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1. 发明授权

US06885102B2 Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts 有权
标题翻译：电子组件具有更密集的触点布置，允许将迹线路由到触点
公开(公告)号：US06885102B2
公开(公告)日：2005-04-26
申请号：US10228524
申请日：2002-08-26
申请人： Kuljeet Singh , Kevin E. Wells , Julius Delino
发明人： Kuljeet Singh , Kevin E. Wells , Julius Delino
IPC分类号： H01L23/498 , H05K1/11 , H05K1/16
CPC分类号： H05K1/111 , H01L23/49838 , H01L2924/0002 , H05K2201/094 , H05K2201/10378 , H05K2201/10734 , Y02P70/611 , Y10S439/907 , Y10T29/49126 , H01L2924/00
摘要： An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows for routing of traces between the contacts.
摘要翻译：描述了一种电子组件，其具有衬底和在衬底上的接触，其间隔开并且以允许更密集的接触布置的方式布置，但仍然允许在触点之间布置迹线。

2. 发明授权

US07064431B2 Electronic assembly having select spacing of rows and columns of contacts to allow for routing of traces to the contacts 有权
标题翻译：电子组件具有行和列的触点的选择间隔，以允许将迹线路由到触点
公开(公告)号：US07064431B2
公开(公告)日：2006-06-20
申请号：US10993866
申请日：2004-11-18
申请人： Kuljeet Singh , Kevin E. Wells , Julius Delino
发明人： Kuljeet Singh , Kevin E. Wells , Julius Delino
IPC分类号： H05K1/16 , H01L23/04 , H01L23/48 , H01L29/40 , H01L23/52
CPC分类号： H05K1/111 , H01L23/49838 , H01L2924/0002 , H05K2201/094 , H05K2201/10378 , H05K2201/10734 , Y02P70/611 , Y10S439/907 , Y10T29/49126 , H01L2924/00
摘要： An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows for routing of traces between the contacts.
摘要翻译：描述了一种电子组件，其具有衬底和在衬底上的接触，其间隔开并且以允许更密集的接触布置的方式布置，但仍然允许在触点之间布置迹线。

3. 发明申请

US20050090125A1 Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts 有权
公开(公告)号：US20050090125A1
公开(公告)日：2005-04-28
申请号：US10993866
申请日：2004-11-18
申请人： Kuljeet Singh , Kevin Wells , Julius Delino
发明人： Kuljeet Singh , Kevin Wells , Julius Delino
IPC分类号： H01L23/498 , H05K1/11 , H01R12/00
CPC分类号： H05K1/111 , H01L23/49838 , H01L2924/0002 , H05K2201/094 , H05K2201/10378 , H05K2201/10734 , Y02P70/611 , Y10S439/907 , Y10T29/49126 , H01L2924/00
摘要： An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows for routing of traces between the contacts.

4. 发明授权

US06566741B2 Grounding of package substrates 有权
标题翻译：封装衬底的接地
公开(公告)号：US06566741B2
公开(公告)日：2003-05-20
申请号：US09425275
申请日：1999-10-21
申请人： Arthur K. Lin , Robert A. Anderson , Kuljeet Singh
发明人： Arthur K. Lin , Robert A. Anderson , Kuljeet Singh
IPC分类号： H01L2302
CPC分类号： H01L21/565 , H01L23/60 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/85399 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： An apparatus and method for dissipating static electrical charge following a manufacturing operation is disclosed. A semiconductor package is provided with ground pads that are located to assure electrical contact with ejection pins used to translate the package from one position to another. Static electricity builds up on the semiconductor package. The ejection pins provide the pathway for dissipating static electrical charge out of the semiconductor package.
摘要翻译：公开了一种用于在制造操作之后消散静电荷的装置和方法。半导体封装设置有接地焊盘，其被定位成确保与用于将封装从一个位置转换到另一个位置的弹出销的电接触。半导体封装产生静电。喷射销提供用于将静电电荷从半导体封装中散出的路径。

