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    • 1. 发明授权
    • Bookbinding printing system in which a plurality of bound products are generated by a single job
    • 装订打印系统,其中通过单个作业生成多个绑定的产品
    • US08531708B2
    • 2013-09-10
    • US13165026
    • 2011-06-21
    • Kazuyuki Saito
    • Kazuyuki Saito
    • G06F3/12
    • G06F3/1285G06F3/1208G06F3/1242G06F3/1262
    • An information processing apparatus comprises: a data determination unit configured to determine, using first received data as a reference, whether to add another received data to processing in a single job; a size determination unit configured, when the data determination unit determines to add the other received data in a bookbinding mode in which a plurality of bound products are generated by a single job, to regard, as single tentative image data, a plurality of image data which are generated from different received data and laid out on a single sheet of paper, and to determine whether the single tentative image data fits in the sheet of paper; and a job generation unit configured to generate a job for at least one received data corresponding to image data contained in the single tentative image data determined by the size determination unit to fit in the sheet of paper.
    • 一种信息处理装置,包括:数据确定单元,被配置为使用第一接收数据作为参考,确定是否将另一接收数据添加到单个作业中的处理; 尺寸确定单元,其被配置为当所述数据确定单元确定将其它接收数据添加到其中由单个作业生成多个绑定产品的装订模式时,将作为单个暂定图像数据的多个图像数据 它们是从不同的接收数据生成的,并且布置在单张纸上,并且确定单个临时图像数据是否适合纸张; 以及作业生成单元,被配置为生成与由所述尺寸确定单元确定的单个临时图像数据中包含的图像数据相对应的至少一个接收数据以适合所述纸张的作业。
    • 3. 发明申请
    • PRINTING CONTROL APPARATUS, PRINTING CONTROL METHOD, AND COMPUTER-READABLE STORAGE MEDIUM
    • 印刷控制装置,印刷控制方法和计算机可读存储介质
    • US20120176645A1
    • 2012-07-12
    • US13335799
    • 2011-12-22
    • Kazuyuki Saito
    • Kazuyuki Saito
    • G06K15/02
    • G06F3/1204G06F3/1262G06F3/1264G06F3/1285
    • A printing control apparatus controls an order of processing executed by a printing apparatus for print jobs included in a first print job group and print jobs included in a second print job group. A detection unit detects a first and second print job included in the first print job group, wherein the second print job has common paper information with the first print job. A control unit arranges processing orders of the detected first and second print jobs to be successive to each other, and arranges a processing order, within the second print job group, of a third print job, which is included in the second print job group and is grouped by a predetermined category together with the first print job, to be equivalent to the processing order of the first print job within the first print job group.
    • 打印控制装置控制包括在第一打印作业组中的打印作业的打印装置执行的处理顺序和包括在第二打印作业组中的打印作业。 检测单元检测包括在第一打印作业组中的第一和第二打印作业,其中第二打印作业具有与第一打印作业相同的纸张信息。 控制单元将所检测到的第一和第二打印作业的处理顺序排列为彼此连续,并且在第二打印作业组内布置包括在第二打印作业组中的第三打印作业的处理顺序,以及 与第一打印作业一起被预定类别分组,以等同于第一打印作业组内的第一打印作业的处理顺序。
    • 4. 发明申请
    • Information Processing Apparatus, Bookbinding Printing Method, and Computer-Readable Medium
    • 信息处理装置,装订打印方法和计算机可读介质
    • US20120033252A1
    • 2012-02-09
    • US13165026
    • 2011-06-21
    • Kazuyuki Saito
    • Kazuyuki Saito
    • G06F3/12
    • G06F3/1285G06F3/1208G06F3/1242G06F3/1262
    • An information processing apparatus comprises: a data determination unit configured to determine, using first received data as a reference, whether to add another received data to processing in a single job; a size determination unit configured, when the data determination unit determines to add the other received data in a bookbinding mode in which a plurality of bound products are generated by a single job, to regard, as single tentative image data, a plurality of image data which are generated from different received data and laid out on a single sheet of paper, and to determine whether the single tentative image data fits in the sheet of paper; and a job generation unit configured to generate a job for at least one received data corresponding to image data contained in the single tentative image data determined by the size determination unit to fit in the sheet of paper.
