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1. 发明授权

US08355111B2 Load driving device, illumination device, display device 有权
标题翻译：负载驱动装置，照明装置，显示装置
公开(公告)号：US08355111B2
公开(公告)日：2013-01-15
申请号：US12543548
申请日：2009-08-19
申请人： Kunihiro Komiya
发明人： Kunihiro Komiya
IPC分类号： G02F1/13
CPC分类号： H05B37/02 , G02F1/1336 , G09G3/3406 , G09G2320/064 , G09G2330/02 , H05B33/0818 , H05B33/0845
摘要： A load driving device according to the present invention is provided with: an enabling control section generating an enabling signal from an externally inputted PWM signal; and a load driving section that is turned on/off according to the enabling signal, and that PWM-drives the load according to the PWM signal.
摘要翻译：根据本发明的负载驱动装置设置有：使能控制部分，其从外部输入的PWM信号产生使能信号; 以及根据使能信号接通/断开的负载驱动部，并且根据PWM信号PWM驱动负载。

2. 发明授权

US08305011B2 Driving circuit for light emitting elements 有权
标题翻译：发光元件的驱动电路
公开(公告)号：US08305011B2
公开(公告)日：2012-11-06
申请号：US12667879
申请日：2008-07-03
申请人： Atsushi Kitagawa , Kunihiro Komiya
发明人： Atsushi Kitagawa , Kunihiro Komiya
IPC分类号： H05B37/02
CPC分类号： H05B33/0866 , H05B33/0827
摘要： Multiple LED terminals are provided to multiple LEDs, respectively. Each of these LED terminals is connected to the anode of the corresponding LED. A booster circuit boosts an input voltage. Multiple constant current sources are provided to the multiple LEDs, respectively. One terminal of each of the constant current sources is connected to the corresponding one of the LEDs via the corresponding one of the LED terminals. Multiple switches are provided to the multiple constant current sources, respectively, each of which selectively outputs a voltage selected from the input voltage and the output voltage of the booster circuit to the corresponding constant current source. A control circuit monitors each of the voltages at the multiple LED terminals, and controls the connection state of each of the switches based upon the corresponding voltage.
摘要翻译：多个LED端子分别提供给多个LED。这些LED端子中的每一个连接到相应LED的阳极。升压电路提高输入电压。多个恒流源分别提供给多个LED。每个恒流源的一个端子经由相应的一个LED端子连接到相应的一个LED。分别向多个恒定电流源提供多个开关，每个恒定电流源选择性地将从升压电路的输入电压和输出电压中选出的电压输出到相应的恒定电流源。控制电路监视多个LED端子处的每个电压，并且基于相应的电压来控制每个开关的连接状态。

3. 发明授权

US07851929B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07851929B2
公开(公告)日：2010-12-14
申请号：US11972950
申请日：2008-01-11
申请人： Kunihiro Komiya
发明人： Kunihiro Komiya
IPC分类号： H01L21/50
CPC分类号： H01L23/3114 , H01L23/50 , H01L23/528 , H01L23/53214 , H01L23/53228 , H01L23/53242 , H01L24/06 , H01L24/10 , H01L24/13 , H01L24/14 , H01L2224/0401 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05644 , H01L2224/05647 , H01L2224/0612 , H01L2224/13 , H01L2224/13023 , H01L2224/13025 , H01L2224/13099 , H01L2224/14104 , H01L2224/1413 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/30107 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor device having a wafer level chip size package may include a semiconductor substrate having an integrated circuit formed thereon; a plurality of electrode pads formed on the semiconductor substrate; at least one rewiring layer which may include rewiring formed adjacent to the plurality of electrode pads; and a plurality of external electrodes formed on the rewiring layer. The plurality of electrodes and plurality of external electrodes may be sectioned and arranged in four areas having the same shapes. Each area may include a first group of N number of external electrodes arranged along an edge of the semiconductor substrate, a second group of (N−2) number of external electrodes arranged inside the first group of external electrodes, and a plurality of (2N−2) number of electrode pads arranged between the first and second groups of external electrodes.
摘要翻译：具有晶片级芯片尺寸封装的半导体器件可以包括其上形成有集成电路的半导体衬底; 形成在所述半导体基板上的多个电极焊盘; 至少一个再布线层，其可以包括邻近多个电极焊盘形成的重新布线; 以及形成在再布线层上的多个外部电极。多个电极和多个外部电极可以被分割并布置在具有相同形状的四个区域中。每个区域可以包括沿着半导体衬底的边缘布置的N个外部电极的第一组，布置在第一组外部电极组内的第（N-2）个外部电极组和多个（2N -2）布置在第一和第二组外部电极组之间的电极焊盘的数量。

