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1. 发明授权

US08629468B2 Method for manufacturing light emitting device and light emitting device 有权
标题翻译：制造发光器件和发光器件的方法
公开(公告)号：US08629468B2
公开(公告)日：2014-01-14
申请号：US12690464
申请日：2010-01-20
申请人： Kenji Isomoto , Chisato Furukawa
发明人： Kenji Isomoto , Chisato Furukawa
IPC分类号： H01L33/00
CPC分类号： C30B29/40 , C30B23/02 , C30B25/18 , C30B29/42 , C30B29/44 , H01L33/0079 , H01L33/025 , H01L33/16
摘要： A method for manufacturing a light emitting device, includes: preparing a first substrate by slicing a single crystal ingot pulled in a pulling direction tilted with respect to a first plane orientation, the slicing being in a direction substantially perpendicular to the pulling direction; preparing a second substrate including a major surface having a plane orientation substantially parallel to a plane orientation of a major surface of the first substrate; growing a stacked unit as a crystal on the major surface of the second substrate, the stacked unit including a light emitting layer; and removing the second substrate after bonding the stacked unit and the major surface of the first substrate by heating them in a joined state. A plane orientation of the major surface of the first substrate and a plane orientation of the major surface of the second substrate are one or another selected from a plane tilted from a (100) plane toward a [011] direction and a plane tilted from a (−100) plane toward a [0-1-1] direction, respectively.
摘要翻译：一种发光器件的制造方法，其特征在于，包括：通过对在相对于第一平面取向倾斜的拉拔方向拉伸的单晶锭进行切片来制作第一基板，所述切片位于与所述拉拔方向大致正交的方向上; 制备包括具有基本上平行于所述第一基底的主表面的平面取向的平面取向的主表面的第二基底; 在第二基板的主表面上生长作为晶体的堆叠单元，所述堆叠单元包括发光层; 以及通过在接合状态下加热所述第一基板的所述层叠单元和所述主表面而将所述第二基板除去。第一基板的主表面的平面取向和第二基板的主表面的平面取向是从（100）面朝向[011]方向倾斜的平面中选择的一个或另一个，以及从（-100）面朝向[0-1-1]方向。

2. 发明申请

US20100237366A1 METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE 有权
标题翻译：用于制造发光装置和发光装置的方法
公开(公告)号：US20100237366A1
公开(公告)日：2010-09-23
申请号：US12690464
申请日：2010-01-20
申请人： Kenji Isomoto , Chisato Furukawa
发明人： Kenji Isomoto , Chisato Furukawa
IPC分类号： H01L33/00 , H01L21/20
CPC分类号： C30B29/40 , C30B23/02 , C30B25/18 , C30B29/42 , C30B29/44 , H01L33/0079 , H01L33/025 , H01L33/16
摘要： A method for manufacturing a light emitting device, includes: preparing a first substrate by slicing a single crystal ingot pulled in a pulling direction tilted with respect to a first plane orientation, the slicing being in a direction substantially perpendicular to the pulling direction; preparing a second substrate including a major surface having a plane orientation substantially parallel to a plane orientation of a major surface of the first substrate; growing a stacked unit as a crystal on the major surface of the second substrate, the stacked unit including a light emitting layer; and removing the second substrate after bonding the stacked unit and the major surface of the first substrate by heating them in a joined state. A plane orientation of the major surface of the first substrate and a plane orientation of the major surface of the second substrate are one or another selected from a plane tilted from a (100) plane toward a [011] direction and a plane tilted from a (−100) plane toward a [0-1-1] direction, respectively.
摘要翻译：一种发光器件的制造方法，其特征在于，包括：通过对在相对于第一平面取向倾斜的拉拔方向拉伸的单晶锭进行切片来制作第一基板，所述切片位于与所述拉拔方向大致正交的方向上; 制备包括具有基本上平行于所述第一基底的主表面的平面取向的平面取向的主表面的第二基底; 在第二基板的主表面上生长作为晶体的堆叠单元，所述堆叠单元包括发光层; 以及通过在接合状态下加热所述第一基板的所述层叠单元和所述主表面而将所述第二基板除去。第一基板的主表面的平面取向和第二基板的主表面的平面取向是从（100）面朝向[011]方向倾斜的平面中选择的一个或另一个，以及从（-100）面朝向[0-1-1]方向。