    • 一种信息处理装置,包括:数据确定单元,被配置为使用第一接收数据作为参考,确定是否将另一接收数据添加到单个作业中的处理; 尺寸确定单元,其被配置为当所述数据确定单元确定将其它接收数据添加到其中由单个作业生成多个绑定产品的装订模式时,将作为单个暂定图像数据的多个图像数据 它们是从不同的接收数据生成的,并且布置在单张纸上,并且确定单个临时图像数据是否适合纸张; 以及作业生成单元,被配置为生成与由所述尺寸确定单元确定的单个临时图像数据中包含的图像数据相对应的至少一个接收数据以适合所述纸张的作业。
    • 5. 发明申请
    • AUDIO SIGNAL COMPENSATION DEVICE AND AUDIO SIGNAL COMPENSATION METHOD
    • 音频信号补偿装置和音频信号补偿方法
    • US20110158427A1
    • 2011-06-30
    • US12963475
    • 2010-12-08
    • Norikatsu ChibaKimio MisekiYasuhiro KanishimaKazuyuki SaitoToshifumi YamamotoTakashi Fukuda
    • Norikatsu ChibaKimio MisekiYasuhiro KanishimaKazuyuki SaitoToshifumi YamamotoTakashi Fukuda
    • H04B15/00
    • H04R3/04
    • An audio signal compensation device includes: a signal processor configured to perform filtering on an input audio signal; a filter coefficients storage module configured to store a plurality of filter coefficients; a user interface configured to provide options for a determination of filter coefficients to a user and to obtain a selection result from the user; and a filter coefficients determining module configured to determine a set of filter coefficients among the plurality of filter coefficients based on the selection result. The options for the determination of filter coefficients are produced by selecting a first filter coefficient and a second filter coefficient from the plurality of filter coefficients, the first filter coefficient corresponding to a first characteristic quantity of external auditory canal characteristics, the second filter coefficient corresponding to a second characteristic quantity of the external auditory canal characteristics which is predicted based on the first characteristic quantity.
    • 音频信号补偿装置包括:信号处理器,被配置为对输入音频信号执行滤波; 滤波器系数存储模块,被配置为存储多个滤波器系数; 用户界面,被配置为提供用于确定用户的滤波器系数的选项并从用户获得选择结果; 以及滤波器系数确定模块,被配置为基于所述选择结果确定所述多个滤波器系数中的一组滤波器系数。 用于确定滤波器系数的选项通过从多个滤波器系数中选择第一滤波器系数和第二滤波器系数来产生,第一滤波系数对应于外耳道特征的第一特征量,第二滤波系数对应于 基于第一特征量预测的外耳道特征的第二特征量。
    • 7. 发明授权
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US07488993B2
    • 2009-02-10
    • US11067627
    • 2005-02-28
    • Kenichi TokanoMotoshige KobayashiKazuyuki Saito
    • Kenichi TokanoMotoshige KobayashiKazuyuki Saito
    • H01L29/51
    • H01L23/562H01L23/3192H01L2924/0002H01L2924/13055H01L2924/13091H01L2924/00
    • A semiconductor device, includes: a semiconductor substrate of 100 micrometers or less in thickness; an electrode pattern formed above the semiconductor substrate; and an insulation film of 50 micrometers or greater in thickness residing on parts of the upper surface side of the semiconductor substrate other than at least on the electrode pattern. And a method of manufacturing a semiconductor device, includes: forming elements on a semiconductor substrate; forming electrodes in a predetermined part on the elements; affixing an insulator sheet of 50 micrometers or greater in thickness to the upper surface side of the semiconductor substrate, the insulator sheet being processed to remove some parts so as to be aligned with the electrodes or regions where the elements are provided, processing a back surface side of the semiconductor substrate affixed within the insulator sheet to form the semiconductor substrate of 100 micrometers or lower in thickness, and dicing the semiconductor substrate into semiconductor chips.
