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    • 2. 发明授权
    • Thermal oxide film formation method for silicon single crystal wafer
    • 硅单晶晶片的热氧化膜形成方法
    • US09171737B2
    • 2015-10-27
    • US13824028
    • 2011-10-06
    • Hiroyuki TakahashiKazuhiko Yoshida
    • Hiroyuki TakahashiKazuhiko Yoshida
    • H01L21/316H01L21/02
    • H01L21/31662H01L21/02238H01L21/02255
    • Disclosed is a method of forming a thermal oxide film on a silicon single crystal wafer, which includes throwing the silicon single wafer into a heat treatment furnace; elevating temperature of the heat treatment furnace up to a temperature T1 where a thermal oxide film is formed to form a thermal oxide film having a thickness d1; subsequently lowering the temperature of the heat treatment furnace down to a temperature lower than the temperature T1; and thereafter elevating the temperature of the heat treatment furnace up to a temperature T2 higher than the temperature T1 to additionally form a thermal oxide film having a thickness d2 thicker than the thickness d1. Thus, there is provided a thermal oxide film formation method to suppress occurrence of slip dislocation and/or crack of the silicon single wafer during formation of the thermal oxide film.
    • 公开了在硅单晶晶片上形成热氧化膜的方法,其包括将硅单晶片投掷到热处理炉中; 将热处理炉的升温至达到形成热氧化膜的温度T1,形成厚度为d1的热氧化膜; 随后将热处理炉的温度降低到低于温度T1的温度; 然后将热处理炉的温度升高到高于温度T1的温度T2,以另外形成厚度d2厚于厚度d1的热氧化膜。 因此,提供了一种热氧化膜形成方法,以在形成热氧化膜期间抑制硅单晶片的滑移位错和/或裂纹的发生。
    • 6. 发明申请
    • FIXED UNIFORM-MOTION UNIVERSAL JOINT
    • 固定均匀运动通用接头
    • US20110065519A1
    • 2011-03-17
    • US12991480
    • 2009-05-28
    • Keisuke SoneHirokazu OobaKazuhiko YoshidaKiyohiro Itou
    • Keisuke SoneHirokazu OobaKazuhiko YoshidaKiyohiro Itou
    • F16D3/223
    • F16D3/2245F16D3/2237F16D2003/22309
    • Provided is a fixed type constant velocity universal joint of an eight-ball undercut-free type, which is capable of achieving an improvement of torque capacity at a high operating angle while ensuring durability at the time of a low operating angle. In the fixed type constant velocity universal joint of the eight-ball undercut-free type, a center of a track groove (32) of an outer joint member and a center of a track groove (35) of an inner joint member are separated from a joint center plane (P) respectively to both sides in an axial direction, and are offset to be positioned away from a joint center axis (X) to a radially opposite side relative to the track grooves (35). When Rt represents a distance between a center of a ball (37) and the center of the track groove (32) of the outer joint member, and F represents an axial distance between the joint center plane (P) and the center of the track groove (32) of the outer joint member, a ratio R1 between F and Rt is set to satisfy 0.061≦R1≦0.087, and, when fr represents a radial offset amount as a distance between the joint center axis (X) and the center of the track groove (32) of the outer joint member, a ratio R3 between fr and Rt is set to satisfy 0.07≦R3≦0.19.
