半导体制造的陶瓷部件上的侵蚀和聚合物沉积，从而可以修复陶瓷部件使用后。该方法包括激活通过烧结陶瓷制造的部件的表面层，以及使用等离子体喷涂工艺在陶瓷部件的表面层上沉积电介质涂层; 当陶瓷部件用于半导体制造时，当电介质涂层被损坏时，去除电介质涂层; 以及通过在去除了损坏的电介质涂层的陶瓷部件的表面层上沉积介电涂层来修复陶瓷部件。

4. 发明授权

US10272467B2 Aerosol coating method and plasma-resistant member formed by the same 有权
公开(公告)号：US10272467B2
公开(公告)日：2019-04-30
申请号：US14910289
申请日：2013-08-28
申请人： Komico Co., Ltd.
发明人： Sung Hwan Yi , Jae Hyun Jung , Kyeong Ik Jang , Kyoung Hwan Ye
IPC分类号： B05D1/12 , C23C24/04 , B05D1/02 , C04B35/622 , C04B35/505
摘要： According to an aerosol coating method, a heat treatment process of preliminary ceramic particles having a first mean particle size (D50) is performed to form ceramic particles having a second mean particle size (D50) in micro unit larger than the first mean particle size. Thereafter, the ceramic particles are mixed with a carrier gas to form an aerosol. The aerosol is sprayed toward the base to form a ceramic coating film on the base.

5. 发明申请

US20180053683A1 LIFT PIN AND METHOD FOR MANUFACTURING SAME 审中-公开
公开(公告)号：US20180053683A1
公开(公告)日：2018-02-22
申请号：US15556167
申请日：2016-01-22
申请人： KOMICO CO., LTD.
发明人： Sung Hee YOON , Kwon Ho JUNG
IPC分类号： H01L21/687 , C23C16/24 , C23C16/458 , C23C16/46 , C30B25/12 , C30B29/06 , H01L21/205
CPC分类号： H01L21/68742 , C23C16/24 , C23C16/4581 , C23C16/4586 , C23C16/46 , C30B25/12 , C30B29/06 , H01L21/205 , H01L21/68757
摘要： A lift pin passes through a hole of a susceptor on which a wafer is placed inside a process chamber in which an epitaxial process is performed with respect to the wafer, to support the wafer, and has a surface formed of a glassy carbon material.

6. 发明申请

US20170137924A1 INTERIOR MATERIAL FOR THIN FILM DEPOSITION DEVICE AND METHOD FOR MANUFACTURING SAME 有权
公开(公告)号：US20170137924A1
公开(公告)日：2017-05-18
申请号：US15317238
申请日：2015-06-04
申请人： KOMICO CO., LTD.
发明人： Sung Soo JANG , Hyun Chul KO , Kyung Ic JANG , Sung Jin CHOI
IPC分类号： C23C4/08 , C23C4/129 , C23C4/134
CPC分类号： C23C4/08 , C23C4/129 , C23C4/134 , C23C14/564 , H01L21/28506 , H01L21/32051 , H01L21/76838
摘要： An internal member for an apparatus of depositing a conductive thin film includes a chamber structure including a object supporting unit supporting an object on which the conductive thin film is to be deposited, and a target supporting unit supporting a target for depositing the conductive thin film on the object, wherein the target including a first metal material the chamber structure having a reaction space therein and a coating structure formed on an inner surface of the chamber structure, the inner surface being indirectly exposed to the reaction space of the chamber structure via the coating structure, and the coating structure including a second metal material having at least one metal element in the first metal material.

7. 发明申请

US20160176763A1 AEROSOL COATING METHOD AND PLASMA-RESISTANT MEMBER FORMED BY THE SAME 审中-公开
标题翻译：气溶胶涂层方法及其抗塑性构件
公开(公告)号：US20160176763A1
公开(公告)日：2016-06-23
申请号：US14910289
申请日：2013-08-28
申请人： KOMICO CO., LTD.
发明人： Sung Hwan Yi , Jae Hyun Jung , Kyeong Ik Jang , Kyoung Hwan Ye
IPC分类号： C04B35/622 , B05D1/02
CPC分类号： B05D1/12 , B05D1/02 , C04B35/505 , C04B35/62222 , C23C24/04
摘要： According to an aerosol coating method, a heat treatment process of preliminary ceramic particles having a first mean particle size (D50) is performed to form ceramic particles having a second mean particle size (D50) in micro unit larger than the first mean particle size. Thereafter, the ceramic particles are mixed with a carrier gas to form an aerosol. The aerosol is sprayed toward the base to form a ceramic coating film on the base.
摘要翻译：根据气溶胶涂布法，进行具有第一平均粒径（D50）的预备陶瓷粒子的热处理工序，以形成具有大于第一平均粒径的微单位的第二平均粒径（D50）的陶瓷粒子。此后，将陶瓷颗粒与载气混合以形成气溶胶。将气溶胶喷射到基底上以在基底上形成陶瓷涂膜。

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