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1. 发明申请

US20230037385A1 SURFACE MOUNT RADIO FREQUENCY CROSSOVER DEVICE 有权
公开(公告)号：US20230037385A1
公开(公告)日：2023-02-09
申请号：US17962936
申请日：2022-10-10
申请人： Knowles Cazenovia, Inc.
发明人： Pierre Nadeau
IPC分类号： H01P5/02 , H01P3/08 , H05K1/02 , H05K1/18
摘要： A microwave or radio frequency (RF) device includes an insulating substrate having a first surface and a second surface opposing the first surface. The device also includes a crossover conductor disposed on the first surface extending between a first edge of the first surface and a second edge of the first surface. The device also includes a depression in the second surface defined at least in part by (i) a third surface recessed in relation to the second surface, and (ii) at least one sidewall that extends between the second surface and the third surface. The device further includes a conductive coating formed over at least a portion of the second surface, the third surface, and the at least one sidewall, where the conductive coating is insulated from the crossover conductor by the insulating substrate.

2. 发明授权

US09490768B2 High frequency band pass filter with coupled surface mount transition 有权
标题翻译：具有耦合表面贴装转换的高频带通滤波器
公开(公告)号：US09490768B2
公开(公告)日：2016-11-08
申请号：US13926169
申请日：2013-06-25
申请人： Knowles Cazenovia Inc.
发明人： Steven Randall , David Allen Bates
IPC分类号： H03H7/01 , H01P1/203 , H01P5/02
CPC分类号： H01P1/2002 , H01P1/20363 , H01P5/028 , H01P11/007 , H03H3/00 , H03H7/004 , H03H7/0161 , H03H7/38
摘要： A high frequency band pass filter with a coupled surface mount transition is provided, including a filter substrate, circuit connection elements defining input and an output elements provided on a surface of the filter substrate, electronic filter components provided on the first surface of the filter substrate, and impedance matching structures provided on the first surface of the filter substrate between the electronic filter components and the respective input and output elements. Signal connection structures are provided on an opposed surface of the filter substrate, in locations that positionally correspond to respective positions of the input and output elements. The respective signal connection elements are capacitively coupled, through a thickness direction of the filter substrate, to a respective one of the input and output elements on the opposed surface of the filter substrate without the presence of any vertical conductive structures within the filter substrate at the input and the output elements.
摘要翻译：提供了具有耦合表面安装转变的高频带通滤波器，包括滤波器基板，限定输入的电路连接元件和设置在滤波器基板的表面上的输出元件，设置在滤波器基板的第一表面上的电子滤波器部件以及设置在滤波器基板的第一表面之间的电子滤波器部件与各个输入和输出元件之间的阻抗匹配结构。信号连接结构设置在过滤器基板的相对表面上，位置上对应于输入和输出元件的相应位置。各个信号连接元件通过滤波器衬底的厚度方向电容耦合到滤波器衬底的相对表面上的输入和输出元件中的相应一个，而不会在滤波器衬底内存在任何垂直的导电结构输入和输出元素。

3. 发明授权

US11431067B2 Dielectric cavity notch filter 有权
公开(公告)号：US11431067B2
公开(公告)日：2022-08-30
申请号：US16904252
申请日：2020-06-17
申请人： Knowles Cazenovia, Inc.
发明人： Jared Parker Burdick
IPC分类号： H01P1/20 , H05K3/30 , H05K1/02
摘要： A band stop filter can include a circuit board having a first surface and an opposing second surface. The circuit board can have a transmission line on the first surface. The band stop filter can include a dielectric cavity resonator physically coupled to the second surface of the circuit board. The dielectric cavity resonator can have a coupling aperture configured to magnetically couple the dielectric cavity resonator to the transmission line, and to cause excitation of the dielectric cavity resonator in a second order transverse electric (TE) mode.

4. 发明申请

US20210167478A1 SURFACE MOUNT RADIO FREQUENCY CROSSOVER DEVICE 有权
公开(公告)号：US20210167478A1
公开(公告)日：2021-06-03
申请号：US16699187
申请日：2019-11-29
申请人： Knowles Cazenovia, Inc.
发明人： Pierre Nadeau
IPC分类号： H01P5/02 , H01P3/08 , H05K1/02 , H05K1/18
摘要： A microwave or radio frequency (RF) device includes an insulating substrate having a first surface and a second surface opposing the first surface. The device also includes a crossover conductor disposed on the first surface extending between a first edge of the first surface and a second edge of the first surface. The device also includes a depression in the second surface defined at least in part by (i) a third surface recessed in relation to the second surface, and (ii) at least one sidewall that extends between the second surface and the third surface. The device further includes a conductive coating formed over at least a portion of the second surface, the third surface, and the at least one sidewall, where the conductive coating is insulated from the crossover conductor by the insulating substrate.

5. 发明申请

US20190081379A1 VERTICAL SWITCHED FILTER BANK 审中-公开
公开(公告)号：US20190081379A1
公开(公告)日：2019-03-14
申请号：US16128467
申请日：2018-09-11
申请人： Knowles Cazenovia, Inc.
发明人： David Bates
IPC分类号： H01P3/08 , H01P5/16 , H01P11/00 , H05K1/02 , H05K1/11 , H05K1/14 , H01P1/20
摘要： A microwave or radio frequency (RF) device includes stacked printed circuit boards (PCBs) mounted on a flexible PCB having at least one ground plane and a signal terminal. Each of the stacked PCBs includes through-holes the sidewalls of which are coated with a conductive material. Microwave components are mounted on the flexible PCB within the through-holes, such that signal terminals of the components bond to signal terminals of respective through-holes. A conductive cover is mounted on the PCBs such that the cover is in electrical contact with the ground plane of the flexible PCB through the conductive material, forming shielding cavities around the components. The flexible PCB is folded such that the cover of one PCB faces the cover of the second PCB. The flexible PCB includes striplines or microstrips that carry RF or microwave signals to the signal terminals.