5. 发明授权

US07247517B2 Method and apparatus for a dual substrate package 有权
标题翻译：双基板封装的方法和装置
公开(公告)号：US07247517B2
公开(公告)日：2007-07-24
申请号：US10676883
申请日：2003-09-30
申请人： Christopher L. Rumer , Kuljeet Singh
发明人： Christopher L. Rumer , Kuljeet Singh
IPC分类号： H01L21/48 , H01L21/50
CPC分类号： H01L23/055 , H01L23/481 , H01L23/49833 , H01L24/45 , H01L24/48 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/13025 , H01L2224/14181 , H01L2224/16225 , H01L2224/17181 , H01L2224/32225 , H01L2224/33181 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73104 , H01L2224/73204 , H01L2224/83192 , H01L2224/92125 , H01L2224/92143 , H01L2224/94 , H01L2924/00014 , H01L2924/01078 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2224/11 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor die having a through via formed therein is disclosed. A first conductive layer is formed on the front side of the die and a second conductive layer is formed on the backside of the die, and coupled with the through via. A first package substrate is electrically coupled with the first conductive layer, and a second package substrate is electrically coupled with the second conductive layer. In another embodiment, a substrate ball electrically couples the first and second package substrates. In a further embodiment, a flip chip bump is attached to the first package substrate.
摘要翻译：公开了一种其中形成有通孔的半导体管芯。第一导电层形成在管芯的前侧，并且第二导电层形成在管芯的背面，并与通孔相连。第一封装衬底与第一导电层电耦合，并且第二封装衬底与第二导电层电耦合。在另一个实施例中，衬底球电耦合第一和第二封装衬底。在另一实施例中，倒装芯片凸块附接到第一封装衬底。

6. 发明授权

US06764877B2 Method of dissipating static electric charge from a chip assembly during a manufacturing operation 失效
标题翻译：在制造操作期间从芯片组件散发静电荷的方法
公开(公告)号：US06764877B2
公开(公告)日：2004-07-20
申请号：US10374415
申请日：2003-02-25
申请人： Arthur K. Lin , Robert A. Anderson , Kuljeet Singh
发明人： Arthur K. Lin , Robert A. Anderson , Kuljeet Singh
IPC分类号： H01L2144
CPC分类号： H01L21/565 , H01L23/60 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/85399 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： An apparatus and method for dissipating static electrical charge following a manufacturing operation is disclosed. A semiconductor package is provided with ground pads that are located to assure electrical contact with ejection pins used to translate the package from one position to another. Static electricity builds up on the semiconductor package. The ejection pins provide the pathway for dissipating static electrical charge out of the semiconductor package.
摘要翻译：公开了一种用于在制造操作之后消散静电荷的装置和方法。半导体封装设置有接地焊盘，其被定位成确保与用于将封装从一个位置转换到另一个位置的弹出销的电接触。半导体封装产生静电。喷射销提供用于将静电电荷从半导体封装中散出的路径。

7. 发明授权

US06715663B2 Wire-bond process flow for copper metal-six, structures achieved thereby, and testing method 有权
公开(公告)号：US06715663B2
公开(公告)日：2004-04-06
申请号：US10052089
申请日：2002-01-16
申请人： Krishna Seshan , Kuljeet Singh
发明人： Krishna Seshan , Kuljeet Singh
IPC分类号： B23K3102
CPC分类号： H01L24/48 , H01L22/32 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/85 , H01L2224/02166 , H01L2224/0392 , H01L2224/04042 , H01L2224/05009 , H01L2224/05073 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/0517 , H01L2224/05184 , H01L2224/05556 , H01L2224/05558 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05669 , H01L2224/45124 , H01L2224/45144 , H01L2224/4807 , H01L2224/48453 , H01L2224/48463 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48669 , H01L2224/48724 , H01L2224/48747 , H01L2224/48755 , H01L2224/48769 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01038 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01043 , H01L2924/01045 , H01L2924/01047 , H01L2924/01052 , H01L2924/01057 , H01L2924/01058 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2224/78 , H01L2924/00 , H01L2224/48744
摘要： The present invention relates to a device that includes a low-ohmic test. The device includes a metallization copper pad such as metal-six, a metal first film such as Ni that is disposed above the metallization copper pad, and a metal second film such as Au that is disposed above the metal first film. The present invention also relates to a wire-bonding process, and to a method of pulling a first wire bond and making a second wire bond.

