专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20110222647A1 X-RAY INSPECTION APPARATUS AND X-RAY INSPECTION METHOD 审中-公开
标题翻译： X射线检查装置和X射线检测方法
公开(公告)号：US20110222647A1
公开(公告)日：2011-09-15
申请号：US13033862
申请日：2011-02-24
申请人： Shinji Sugita , Masayuki Masuda , Kiyoshi Murakami
发明人： Shinji Sugita , Masayuki Masuda , Kiyoshi Murakami
IPC分类号： G01N23/04
CPC分类号： G01N23/046 , G01N2223/419
摘要： The X-ray inspection apparatus and method realize high-speed defect analysis inspection. The processing executed by the X-ray inspection apparatus includes executing high-speed imaging, creating an inspection image by executing reconstruction processing, and performing automatic inspection. If the object has passed automatic inspection, the processing executed by the X-ray inspection apparatus includes displaying inspection results. If the object has failed automatic inspection, the processing executed by the X-ray inspection apparatus includes switching the imaging conditions and performing imaging for defect analysis, creating an image by executing reconstruction processing for defect analysis, and outputting the image for defect analysis.
摘要翻译： X射线检查装置和方法实现高速缺陷分析检查。由X射线检查装置执行的处理包括执行高速成像，通过执行重建处理创建检查图像，并执行自动检查。如果物体已通过自动检查，则由X射线检查装置执行的处理包括显示检查结果。如果物体自动检查失败，则由X射线检查装置执行的处理包括切换成像条件并执行用于缺陷分析的成像，通过执行缺陷分析的重建处理并输出用于缺陷分析的图像来创建图像。

2. 发明授权

US07869644B2 Methods of and apparatus for inspecting substrate 失效
标题翻译：检查基板的方法和装置
公开(公告)号：US07869644B2
公开(公告)日：2011-01-11
申请号：US11186151
申请日：2005-07-20
申请人： Kiyoshi Murakami , Masato Ishiba , Jun Kuriyama , Teruhisa Yotsuya
发明人： Kiyoshi Murakami , Masato Ishiba , Jun Kuriyama , Teruhisa Yotsuya
IPC分类号： G06K9/00 , G06K9/48 , G06K9/36 , H04N7/18 , B23P19/00
CPC分类号： G01N21/8851 , G01N21/95684 , G06T7/001 , G06T7/254 , G06T2207/30141 , G06T2207/30152 , H05K13/0817 , H05K13/083 , Y10T29/53174
摘要： Inspection apparatus are used to inspect a substrate as solder is printed, components are mounted and the substrate is heated for a soldering process. Images of the substrate are taken both before and after a production process such as the component mounting process and the soldering process and their differences are extracted. Each component on the substrate may be identified by differentiation and binarization processes and setting conditions for windows are determined corresponding to identified components. Windows are set according to determined setting conditions for inspecting the conditions of the substrate by using image data in the set windows and standard inspection data corresponding to component identification data.
摘要翻译：使用检查装置来检查基板，因为焊料被印刷，部件被安装并且基板被加热用于焊接工艺。在诸如部件安装工艺和焊接工艺的生产过程之前和之后都采集衬底的图像，并且提取它们的差异。可以通过微分和二值化处理识别衬底上的每个组件，并且对应于所识别的组件确定窗口的设置条件。 Windows根据设定条件设定，通过使用设定窗口中的图像数据和对应于部件识别数据的标准检查数据来检查基板的状况。

3. 发明申请

US20100177947A1 X-RAY EXAMINATION REGION SETTING METHOD, X-RAY EXAMINATION APPARATUS AND X-RAY EXAMINATION REGION SETTING PROGRAM 有权
标题翻译： X射线检查区域设置方法，X射线检查装置和X射线检查区域设置程序
公开(公告)号：US20100177947A1
公开(公告)日：2010-07-15
申请号：US12649984
申请日：2009-12-30
申请人： HIDEYUKI HAYASHI , KUNIO YOSHIDA , KIYOSHI MURAKAMI
发明人： HIDEYUKI HAYASHI , KUNIO YOSHIDA , KIYOSHI MURAKAMI
IPC分类号： G06K9/00
CPC分类号： B23K31/12 , B23K2101/40 , G06T7/0004 , G06T2207/10121 , G06T2207/30152
摘要： This invention enables information on a connection wiring with a substrate of a mounted component to be accurately and easily inputted in an X-ray examination apparatus. In teaching of a substrate examination, when a user inputs a two-dimensional region of a component to be examined with respect to a visible light image of the substrate, three-dimensional data is generated for the relevant region, which data is then analyzed to acquire a center coordinate, the number, the number of rows, and the number of columns on a ball terminal connecting the component to the substrate. Results such as the center coordinate acquired in such a manner may be displayed. The visible light image for the substrate is displayed in a display field of a screen. In the display field, a frame corresponding to a region acquired as an examination target is displayed in accordance with the visible light image, and a frame corresponding to each solder ball is displayed based on a position and the like of the solder ball acquired based on the three-dimensional data.
摘要翻译：本发明能够准确且容易地在X射线检查装置中输入与安装部件的基板的连接布线的信息。在衬底检查的教导中，当用户相对于衬底的可见光图像输入要检查的成分的二维区域时，针对相关区域生成三维数据，然后将该数据分析为获取将部件连接到基板的球形终端的中心坐标，数量，行数和列数。可以显示诸如以这种方式获取的中心坐标的结果。基板的可见光图像显示在屏幕的显示区域中。在显示区域中，根据可见光图像显示与作为检查对象取得的区域对应的框架，并且基于基于以下方式获取的焊球的位置等显示与每个焊球对应的框架三维数据。