6. 发明授权

US11437696B2 RF devices and methods thereof involving a vertical switched filter bank 有权
公开(公告)号：US11437696B2
公开(公告)日：2022-09-06
申请号：US16128469
申请日：2018-09-11
申请人： Knowles Cazenovia, Inc.
发明人： David Bates
IPC分类号： H01P5/16 , H01P1/20 , H01P11/00 , H01P3/08 , H01L25/065 , H01L23/538 , H05K3/46 , H01L23/66 , H01L23/552 , H05K1/14 , H01L25/10 , H05K1/02 , H05K1/11 , H05K3/00 , H05K3/22 , H05K3/32 , H05K3/36 , H05K1/18
摘要： Methods for manufacturing a microwave or radio frequency (RF) device include mounting a printed circuit board (PCB) on a flexible PCB having at least one ground plane and a signal terminal. The PCB can include a through-hole the sidewalls of which are coated with a conductive material. The methods can include placing a microwave component within the through-hole. The methods can include disposing a conductive cover on the PCB such that the cover is in electrical contact with the ground plane of the flexible PCB through the conductive material, forming shielding around the microwave component. The flexible PCB can be folded along a respective bend portion.

7. 发明授权

US11355829B2 Vertical switched filter bank 有权
公开(公告)号：US11355829B2
公开(公告)日：2022-06-07
申请号：US16128467
申请日：2018-09-11
申请人： Knowles Cazenovia, Inc.
发明人： David Bates
IPC分类号： H01P5/16 , H01P1/20 , H01P11/00 , H01P3/08 , H01L25/065 , H01L23/538 , H05K3/46 , H01L23/66 , H01L23/552 , H05K1/14 , H01L25/10 , H05K1/02 , H05K1/11 , H05K3/00 , H05K3/22 , H05K3/32 , H05K3/36 , H05K1/18
摘要： A microwave or radio frequency (RF) device includes stacked printed circuit boards (PCBs) mounted on a flexible PCB having at least one ground plane and a signal terminal. Each of the stacked PCBs includes through-holes the sidewalls of which are coated with a conductive material. Microwave components are mounted on the flexible PCB within the through-holes, such that signal terminals of the components bond to signal terminals of respective through-holes. A conductive cover is mounted on the PCBs such that the cover is in electrical contact with the ground plane of the flexible PCB through the conductive material, forming shielding cavities around the components. The flexible PCB is folded such that the cover of one PCB faces the cover of the second PCB. The flexible PCB includes striplines or microstrips that carry RF or microwave signals to the signal terminals.

8. 发明授权

US11239539B1 Substrate-mountable electromagnetic waveguide 有权
公开(公告)号：US11239539B1
公开(公告)日：2022-02-01
申请号：US17013504
申请日：2020-09-04
申请人： Knowles Cazenovia, Inc.
发明人： Jared Burdick , Pierre Nadeau
IPC分类号： H01P3/16 , H01P3/12 , H01P5/08
摘要： An electromagnetic waveguide including conductive material on upper lower, and side surfaces of a dielectric is disclosed. A conductive excitation member is electrically coupled to the conductive material on the upper surface of the dielectric and extends to the lower surface of the dielectric at or near an end surface of the dielectric. The conductive excitation member includes a host interface flange separated and electrically isolated from the conductive material on the lower surface of the dielectric. The conductive material on the lower surface of the dielectric can be a ground plane and the waveguide can be a surface-mountable component.

9. 发明申请

US20200259263A1 RADIO FREQUENCY DEVICE WITH NON-UNIFORM WIDTH CAVITIES 审中-公开
公开(公告)号：US20200259263A1
公开(公告)日：2020-08-13
申请号：US16787286
申请日：2020-02-11
申请人： KNOWLES CAZENOVIA, INC.
发明人： Hassan DANI
IPC分类号： H01Q13/06 , H01Q13/22
摘要： A microwave or radio frequency (RF) device includes a substrate and a cover. The substrate has a first surface and an opposing second surface, the first surface including a first RF component and a second RF component electrically coupled to the first RF component in series. The cover is disposed over the first surface of the substrate, where the cover includes a first portion with a first width covering the first RF component, where the first portion and the first surface define a first waveguide cavity having the first width, and a second portion with a second width, less than the first width, covering the second RF component, where the second portion and the first surface define a second waveguide cavity having the second width.

10. 发明申请

US20220416747A1 Tunable Electrical Component Having Distributed-Element Circuit 有权
公开(公告)号：US20220416747A1
公开(公告)日：2022-12-29
申请号：US17358394
申请日：2021-06-25
申请人： Knowles Cazenovia, Inc.
发明人： Gregory Alton
IPC分类号： H03H7/01 , H03H1/00
摘要： The disclosure relates to an electrical component, for example, a surface-mount resonator, including a distributed-element circuit disposed on a dielectric base and separated from an electromagnetic field modification member by a gaseous gap, wherein a frequency characteristic of the electrical component can be tuned by positioning the electromagnetic field modification member relative to the distributed-element circuit using an actuator.

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