4. 发明授权

US07622900B2 Semiconductor integrated circuit supplying voltage to a load using a charge pump and electronic device including the same 有权
标题翻译：半导体集成电路使用电荷泵向负载提供电压以及包括该负载的电子装置
公开(公告)号：US07622900B2
公开(公告)日：2009-11-24
申请号：US11780724
申请日：2007-07-20
申请人： Kunihiro Komiya
发明人： Kunihiro Komiya
IPC分类号： G05F1/563 , H02M3/18
CPC分类号： H02M3/07 , H05B33/0815 , H05B33/0818
摘要： A semiconductor integrated circuit includes a charge pump boosting an input voltage and outputting the boosted voltage to a load, and a charge pump control circuit outputting a voltage to the charge pump based on the output voltage of the charge pump and determining an upper limit value of a current to be output to the charge pump based on the output voltage of the charge pump.
摘要翻译：半导体集成电路包括电荷泵，其提高输入电压并将升压电压输出到负载;以及电荷泵控制电路，其基于电荷泵的输出电压向电荷泵输出电压，并且确定电荷泵的上限值基于电荷泵的输出电压输出到电荷泵的电流。

5. 发明授权

US07453711B2 Step-up power supply unit and portable apparatus utilizing the same 失效
标题翻译：升压电源单元和利用其的便携式设备
公开(公告)号：US07453711B2
公开(公告)日：2008-11-18
申请号：US11084472
申请日：2005-03-18
申请人： Osamu Yanagida , Kunihiro Komiya
发明人： Osamu Yanagida , Kunihiro Komiya
IPC分类号： H02M3/18 , H02M7/00 , H02M7/19
CPC分类号： H02M3/07
摘要： A step-up power supply unit for providing a multiplicity of different step-up voltages as needed, generated by stepping up a voltage of a single power source such as a battery. The step-up voltage of the last stage charge pump unit and the step-up voltage of at least one charge pump unit other than the last stage charge pump unit, are made available as multiple output voltages. When one or more of the output voltages are not needed, all the charge pump units subsequent to the one providing the highest output voltage are disabled based on an output voltage control signal, thereby minimizing the size and cost of the step-up circuit and reducing the power consumption by the circuit.
摘要翻译：升压电源单元，用于通过升高诸如电池的单个电源的电压来产生需要的多个不同的升压电压。最后一级电荷泵单元的升压电压和除最后一级电荷泵单元之外的至少一个电荷泵单元的升压电压可用作多个输出电压。当不需要一个或多个输出电压时，基于输出电压控制信号禁用提供最高输出电压的所有电荷泵单元，从而使升压电路的尺寸和成本最小化并且减小电路的功耗。

6. 发明申请

US20080030258A1 Semiconductor Integrated Circuit Outputting Detection Signal Based on Detection Result of a Detecting Device and Electronic Device Including the Same 失效
标题翻译：基于检测装置和包括其的电子装置的检测结果的半导体集成电路输出检测信号
公开(公告)号：US20080030258A1
公开(公告)日：2008-02-07
申请号：US11832316
申请日：2007-08-01
申请人： Kunihiro Komiya
发明人： Kunihiro Komiya
IPC分类号： G01D5/12 , G08C19/02
CPC分类号： H03M1/187
摘要： A semiconductor integrated circuit includes a first external terminal for receiving a voltage converted by a resistance portion from a current varying in response to an extrinsic factor, a second external terminal for externally outputting the voltage received at the first external terminal as a detection signal, a control circuit outputting a control signal for changing a resistance value of the resistance portion based on the voltage received at the first external terminal, and a third external terminal for outputting the control signal to the resistance portion.
摘要翻译：半导体集成电路包括：第一外部端子，用于接收由电阻部分转换的电压，响应外部因素变化的电流;外部输出在第一外部端子接收的电压的第二外部端子作为检测信号，控制电路根据第一外部端子接收的电压输出用于改变电阻部分的电阻值的控制信号;以及第三外部端子，用于将控制信号输出到电阻部分。

7. 发明申请

US20120133058A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20120133058A1
公开(公告)日：2012-05-31
申请号：US13365591
申请日：2012-02-03
申请人： Kunihiro KOMIYA
发明人： Kunihiro KOMIYA
IPC分类号： H01L23/48
CPC分类号： H01L23/3114 , H01L23/50 , H01L23/528 , H01L23/53214 , H01L23/53228 , H01L23/53242 , H01L24/06 , H01L24/10 , H01L24/13 , H01L24/14 , H01L2224/0401 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05644 , H01L2224/05647 , H01L2224/0612 , H01L2224/13 , H01L2224/13023 , H01L2224/13025 , H01L2224/13099 , H01L2224/14104 , H01L2224/1413 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/30107 , H01L2924/00 , H01L2924/00014
摘要： The semiconductor device has the CSP structure, and includes: a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps are arranged in two rows along the periphery of the semiconductor device. The electrode pads are arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring is extended from an electrode pad, and is connected to any one of the outermost solder bumps or any one of the inner solder bumps.
摘要翻译：半导体器件具有CSP结构，并且包括：形成在半导体集成电路上的多个电极焊盘，用于从/从外部输入/输出信号; 用于制造外部引线电极的焊料凸块; 并重新布线。焊料凸块沿着半导体器件的周边布置成两排。电极焊盘配置在最外侧的焊料凸块的内部，以夹在两排焊料凸点之间。重新布线的每个迹线从电极焊盘延伸，并且连接到任何一个最外面的焊料凸块或任何一个内部焊料凸块。