4. 发明授权

US07680320B2 Image processing method, substrate inspection method, substrate inspection apparatus and method of generating substrate inspection data 失效
标题翻译：图像处理方法，基板检查方法，基板检查装置以及生成基板检查数据的方法
公开(公告)号：US07680320B2
公开(公告)日：2010-03-16
申请号：US11317415
申请日：2005-12-22
申请人： Kiyoshi Murakami , Masato Ishiba , Teruhisa Yotsuya
发明人： Kiyoshi Murakami , Masato Ishiba , Teruhisa Yotsuya
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T2207/30152
摘要： A color image as a combination of color data corresponding to a plural n-number of different hues is processed by extracting a target object from the image and carrying out a specified image processing. A reference image is obtained in the absence of the target object. Color data corresponding to specified less than n of the different hues are considered and difference in the degree of intensity of the considered color data relative to the combination of color data corresponding to n different hues between each pixel of the target image containing the target object and a corresponding pixel on the reference image are extracted. Pixels for which the extracted difference is greater than a specified threshold value and is in a specified direction are extracted. An image area formed by the extracted pixels are recognized as the target object.
摘要翻译：通过从图像中提取目标对象并执行指定的图像处理来处理与多个n个不同色调相对应的颜色数据的组合的彩色图像。在没有目标对象的情况下获得参考图像。考虑对应于不同色调的指定小于n的颜色数据，并且所考虑的颜色数据的强度的程度与对应于包含目标对象的目标图像的每个像素之间的n个不同色调的颜色数据的组合的差异，以及提取参考图像上的对应像素。提取提取的差异大于指定阈值并且在指定方向上的像素。由提取的像素形成的图像区域被识别为目标对象。

5. 发明申请

US20060018531A1 Methods of and apparatus for inspecting substrate 失效
标题翻译：检查基板的方法和装置
公开(公告)号：US20060018531A1
公开(公告)日：2006-01-26
申请号：US11186151
申请日：2005-07-20
申请人： Kiyoshi Murakami , Masato Ishiba , Jun Kuriyama , Teruhisa Yotsuya
发明人： Kiyoshi Murakami , Masato Ishiba , Jun Kuriyama , Teruhisa Yotsuya
IPC分类号： G06K9/00
CPC分类号： G01N21/8851 , G01N21/95684 , G06T7/001 , G06T7/254 , G06T2207/30141 , G06T2207/30152 , H05K13/0817 , H05K13/083 , Y10T29/53174
摘要： Inspection apparatus are used to inspect a substrate as solder is printed, components are mounted and the substrate is heated for a soldering process. Images of the substrate are taken both before and after a production process such as the component mounting process and the soldering process and their differences are extracted. Each component on the substrate may be identified by differentiation and binarization processes and setting conditions for windows are determined corresponding to identified components. Windows are set according to determined setting conditions for inspecting the conditions of the substrate by using image data in the set windows and standard inspection data corresponding to component identification data.
摘要翻译：使用检查装置来检查基板，因为焊料被印刷，部件被安装并且基板被加热用于焊接工艺。在诸如部件安装工艺和焊接工艺的生产过程之前和之后都采集衬底的图像，并且提取它们的差异。可以通过微分和二值化处理识别衬底上的每个组件，并且对应于所识别的组件确定窗口的设置条件。 Windows根据设定条件设定，通过使用设定窗口中的图像数据和对应于部件识别数据的标准检查数据来检查基板的状况。