3. 外观设计

USD562234S1 Inverter controller 有权
公开(公告)号：USD562234S1
公开(公告)日：2008-02-19
申请号：US29278749
申请日：2007-04-09
申请人： Takayuki Morihara , Shigekatsu Nagatomo , Koji Nuki , Kenji Isomoto
设计人： Takayuki Morihara , Shigekatsu Nagatomo , Koji Nuki , Kenji Isomoto

4. 发明授权

US06320207B1 Light emitting device having flat growth GaN layer 失效
标题翻译：具有平坦生长GaN层的发光器件
公开(公告)号：US06320207B1
公开(公告)日：2001-11-20
申请号：US08844616
申请日：1997-04-21
申请人： Chisato Furukawa , Masayuki Ishikawa , Hideto Sugawara , Kenji Isomoto
发明人： Chisato Furukawa , Masayuki Ishikawa , Hideto Sugawara , Kenji Isomoto
IPC分类号： H01L3300
CPC分类号： H01L33/325 , H01L21/0237 , H01L21/0242 , H01L21/02458 , H01L21/02502 , H01L21/0251 , H01L21/0254 , H01L21/0262
摘要： A light emitting device has an N-type gallium nitride system compound semiconductor layer provided on a substrate; and a P-type gallium nitride system compound semiconductor layer provided on said N-type gallium nitride system compound semiconductor layer. The N-type gallium nitride compound semiconductor layer has such an area that an impurity concentration increases corresponding to a layer thickness from the side of said substrate.
摘要翻译：发光器件具有设置在基板上的N型氮化镓系化合物半导体层; 以及设置在所述N型氮化镓系化合物半导体层上的P型氮化镓系化合物半导体层。 N型氮化镓系化合物半导体层具有从基板一侧的层厚度的杂质浓度增加的面积。

5. 发明授权

US6017807A P-type GaN compound semiconductor and method for manufacturing the same 失效
标题翻译： P型GaN化合物半导体及其制造方法
公开(公告)号：US6017807A
公开(公告)日：2000-01-25
申请号：US60068
申请日：1998-04-15
申请人： Chisato Furukawa , Masayuki Ishikawa , Hideto Sugawara , Kenji Isomoto
发明人： Chisato Furukawa , Masayuki Ishikawa , Hideto Sugawara , Kenji Isomoto
IPC分类号： H01L21/205 , H01L33/06 , H01L33/32 , H01L33/36 , H01L31/18
CPC分类号： H01L33/325 , H01L33/007
摘要： After p-type gallium nitride compound semiconductor layers, to which p-type impurity is added, are formed by virtue of chemical vapor deposition, the p-type gallium nitride compound semiconductor layers are thermally annealed at more than 400.degree. C. or more than 700.degree. C. while supplying a flow of an inert gas in parallel to a substrate surface at a predetermined flow rate or more. Otherwise, the p-type gallium nitride compound semiconductor layers are thermally annealed at more than 400.degree. C. or more than 700.degree. C. in an inert gas atmosphere having a predetermined pressure or more. According to the annealing process, the p-type impurity can be more effectively activated, so that p-type gallium nitride compound semiconductor layers which have fewer crystal defects, etc. and have lower resistivity can be formed.
摘要翻译：在通过化学气相沉积形成p型杂质的p型氮化镓化合物半导体层之后，p型氮化镓系化合物半导体层在400℃以上热退火，同时以预定的流速或更多的流量平行于衬底表面供应惰性气体流。否则，在具有预定压力或更大压力的惰性气体气氛中，p型氮化镓化合物半导体层在大于400℃或高于700℃下热退火。根据退火处理，可以更有效地激活p型杂质，从而可以形成具有较少的晶体缺陷等并且具有较低电阻率的p型氮化镓化合物半导体层。

