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    • 7. 发明申请
    • Solderable pads utilizing nickel and silver nanoparticle ink jet inks
    • 使用镍和银纳米颗粒喷墨油墨的可焊垫
    • US20070281099A1
    • 2007-12-06
    • US11443265
    • 2006-05-31
    • James J. HowarthAnthony R. JamesKarel Vanheusden
    • James J. HowarthAnthony R. JamesKarel Vanheusden
    • B05D1/12B05D3/02B05D7/00B05C5/00B41J2/01
    • H05K3/247H05K1/095H05K3/125H05K2201/0257H05K2201/035H05K2203/013H05K2203/1476
    • A system and a method are provided for ink-jet printing a solderable conductive pad onto a substrate. The system comprises at least one print head and a curing station for curing an ink deposited onto the substrate. The system is configured to: deposit at least a first layer of a first ink onto the substrate; cure the first layer of the first ink; deposit at least an intermediate layer of a second ink on top of the cured first layer of the first ink; cure the intermediate layer of the second ink; deposit at least a last layer of the first ink on top of the cured intermediate layer of the second ink; and cure the last layer of the first ink. The first ink has a relatively high conductivity. The second ink has a relatively low conductivity. The first layer, the intermediate layer, and the last layer may be arranged such that when solder is applied to the last layer, the solder is prevented from leaching through to the first layer.
    • 提供了一种系统和方法,用于将可焊接导电垫喷墨印刷到基底上。 该系统包括至少一个打印头和固化站,用于固化沉积到基底上的油墨。 该系统被配置为:将至少第一层第一油墨沉积到基底上; 固化第一层油墨的第一层; 在第一墨水的固化的第一层的顶部上沉积至少第二墨水的中间层; 固化第二墨水的中间层; 在第二墨水的固化中间层的顶部上沉积至少最后一层第一墨; 并固化第一个墨水的最后一层。 第一种墨水具有较高的导电性。 第二墨水具有较低的导电性。 可以将第一层,中间层和最后一层布置成使得当将焊料施加到最后一层时,防止焊料浸入第一层。