6. 发明授权

US06947151B2 Surface state inspecting method and substrate inspecting apparatus 失效
标题翻译：表面状态检查方法和基板检查装置
公开(公告)号：US06947151B2
公开(公告)日：2005-09-20
申请号：US10338020
申请日：2003-01-08
申请人： Yoshiki Fujii , Kiyoshi Murakami
发明人： Yoshiki Fujii , Kiyoshi Murakami
IPC分类号： G01B11/24 , G01J3/08 , G01J3/46 , G01N21/88 , G01N21/956
CPC分类号： G01N21/8806 , G01N21/95684
摘要： In a substrate inspecting apparatus comprising a projecting section (4) in which light sources (8), (9) and (10) are provided for emitting colored lights of R, G and B in directions having different elevation angles, one or two color components which is/are greater than the mean value of the intensities of color components is/are extracted for an inspecting region including a soldered portion. Inclined surfaces adapted to the light sources (8), (9) and (10) are converted into monochromatic shaded images by the extraction processing. A boundary position between the inclined surfaces adapted to the light sources (8) and (9) are converted into one shaded image having a mixed color of red and green and the boundary position between the inclined surfaces adapted to the light sources (9) and (10) is converted into a different shaded image.
摘要翻译：在包括其中设置有光源（8），（9）和（10）的投影部分（4）的基板检查装置中，用于沿着具有不同仰角的方向发射R，G和B的彩色光，一个或两个颜色对于包括焊接部分的检查区域，提取/大于颜色分量的强度的平均值的分量。适于光源（8），（9）和（10）的倾斜表面通过提取处理被转换为单色阴影图像。适合于光源（8）和（9）的倾斜表面之间的边界位置被转换为具有红色和绿色混合颜色的一个阴影图像，以及适合于光源（9）和（10）被转换成不同的阴影图像。

7. 发明授权

US08351682B2 X-ray examination region setting method, X-ray examination apparatus and X-ray examination region setting program 有权
标题翻译： X线检查区域设定方法，X光检查装置及X线检查区域设定程序
公开(公告)号：US08351682B2
公开(公告)日：2013-01-08
申请号：US12649984
申请日：2009-12-30
申请人： Hideyuki Hayashi , Kunio Yoshida , Kiyoshi Murakami
发明人： Hideyuki Hayashi , Kunio Yoshida , Kiyoshi Murakami
IPC分类号： G06K9/00
CPC分类号： B23K31/12 , B23K2101/40 , G06T7/0004 , G06T2207/10121 , G06T2207/30152
摘要： This invention enables information on a connection wiring with a substrate of a mounted component to be accurately and easily inputted in an X-ray examination apparatus. In teaching of a substrate examination, when a user inputs a two-dimensional region of a component to be examined with respect to a visible light image of the substrate, three-dimensional data is generated for the relevant region, which data is then analyzed to acquire a center coordinate, the number, the number of rows, and the number of columns on a ball terminal connecting the component to the substrate. Results such as the center coordinate acquired in such a manner may be displayed. The visible light image for the substrate is displayed in a display field of a screen. In the display field, a frame corresponding to a region acquired as an examination target is displayed in accordance with the visible light image, and a frame corresponding to each solder ball is displayed based on a position and the like of the solder ball acquired based on the three-dimensional data.
摘要翻译：本发明能够准确且容易地在X射线检查装置中输入与安装部件的基板的连接布线的信息。在衬底检查的教导中，当用户相对于衬底的可见光图像输入要检查的成分的二维区域时，针对相关区域生成三维数据，然后将该数据分析为获取将部件连接到基板的球形终端的中心坐标，数量，行数和列数。可以显示诸如以这种方式获取的中心坐标的结果。基板的可见光图像显示在屏幕的显示区域中。在显示区域中，根据可见光图像显示与作为检查对象取得的区域对应的框架，并且基于基于以下方式获取的焊球的位置等显示与每个焊球对应的框架三维数据。