8. 发明授权

US6050585A Bicycle seat power adjustable mechanism 失效
标题翻译：自行车座椅动力可调机构
公开(公告)号：US6050585A
公开(公告)日：2000-04-18
申请号：US219409
申请日：1998-12-23
申请人： Kuljeet Singh Rai
发明人： Kuljeet Singh Rai
IPC分类号： B62J1/10 , B62K19/36 , B62H1/00
CPC分类号： B62K19/36 , B62J1/10
摘要： A bicycle seat power adjustment mechanism includes a two-direction activation switch mounted on the handlebars and a power supply mounted on the bike frame or under the seat. The power supply would typically be a battery pack, and may be used in conjunction with a generator powered by the motion of the bicycle. An electric motor drives a bevel gear combination that causes an interior drive shaft to rotate. The drive shaft is contained within the seat mounting post and a receiving member of the bike frame. The drive shaft is threaded so that, depending upon the direction of rotation, the drive shaft is moved up and down within a seat post receiving member of the bicycle frame. The direction of rotation is controlled by the activation switch. A rotation inhibition mechanism is provided so that the seat does not tend to rotate when the device is activated.
摘要翻译：自行车座椅动力调节机构包括安装在车把上的双向起动开关和安装在自行车车架上或座椅下方的电源。电源通常是电池组，并且可以与由自行车的运动驱动的发电机结合使用。电动机驱动一个使内部驱动轴旋转的锥齿轮组合。驱动轴容纳在座椅安装柱和自行车架的接收构件中。驱动轴是螺纹的，使得根据旋转方向，驱动轴在自行车车架的座椅接收构件内上下移动。旋转方向由激活开关控制。设置有旋转禁止机构，使得当该装置被启动时该座椅不趋于旋转。

9. 发明授权

US07282796B2 Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts 有权
标题翻译：电子组件具有更密集的触点布置，允许将迹线路由到触点
公开(公告)号：US07282796B2
公开(公告)日：2007-10-16
申请号：US10994057
申请日：2004-11-18
申请人： Kuljeet Singh , Kevin E. Wells , Julius Delino
发明人： Kuljeet Singh , Kevin E. Wells , Julius Delino
IPC分类号： H01L23/04 , H01L23/48 , H01L23/52
CPC分类号： H05K1/111 , H01L23/49838 , H01L2924/0002 , H05K2201/094 , H05K2201/10378 , H05K2201/10734 , Y02P70/611 , Y10S439/907 , Y10T29/49126 , H01L2924/00
摘要： An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows for routing of traces between the contacts.
摘要翻译：描述了一种电子组件，其具有衬底和在衬底上的接触，其间隔开并且以允许更密集的接触布置的方式布置，但仍然允许在触点之间布置迹线。

10. 发明申请

US20050087858A1 Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts 有权
公开(公告)号：US20050087858A1
公开(公告)日：2005-04-28
申请号：US10994057
申请日：2004-11-18
申请人： Kuljeet Singh , Kevin Wells , Julius Delino
发明人： Kuljeet Singh , Kevin Wells , Julius Delino
IPC分类号： H01L23/498 , H05K1/11 , H01L23/04
CPC分类号： H05K1/111 , H01L23/49838 , H01L2924/0002 , H05K2201/094 , H05K2201/10378 , H05K2201/10734 , Y02P70/611 , Y10S439/907 , Y10T29/49126 , H01L2924/00
摘要： An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows for routing of traces between the contacts.

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