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    • 2. 发明授权
    • Layered two-dimensional code, creation method thereof, and read method
    • 分层二维码,其创建方法和读取方法
    • US08511562B2
    • 2013-08-20
    • US11988885
    • 2006-04-04
    • Tatsuya OnodaKazuhiro Miwa
    • Tatsuya OnodaKazuhiro Miwa
    • G06K7/12G06K7/00G06K19/08
    • G06K19/06037G06K19/06046G06K2019/06225Y10T156/10
    • The present invention provides a layered two-dimensional code which can be considerably improved in the data capacity thereof without increasing the area thereof by integrating a plurality of two-dimensional codes by a predetermined correlation and expressing it as one two-dimensional code, a method of creating the layered two-dimensional code, and a method of reading the layered two-dimensional code. The layered two-dimensional code is formed as a surface layer by layering a plurality of code layers (for example, code layers 1, 2, and 3) each having information cells (1a′, 1a″, and the like) arranged in a two-dimensional matrix and by integrating the plurality of code layers. An index information code 1c essentially including the information of an RGB value of each code layer is included at one part of the surface layer. When the information cells (1a′ and 1a″) of the code layers 1 and 2 are superposed.
    • 本发明提供了一种分层二维码,其数据容量可以大大提高,而不增加其面积,通过以预定的相关性整合多个二维码并将其表示为一个二维码,方法 创建分层二维码,以及读取分层二维码的方法。 分层二维码通过层叠多个代码层(例如,代码层1,2和3)形成为表面层,每个代码层具有布置在其中的信息单元(1a',1a“等) 二维矩阵并且通过对多个代码层进行积分。 基本上包含每个代码层的RGB值的信息的索引信息代码1c被包括在表层的一部分。 当代码层1和2的信息单元(1a'和1a“)叠加时。
    • 6. 发明申请
    • SEMICONDUCTOR MANUFACTURING APPARATUS AND CONTROL SYSTEM AND CONTROL METHOD THEREFOR
    • 半导体制造装置及其控制系统及其控制方法
    • US20110130861A1
    • 2011-06-02
    • US13020692
    • 2011-02-03
    • Kazuhiro MIWAKazuhiro WATANABEAkito MIFUNE
    • Kazuhiro MIWAKazuhiro WATANABEAkito MIFUNE
    • G06F19/00
    • G05B13/048
    • Disclosed herein is technology for, among other things, a semiconductor manufacturing apparatus, and a control system and a control method therefor, by which a target parameter that is measured from a wafer processed with a plurality of processing parameters that are processing conditions of the semiconductor manufacturing apparatus to process a wafer, a multiple classification analysis is performed with the plurality of processing parameters and the target parameter to calculate a model formula expressing the target parameter in a selected parameter, a predicted value of the target parameter of the wafer being processed by use of the model formula is calculated, while the processing is being performed, the processing parameters of the processing is modified on the basis of the predicted value, and the processing is continuously performed.
    • 本文公开了一种技术,其中包括半导体制造装置,以及控制系统及其控制方法,通过该半导体制造装置,从用作为半导体的处理条件的多个处理参数处理的晶片测量的目标参数 用于处理晶片的制造装置,利用多个处理参数和目标参数进行多重分类分析,以计算表示所选参数中的目标参数的模型公式,所述晶片的目标参数的预测值由 在进行处理的同时,计算出模型公式的使用,根据该预测值对处理的处理参数进行修正,继续进行处理。