8. 发明申请

US20060057340A1 Conductive paste multilayered board including the conductive paste and process for producing the same 有权
标题翻译：包括导电浆的导电糊多层板及其制造方法
公开(公告)号：US20060057340A1
公开(公告)日：2006-03-16
申请号：US10516236
申请日：2003-05-27
申请人： Hiroaki Umeda , Hisatoshi Murakami , Kiyoshi Murakami
发明人： Hiroaki Umeda , Hisatoshi Murakami , Kiyoshi Murakami
IPC分类号： B32B3/00
CPC分类号： H05K1/095 , H01B1/22 , H05K3/4069 , Y10T428/24917
摘要： A conductive paste is provided, which has good conductivity and good adhesiveness to substrates and has good long-lasting stability of these properties, and which, when applied to a through-hole of a multi-layered substrate, ensures improved reliability of bonding to the end faces of conductive layers in the through-hole. Therefore, the paste does not require through-hole plating. The conductive paste comprises (A) 100 parts by weight of a resin component that contains an acrylate resin and an epoxy resin, (B) from 200 to 1800 parts by weight of a metal powder of at least two metals that contain at least one low-melting-point metal having a melting point of not higher than 180° C. and at least one high-melting-point metal having a melting point of not lower than 800° C., (C) from 0.5 to 40 parts by weight of a curing agent that contains from 0.3 to 35 parts by weight of a phenol-type curing agent, and (D) from 0.3 to 80 parts by weight of a flux.
摘要翻译：提供导电性糊剂，其具有良好的导电性和对基材的良好的粘合性，并且具有这些性能的良好的持久稳定性，并且当应用于多层基材的通孔时，确保提高粘合到通孔中导电层的端面。因此，该浆料不需要通孔电镀。导电性糊剂包含（A）100重量份含有丙烯酸酯树脂和环氧树脂的树脂成分，（B）200〜1800重量份的至少两种含有至少一种低分子量的金属的金属粉末熔点不高于180℃的熔点金属和熔点不低于800℃的至少一种高熔点金属，（C）0.5〜40重量份的固化剂，其含有0.3〜35重量份的苯酚型固化剂，和（D）0.3〜80重量份的助熔剂。

9. 发明申请

US20110222655A1 X-RAY INSPECTION APPARATUS, X-RAY INSPECTION METHOD, X-RAY INSPECTION PROGRAM, AND X-RAY INSPECTION SYSTEM 审中-公开
标题翻译： X射线检查装置，X射线检查方法，X射线检查程序和X射线检查系统
公开(公告)号：US20110222655A1
公开(公告)日：2011-09-15
申请号：US13032342
申请日：2011-02-22
申请人： Kiyoshi Murakami , Hironori Kasahara
发明人： Kiyoshi Murakami , Hironori Kasahara
IPC分类号： G01B15/02
CPC分类号： G01N23/18 , G01N23/046 , G01N2223/419 , G01N2223/6113 , G01N2223/643 , H05K13/082
摘要： An X-ray inspection apparatus previously acquires and stores a mask thickness in a cream solder printing as a thickness of the solder applied on the board. In a cross-section parallel to a board surface, a range in a height direction is set as an inspection target from the mask thickness of the inspection target board, and the number of cross-sections is specified. The X-ray inspection apparatus measures an area and roundness of the solder in an inspection window for each cross-section. When the minimum values of the area and roundness are not lower than reference values, the X-ray inspection apparatus determines that the soldering of the inspection window is nondefective. When one of the minimum values of the area and roundness is lower than the reference value, the X-ray inspection apparatus determines that the soldering of the inspection window is defective.
摘要翻译： X射线检查装置预先在膏状焊料印刷中获取并存储作为涂布在基板上的焊料的厚度的掩模厚度。在平行于板表面的横截面中，根据检查对象板的掩模厚度将高度方向的范围设定为检查对象，并且规定了横截面数。 X射线检查装置测量每个横截面的检查窗中焊料的面积和圆度。当面积和圆度的最小值不低于参考值时，X射线检查设备确定检查窗口的焊接是非缺陷的。当面积和圆度的最小值之一低于参考值时，X射线检查设备确定检查窗口的焊接有缺陷。

10. 发明授权

US07512260B2 Substrate inspection method and apparatus 失效
标题翻译：基板检查方法和装置
公开(公告)号：US07512260B2
公开(公告)日：2009-03-31
申请号：US11218920
申请日：2005-09-02
申请人： Kiyoshi Murakami , Yasunori Asano , Takashi Kinoshita , Teruhisa Yotsuya
发明人： Kiyoshi Murakami , Yasunori Asano , Takashi Kinoshita , Teruhisa Yotsuya
IPC分类号： G06K9/00 , G01R31/26
CPC分类号： G06T7/0008 , G06T7/001 , G06T7/74 , G06T2207/30141
摘要： Preparation steps are taken before a substrate with components is inspected and a whole image of a standard substrate is prepared preliminarily and inspection areas are determined for target portions to be inspected on this whole image. At the time of the inspection, a camera is positioned corresponding to a target portion to obtain a target image and an area corresponding to the target image is extracted from the whole image and displacement values of this area are calculated relative to the target image. The setting position of the inspection area is corrected by the calculated displacement values and an inspection area is set on the target image based on the corrected coordinates.
摘要翻译：在检查具有部件的基板之前进行准备步骤，并且准备准备标准基板的整体图像，并且在该整个图像上确定要检查的目标部分的检查区域。在检查时，对应于目标部分的相机定位以获得目标图像，并且从整个图像中提取与目标图像相对应的区域，并且相对于目标图像计算该区域的位移值。通过计算的位移值来校正检查区域的设置位置，并且基于校正的坐标将目标图像设置检查区域。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式