    • 本发明提供一种八球无切削型的固定式等速万向接头,其能够在确保低操作角度下的耐久性的同时,在高操作角度下实现扭矩容量的提高。 在八球无切削型的固定式等速万向接头中,外接头构件的轨道槽(32)的中心和内接头构件的轨道槽(35)的中心与 相对于轨道槽(35)分别向联轴器中心轴线(X)延伸到径向相对的一侧。 当Rt表示球(37)的中心与外侧接头构件的轨道槽(32)的中心之间的距离,F表示接头中心面(P)与轨道的中心之间的轴向距离 外侧接头构件的槽(32),将F和Rt之间的比率R1设定为满足0.061≤n1E; R1≦̸ 0.087,并且当fr表示作为接头中心轴线(X)和 外侧接头构件的轨道槽(32)的中心,fr和Rt之间的比率R3设定为满足0.07≦̸ R3≦̸ 0.19。
    • 7. 发明授权
    • Epoxy resin composition
    • 环氧树脂组合物
    • US07727426B2
    • 2010-06-01
    • US11991299
    • 2006-08-23
    • Kazumasa KobayashiChiaki AsanoHiroshi SatoYasuyuki TakedaKazuhiko Yoshida
    • Kazumasa KobayashiChiaki AsanoHiroshi SatoYasuyuki TakedaKazuhiko Yoshida
    • F21V9/00H01L27/15C08F20/00
    • C08G59/4215
    • Disclosed is an epoxy resin composition which is solid at ordinary room temperature, cures with excellent light resistance and heat resistance and minimal shrinkage, and is useful for encapsulating LEDs. The epoxy resin composition is characterized by comprising as an essential component an epoxy resin having an epoxy equivalent of 300-1000 g/eq and a softening point of 65-110° C. obtained by reacting a nonaromatic polycarboxylic acid (A) having an acid value of 100-250 mgKOH/g with a nonaromatic epoxy resin (B) having an epoxy equivalent of 100-400 g/eq. The nonaromatic polycarboxylic acid (A) may be obtained by reacting 1,4-cyclohexanedimethanol, 2,2-bis(4-hydroxycyclohexyl)propane, or 3,9-bis(1,1-dimethyl-2-hydroxyethyl)-2,4,8,10-tetraoxaspiro[5,5]undecane with methylhexahydrophthalic acid or hexahydrophthalic acid.
    • 公开了在常温下为固体的环氧树脂组合物,具有优异的耐光性和耐热性和最小的收缩率,并且可用于封装LED。 环氧树脂组合物的特征在于,通过使具有酸的非芳香族多元羧酸(A)反应,得到环氧当量为300〜1000g / eq,软化点为65〜110℃的环氧树脂作为必要成分 与环氧当量为100-400g / eq的非芳族环氧树脂(B)的值为100-250mgKOH / g。 非芳族多元羧酸(A)可以通过使1,4-环己烷二甲醇,2,2-双(4-羟基环己基)丙烷或3,9-双(1,1-二甲基-2-羟乙基)-2, 4,8,10-四氧杂螺[5,5]十一烷与甲基六氢邻苯二甲酸或六氢邻苯二甲酸。
    • 8. 发明申请
    • MAGNESIUM ALLOY FOR CASTING AND MAGNESIUM-ALLOY CAST PRODUCT
    • 镁合金铸造和镁合金铸造产品
    • US20100119405A1
    • 2010-05-13
    • US12596810
    • 2008-04-14
    • Yuki OkamotoKyoichi KinoshitaMotoharu TanizawaKazuhiko Yoshida
    • Yuki OkamotoKyoichi KinoshitaMotoharu TanizawaKazuhiko Yoshida
    • C22C23/00
    • C22C23/00B22D21/007
    • A magnesium alloy for casting according to the present invention is characterized in that, when the entirety is taken as 100% by mass, it includes copper (Cu) in an amount of from 1% by mass or more to 5% by mass or less, calcium (Ca) in an amount of from 0.1% by mass or more to 5% by mass or less, silver (Ag) in an amount of from 0.1% by mass or more to 5% by mass or less, and the balance comprising magnesium (Mg) and inevitable impurities.By means of including Cu and Ca, crystallized substances of Mg—Ca compounds crystallize in crystalline grain boundaries between Mg crystalline grains as three-dimensionally mesh shapes, along with Mg—Cu compounds. By means of the three-dimensionally mesh constructions, grain-boundary sliding, which becomes active especially when becoming high temperature, is suppressed, and thereby high-temperature strength and creep resistance at high temperature improve. Moreover, by means of the Ag addition, the Mg crystalline grains become micro-fine and thereby the three-dimensionally mesh constructions, whose continuities are high and which are fine, are formed. In addition, it is less likely that Ag affects the heat conductivity of magnesium alloy adversely.
    • 根据本发明的铸造用镁合金的特征在于,当全部为100质量%时,其包含1质量%以上5质量%以下的铜(Cu) ,钙(Ca)的量为0.1质量%以上至5质量%以下,银(Ag)的含量为0.1质量%以上且5质量%以下,余量 包括镁(Mg)和不可避免的杂质。 通过包括Cu和Ca,Mg-Ca化合物的结晶物质与Mg-Cu化合物一起作为三维网格形状在Mg晶粒之间的结晶晶界中结晶。 通过三维网状结构,能够抑制特别是在高温时变得活跃的晶界滑动,从而提高高温下的高温强度和耐蠕变性。 此外,通过Ag添加,Mg晶粒变得微细,从而形成连续性高且细小的三维网状结构。 此外,Ag不太可能不利地影响镁合金的导热性。