8. 发明申请

US20100194294A1 DRIVING CIRCUIT FOR LIGHT EMITTING ELEMENT, AND ELECTRONIC DEVICE 有权
标题翻译：用于发光元件和电子设备的驱动电路
公开(公告)号：US20100194294A1
公开(公告)日：2010-08-05
申请号：US12667879
申请日：2008-07-03
申请人： Atsushi Kitagawa , Kunihiro Komiya
发明人： Atsushi Kitagawa , Kunihiro Komiya
IPC分类号： H05B37/02
CPC分类号： H05B33/0866 , H05B33/0827
摘要： Multiple LED terminals are provided to multiple LEDs, respectively. Each of these LED terminals is connected to the anode of the corresponding LED. A booster circuit boosts an input voltage. Multiple constant current sources are provided to the multiple LEDs, respectively. One terminal of each of the constant current sources is connected to the corresponding one of the LEDs via the corresponding one of the LED terminals. Multiple switches are provided to the multiple constant current sources, respectively, each of which selectively outputs a voltage selected from the input voltage and the output voltage of the booster circuit to the corresponding constant current source. A control circuit monitors each of the voltages at the multiple LED terminals, and controls the connection state of each of the switches based upon the corresponding voltage.
摘要翻译：多个LED端子分别提供给多个LED。这些LED端子中的每一个连接到相应LED的阳极。升压电路提高输入电压。多个恒流源分别提供给多个LED。每个恒流源的一个端子经由相应的一个LED端子连接到相应的一个LED。分别向多个恒定电流源提供多个开关，每个恒定电流源选择性地将从升压电路的输入电压和输出电压选择的电压输出到相应的恒定电流源。控制电路监视多个LED端子处的每个电压，并且基于相应的电压来控制每个开关的连接状态。

9. 发明授权

US07570084B2 Semiconductor integrated circuit outputting detection signal based on detection result of a detecting device and electronic device including the same 失效
标题翻译：基于检测装置的检测结果和包括该检测装置的电子装置的半导体集成电路输出检测信号
公开(公告)号：US07570084B2
公开(公告)日：2009-08-04
申请号：US11832316
申请日：2007-08-01
申请人： Kunihiro Komiya
发明人： Kunihiro Komiya
IPC分类号： H03K5/153
CPC分类号： H03M1/187
摘要： A semiconductor integrated circuit includes a first external terminal for receiving a voltage converted by a resistance portion from a current varying in response to an extrinsic factor, a second external terminal for externally outputting the voltage received at the first external terminal as a detection signal, a control circuit outputting a control signal for changing a resistance value of the resistance portion based on the voltage received at the first external terminal, and a third external terminal for outputting the control signal to the resistance portion.
摘要翻译：半导体集成电路包括：第一外部端子，用于接收由电阻部分转换的电压，响应外部因素变化的电流;外部输出在第一外部端子接收的电压的第二外部端子作为检测信号，控制电路根据第一外部端子接收的电压输出用于改变电阻部分的电阻值的控制信号;以及第三外部端子，用于将控制信号输出到电阻部分。

10. 发明申请

US20080007322A1 Power supply apparatus 有权
标题翻译：电源设备
公开(公告)号：US20080007322A1
公开(公告)日：2008-01-10
申请号：US11810737
申请日：2007-06-07
申请人： Hiroaki Asazu , Kunihiro Komiya
发明人： Hiroaki Asazu , Kunihiro Komiya
IPC分类号： G05F1/10 , G05F1/70 , G05F5/00
CPC分类号： H02M3/156
摘要： A voltage generation unit generates a driving voltage for driving an LED. A first feedback path feeds back a voltage according to a voltage at one end of the LED. A second feedback path feeds back a voltage according to a voltage at the other end of the LED. A current driving circuit is provided on a path on which the voltage generation unit drives the LED. A control circuit controls the voltage generation unit so that one of first and second feedback voltages fed back by the first and second feedback paths, respectively is closer to a predetermined reference voltage.
摘要翻译：电压产生单元产生用于驱动LED的驱动电压。第一反馈路径根据LED一端的电压反馈电压。第二反馈路径根据LED另一端的电压反馈电压。在电压产生单元驱动LED的路径上设置电流驱动电路。控制电路控制电压产生单元，使得由第一和第二反馈路径反馈的第一和第二反馈电压中的一个分别更接近预定的参考电压。

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