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    • 4. 发明授权
    • Pressure sensor
    • 压力传感器
    • US06298730B1
    • 2001-10-09
    • US09208689
    • 1998-12-10
    • Kouzou YamagishiToshiaki OkumuraYoji SerizawaHaruhiko SekiyaTakayuki YokoyamaYasutaka IdeIkuya MiyaharaYasuo WatanabeShuzi TohyamaHayato Kobayashi
    • Kouzou YamagishiToshiaki OkumuraYoji SerizawaHaruhiko SekiyaTakayuki YokoyamaYasutaka IdeIkuya MiyaharaYasuo WatanabeShuzi TohyamaHayato Kobayashi
    • G01L900
    • G01L19/148G01L19/0084G01L19/142G01L19/147
    • A pressure sensor (1) having a first terminal (35), the first terminal (35) including a horizontal portion (61) and a vertical portion (62) at an intermediate portion thereof and being elastically deformable. A portion of the first terminal (35) being inserted and soldered to a circuit substrate (33) has a collar portion (63) being abutted around a through-hole (51) of the circuit substrate (33). The first terminal (35) is fixed at a state being pressed to the circuit substrate (33) by the collar portion (63) and being slightly compressed between a base member (32). When the circuit substrate (33) and the base member (32) are spaced apart by circumambient heat, the first terminal (35) can follow by the compressed margin. When the first terminal (35) itself is thermally expanded, the first terminal (35) can follow by an elastic deformation of the horizontal portion (61) and the vertical portion (62). Accordingly, stress caused to the soldered portion by a thermal deformation and the like can be relaxed so that the pressure sensor (1) can be applied to a wider temperature range.
    • 一种具有第一端子(35)的压力传感器(1),所述第一端子(35)在其中间部分包括水平部分(61)和垂直部分(62)并且是可弹性变形的。 第一端子(35)的插入和焊接到电路基板(33)的部分具有环绕电路基板(33)的通孔(51)的轴环部分(63)。 第一端子(35)被固定在被套环部分(63)按压到电路基板(33)并且在基部构件(32)之间被略微压缩的状态。 当电路基板(33)和基部构件(32)通过周向热隔开时,第一端子(35)可以跟随压缩边缘。 当第一端子(35)本身热膨胀时,第一端子(35)可以由水平部分(61)和垂直部分(62)的弹性变形引起。 因此,通过热变形等对焊接部产生的应力可以被松弛,使得压力传感器(1)可以应用于较宽的温度范围。