6. 外观设计

USD562233S1 Inverter controller 有权
公开(公告)号：USD562233S1
公开(公告)日：2008-02-19
申请号：US29278747
申请日：2007-04-09
申请人： Kenji Isomoto , Shigekatsu Nagatomo , Koji Nuki , Takayuki Morihara
设计人： Kenji Isomoto , Shigekatsu Nagatomo , Koji Nuki , Takayuki Morihara

7. 发明申请

US20080007919A1 Motor Control Apparatus And method Of Assembling Motor Control Apparatus 失效
标题翻译：电机控制装置及组装电机控制装置的方法
公开(公告)号：US20080007919A1
公开(公告)日：2008-01-10
申请号：US11663191
申请日：2005-08-22
申请人： Kenji Isomoto , Shuhei Nohara , Shigekatsu Nagatomo
发明人： Kenji Isomoto , Shuhei Nohara , Shigekatsu Nagatomo
IPC分类号： H05K7/20 , H05K3/00
CPC分类号： H02M7/003 , H01L2924/0002 , H05K7/209 , Y10T29/49002 , H01L2924/00
摘要： There is provided a motor control apparatus in which a size of the apparatus can easily be reduced, a work for aligning a power semiconductor module with a substrate can be eliminated and an assembling property can be enhanced. In a motor control apparatus in which a power semiconductor module adhering to a heat sink is mounted on a first substrate, a spacer is provided between the heat sink and the substrate and the power semiconductor module is disposed in the spacer. Moreover, an edge part of a hole has such a structure as to block a space between a terminal protruded from a side portion of the power semiconductor module and the heat sink.
摘要翻译：提供了一种电动机控制装置，其中可以容易地减小装置的尺寸，可以消除用于对准功率半导体模块与衬底的工作，并且可以提高组装性能。在其中将附着在散热片上的功率半导体模块安装在第一基板上的电动机控制装置中，在散热片和基板之间设置间隔件，功率半导体模块设置在间隔件中。此外，孔的边缘部分具有阻挡从功率半导体模块的侧部突出的端子与散热器之间的空间的结构。

8. 发明授权

US06921328B1 Cooling device for electric equipment 有权
标题翻译：电气设备冷却装置
公开(公告)号：US06921328B1
公开(公告)日：2005-07-26
申请号：US09700957
申请日：1999-05-24
申请人： Shuhei Nohara , Hiromi Imamura , Masayuki Ono , Kenji Isomoto
发明人： Shuhei Nohara , Hiromi Imamura , Masayuki Ono , Kenji Isomoto
IPC分类号： H05K7/20 , F01D25/24
CPC分类号： H05K7/20172
摘要： A cooling device for an electric equipment which is excellent in cooling efficiency and low in noise and permits easy mounting of a cooling fan and a fan guard, comprising a heat sink (1) having a U-shaped frame (4) consisting of a flat part (2) and side parts (3) disposed on the opposite sides of the flat part (2), fins (5) formed on the frame (4) and fan guard mounting holes (6) formed in the side parts (3) of the frame (4); a cooling fan (7) having an engaging recess (8) in the side thereof; and a U-shaped fan guard (9) consisting of a fan guard body (10) and side plates (11) disposed on the opposite ends of the fan guard body (10); wherein a lattice body (12) is provided on the fan guard body (10), an air guide (17) at the tip end of each side plate (11), a fan mounting engaging projection (13) on the inner side surface of each side plate for clamping and retaining by engaging the cooling fan (7) and a projection support (15), having an engaging projection (14) for mounting the fan guard (9) to the heat sink (1), on the outer side surface of each side plate.
摘要翻译：一种电气设备的冷却装置，其冷却效率优异，噪音低，并且容易安装冷却风扇和风扇防护装置，其包括具有U形框架（4）的散热器（1），所述U形框架（4）由平面设置在平坦部分（2）的相对侧上的部分（2）和侧部（3），形成在框架（4）上的翅片（5）和形成在侧面部分（3）中的风扇防护装置安装孔的框架（4）; 冷却风扇（7），其侧面具有接合凹部（8）; 以及由风扇防护体（10）和设置在风扇防护体（10）的相对端上的侧板（11）组成的U形风扇防护罩（9）。其特征在于，在所述风扇防护体（10）上设有格子体（12），在所述侧板（11）的前端设有空气引导部（17），在所述风扇安装接合突起（13）的内侧面每个侧板通过接合冷却风扇（7）和突出支撑件（15）夹紧和保持，其具有用于将风扇防护件（9）安装到散热器（1）的外侧的接合突起（14）每个侧板的表面。

