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1. 发明授权

US09485853B2 Wiring substrate having a plurality of connection terminals and a filling member provided therebetween 有权
标题翻译：具有多个连接端子的配线基板和设置在其间的填充部件
公开(公告)号：US09485853B2
公开(公告)日：2016-11-01
申请号：US13885928
申请日：2012-05-16
申请人： Tatsuya Ito , Seiji Mori , Takahiro Hayashi , Makoto Wakazono , Tomohiro Nishida
发明人： Tatsuya Ito , Seiji Mori , Takahiro Hayashi , Makoto Wakazono , Tomohiro Nishida
IPC分类号： H05K1/00 , H05K1/02 , H05K1/11 , H05K3/40 , H01L23/498 , H05K3/34 , H05K3/46 , H01L23/14
CPC分类号： H05K1/0213 , H01L23/145 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L2924/0002 , H05K1/111 , H05K3/3436 , H05K3/3452 , H05K3/4007 , H05K3/4661 , H05K2201/0195 , H05K2201/09881 , H05K2201/099 , H05K2201/09918 , Y02P70/611 , H01L2924/00
摘要： A wiring substrate according to the present invention includes a laminate of one or more insulation layers and one or more conductive layers and further includes a plurality of connection terminals formed on the laminate and spaced apart from one another, each having a step formed at the outer periphery of a first main surface opposite a contact surface in contact with the laminate, and a filling member provided in a filling manner between the connection terminals.
摘要翻译：根据本发明的布线基板包括一个或多个绝缘层和一个或多个导电层的层叠体，并且还包括形成在层压体上并彼此间隔开的多个连接端子，每个连接端子形成在外部与层叠体接触的与接触面相反的第一主表面的周边，以及以连接端子之间的填充方式设置的填充构件。

2. 发明授权

US07183497B2 Multilayer wiring board 有权
标题翻译：多层接线板
公开(公告)号：US07183497B2
公开(公告)日：2007-02-27
申请号：US11012326
申请日：2004-12-16
申请人： Toshifumi Kojima , Makoto Wakazono
发明人： Toshifumi Kojima , Makoto Wakazono
IPC分类号： H05K1/16 , H01R12/04
CPC分类号： H05K3/4602 , H05K2201/0209 , H05K2201/0347 , H05K2201/068 , H05K2201/09536 , H05K2201/0959 , H05K2201/096
摘要： A multilayer wiring board (11) is provided which includes a core substrate (12) including a plurality of through-holes (15). The through-holes (15) include through-hole conductors (17) on the inner walls of corresponding penetration holes (16) of a diameter of 200 μm or less. Interlayer insulating layers (31, 32) are disposed on opposite sides of the principal planes (13, 14) of the core substrate (12). Wiring layers (23, 24) are disposed on the surface of interlayer insulating layers (31, 32). The through-holes (15) are filled with a hardened filling material (18). Lid conductors (21, 22) close the openings of the through-holes (15). The value of linear expansion of the hardened filling material (18) is 1.2% or less in the temperature region from room temperature to the solder reflow temperature. The board has excellent connection reliability and exhibits little or no cracking or delamination in the lid conductor closing the openings of the through-holes and in the surrounding conductor area.
摘要翻译：提供一种多层布线板（11），其包括具有多个通孔（15）的芯基板（12）。通孔（15）包括直径为200μm或更小的相应穿孔（16）的内壁上的通孔导体（17）。层间绝缘层（31,32）设置在芯基板（12）的主平面（13,14）的相对侧上。接线层（23,24）设置在层间绝缘层（31,32）的表面上。通孔（15）填充有硬化的填充材料（18）。盖导体（21,22）封闭通孔（15）的开口。在从室温到焊锡回流温度的温度区域中，硬化填充材料（18）的线膨胀值为1.2％以下。该板具有良好的连接可靠性，并且在封闭导通孔和周围导体区域的开口的盖导体中几乎没有或没有破裂或分层。