    • 半导体器件包括:厚度为100微米或更小的半导体衬底; 形成在所述半导体衬底上方的电极图案; 以及位于半导体衬底的上表面侧的至少在电极图案上的部分上的厚度为50微米或更大的绝缘膜。 一种制造半导体器件的方法包括:在半导体衬底上形成元件; 在元件上的预定部分中形成电极; 将半导体衬底的上表面侧的厚度为50μm以上的绝缘体片固定,对绝缘片进行加工,以除去一些部件,使其与设置有元件的电极或区域对齐,加工后表面 将半导体衬底的一侧固定在绝缘片内,以形成厚度为100微米或更小的半导体衬底,并将半导体衬底切割成半导体芯片。
    • 8. 发明申请
    • Information processing apparatus and audio output method
    • 信息处理设备和音频输出方式
    • US20070143602A1
    • 2007-06-21
    • US11605622
    • 2006-11-28
    • Kazuyuki Saito
    • Kazuyuki Saito
    • H04L9/00
    • G06F21/10H04L9/0827H04L2209/605
    • According to one embodiment, an information processing apparatus includes encrypting unit which encrypts first digital audio data by using an encryption key, decrypting unit which decrypts the encrypted first digital audio data, a first converter which converts the decrypted first digital audio data into a first analog audio signal, a second converter which converts second digital audio data into a second analog audio signal, an analog mixer which mixes the first analog audio signal and the second analog audio signal with each other, and outputting unit which outputs the mixed audio signal.
    • 根据一个实施例,一种信息处理装置包括:加密单元,其通过使用加密密钥加密第一数字音频数据;解密单元,其对加密的第一数字音频数据进行解密;第一转换器,其将解密的第一数字音频数据转换为第一模拟 音频信号,将第二数字音频数据转换为第二模拟音频信号的第二转换器,将第一模拟音频信号和第二模拟音频信号彼此混合的模拟混频器,以及输出混合音频信号的输出单元。
    • 10. 发明申请
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US20050208738A1
    • 2005-09-22
    • US11067627
    • 2005-02-28
    • Kenichi TokanoMotoshige KobayashiKazuyuki Saito
    • Kenichi TokanoMotoshige KobayashiKazuyuki Saito
    • H01L21/304H01L21/02H01L21/301H01L21/44H01L21/50H01L23/00H01L23/31
    • H01L23/562H01L23/3192H01L2924/0002H01L2924/13055H01L2924/13091H01L2924/00
    • A semiconductor device, comprises: a semiconductor substrate of 100 micrometers or less in thickness; an electrode pattern formed above the semiconductor substrate; and an insulation film of 50 micrometers or greater in thickness residing on parts of the upper surface side of the semiconductor substrate other than at least on the electrode pattern. And a method of manufacturing a semiconductor device, comprises: forming elements on a semiconductor substrate; forming electrodes in a predetermined part on the elements; affixing an insulator sheet of 50 micrometers or greater in thickness to the upper surface side of the semiconductor substrate, the insulator sheet being processed to remove some parts so as to be aligned with the electrodes or regions where the elements are provided, processing a back surface side of the semiconductor substrate affixed within the insulator sheet to form the semiconductor substrate of 100 micrometers or lower in thickness, and dicing the semiconductor substrate into semiconductor chips.
    • 一种半导体器件,包括:厚度为100微米或更小的半导体衬底; 形成在所述半导体衬底上方的电极图案; 以及位于半导体衬底的上表面侧的至少在电极图案上的部分上的厚度为50微米或更大的绝缘膜。 一种制造半导体器件的方法,包括:在半导体衬底上形成元件; 在元件上的预定部分中形成电极; 将半导体衬底的上表面侧的厚度为50μm以上的绝缘体片固定,对绝缘片进行加工,以除去一些部件,使其与设置元件的电极或区域对齐,加工后表面 将半导体衬底的一侧固定在绝缘片内,以形成厚度为100微米或更小的半导体衬底,并将半导体衬底切割成半导体芯片。