9. 发明授权

US07898806B2 Motor controller 有权
标题翻译：电机控制器
公开(公告)号：US07898806B2
公开(公告)日：2011-03-01
申请号：US12439767
申请日：2007-08-24
申请人： Kenji Isomoto
发明人： Kenji Isomoto
IPC分类号： H05K7/20
CPC分类号： H02M7/003 , H05K7/20918
摘要： There is provided a motor controller that can easily reduce the size and manufacturing cost of a motor controller by reducing the size of a heat sink without increasing the number of parts much.The motor controller includes a heat sink, a plurality of power semiconductor modules that is in close contact with the heat sink, a substrate (6) that is electrically connected to the plurality of power semiconductor modules, and a fan (8) that generates the flow of external air and supplies cooling air to the heat sink. The heat sink is formed by the combination of two kinds of heat sinks that include a first heat sink (9) and a second heat sink (10), and at least one of the power semiconductor modules is in close contact with each of the first and second heat sinks (9) and (10).
摘要翻译：提供了一种电动机控制器，其可以通过减少散热器的尺寸而不增加零件数量而容易地减小电动机控制器的尺寸和制造成本。马达控制器包括散热器，与散热器紧密接触的多个功率半导体模块，电连接到多个功率半导体模块的基板（6）和产生该多个功率半导体模块的风扇（8）外部空气流动，并向散热片提供冷却空气。散热器由包括第一散热器（9）和第二散热器（10）的两种散热器的组合形成，并且功率半导体模块中的至少一个与第一散热器（9）和第二散热器和第二散热器（9）和（10）。

10. 发明申请

US20070258194A1 Motor Controller 有权
标题翻译：电机控制器
公开(公告)号：US20070258194A1
公开(公告)日：2007-11-08
申请号：US11630414
申请日：2005-06-02
申请人： Hideharu Okayama , Kenji Isomoto , Shuhei Nohara , Toshio Omata
发明人： Hideharu Okayama , Kenji Isomoto , Shuhei Nohara , Toshio Omata
IPC分类号： H02B1/00
CPC分类号： H02M7/003 , H01L25/162 , H01L2924/0002 , H05K1/0203 , H05K1/144 , H05K7/209 , H05K2201/1056 , H05K2201/2018 , H05K2201/2036 , H01L2924/00
摘要： There is provided a motor controller which eliminates a positioning operation between a power semiconductor element and a base plate to improve assemblability. A motor controller has a power semiconductor element (3) closely contacted with a heatsink (1) and mounted in a first base plate (4), wherein a spacer (2) having an engaging section (2e) formed therein as a hole for the power semiconductor element (3) is interposed between the heatsink (1) and the base plate (4), and the power semiconductor element (3) is positioned in the spacer (2). Further, the peripheral wall of the hole is arranged so as to shut off a space between a terminal projecting from the side of the power semiconductor element (3) and the heatsink (1).
摘要翻译：提供了一种电动机控制器，其消除功率半导体元件和基板之间的定位操作，以改善组装性。电动机控制器具有与散热器（1）紧密接触并安装在第一基板（4）中的功率半导体元件（3），其中具有形成在其中的接合部分（2e）作为孔的间隔件（2）功率半导体元件（3）插入在散热器（1）和基板（4）之间，功率半导体元件（3）位于间隔物（2）中。此外，孔的周壁布置成切断从功率半导体元件（3）的侧面突出的端子与散热器（1）之间的空间。

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