3. 发明申请

US20140124242A1 WIRING SUBSTRATE 有权
标题翻译：接线基板
公开(公告)号：US20140124242A1
公开(公告)日：2014-05-08
申请号：US13885928
申请日：2012-05-16
申请人： Tatsuya Ito , Seiji Mori , Takahiro Hayashi , Makoto Wakazono , Tomohiro Nishida
发明人： Tatsuya Ito , Seiji Mori , Takahiro Hayashi , Makoto Wakazono , Tomohiro Nishida
IPC分类号： H05K1/02
CPC分类号： H05K1/0213 , H01L23/145 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L2924/0002 , H05K1/111 , H05K3/3436 , H05K3/3452 , H05K3/4007 , H05K3/4661 , H05K2201/0195 , H05K2201/09881 , H05K2201/099 , H05K2201/09918 , Y02P70/611 , H01L2924/00
摘要： A wiring substrate according to the present invention includes a laminate of one or more insulation layers and one or more conductive layers and further includes a plurality of connection terminals formed on the laminate and spaced apart from one another, each having a step formed at the outer periphery of a first main surface opposite a contact surface in contact with the laminate, and a filling member provided in a filling manner between the connection terminals.
摘要翻译：根据本发明的布线基板包括一个或多个绝缘层和一个或多个导电层的层叠体，并且还包括形成在层压体上并彼此间隔开的多个连接端子，每个连接端子形成在外部与层叠体接触的与接触面相反的第一主表面的周边，以及以连接端子之间的填充方式设置的填充构件。

4. 发明授权

US07438969B2 Filling material, multilayer wiring board, and process of producing multilayer wiring board 有权
标题翻译：填充材料，多层布线板以及多层布线板的制造工序
公开(公告)号：US07438969B2
公开(公告)日：2008-10-21
申请号：US10615067
申请日：2003-07-09
申请人： Toshifumi Kojima , Makoto Wakazono , Toshikatu Takada
发明人： Toshifumi Kojima , Makoto Wakazono , Toshikatu Takada
IPC分类号： B32B3/00 , H05K1/03
CPC分类号： H05K3/0094 , H05K3/4602 , H05K2201/0347 , H05K2201/0959 , Y10S428/901 , Y10T156/10 , Y10T428/24893 , Y10T428/24917 , Y10T428/25
摘要： A solvent-free filling material comprising a filler, a thermosetting resin, a curing agent, and a curing catalyst, wherein the thermosetting resin is an epoxy resin, and the curing agent is a dicyandiamide curing agent; a multilayer printed wiring board comprising a substrate, a through-hole, the filling material filling the through-hole, and a conductor layer formed on an exposed surface of the filling material in the through-hole; and a process for producing the multilayer printed wiring board.
摘要翻译：一种无溶剂填充材料，包括填料，热固性树脂，固化剂和固化催化剂，其中热固性树脂是环氧树脂，固化剂是双氰胺固化剂; 包括基板，通孔，填充通孔的填充材料和形成在通孔中的填充材料的暴露表面上的导体层的多层印刷线路板; 以及多层印刷布线板的制造方法。

5. 发明申请

US20050126818A1 Multilayer wiring board 有权
标题翻译：多层接线板
公开(公告)号：US20050126818A1
公开(公告)日：2005-06-16
申请号：US11012326
申请日：2004-12-16
申请人： Toshifumi Kojima , Makoto Wakazono
发明人： Toshifumi Kojima , Makoto Wakazono
IPC分类号： H05K3/46 , H05K1/03 , H05K1/11
CPC分类号： H05K3/4602 , H05K2201/0209 , H05K2201/0347 , H05K2201/068 , H05K2201/09536 , H05K2201/0959 , H05K2201/096
摘要： A multilayer wiring board (11) is provided which includes a core substrate (12) including a plurality of through-holes (15). The through-holes (15) include through-hole conductors (17) on the inner walls of corresponding penetration holes (16) of a diameter of 200 μm or less. Interlayer insulating layers (31, 32) are disposed on opposite sides of the principal planes (13, 14) of the core substrate (12). Wiring layers (23, 24) are disposed on the surface of interlayer insulating layers (31, 32). The through-holes (15) are filled with a hardened filling material (18). Lid conductors (21, 22) close the openings of the through-holes (15). The value of linear expansion of the hardened filling material (18) is 1.2% or less in the temperature region from room temperature to the solder reflow temperature. The board has excellent connection reliability and exhibits little or no cracking or delamination in the lid conductor closing the openings of the through-holes and in the surrounding conductor area.
摘要翻译：提供一种多层布线板（11），其包括具有多个通孔（15）的芯基板（12）。通孔（15）包括直径为200μm或更小的相应穿孔（16）内壁上的通孔导体（17）。层间绝缘层（31,32）设置在芯基板（12）的主平面（13,14）的相对侧上。接线层（23,24）设置在层间绝缘层（31,32）的表面上。通孔（15）填充有硬化的填充材料（18）。盖导体（21,22）封闭通孔（15）的开口。在从室温到焊锡回流温度的温度区域中，硬化填充材料（18）的线膨胀值为1.2％以下。该板具有良好的连接可靠性，并且在封闭导通孔和周围导体区域的开口的盖导体中几乎没有或没有破裂或分层。

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